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AMD XCV150-4PQ240C

Part No.:
XCV150-4PQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV150-4PQ240C.pdf
Description:
IC FPGA 166 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,573

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Product details

Overview

XCV150-4PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 maximum user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV150-4PQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 generation designs.

Technical Context

The XCV150-4PQ240C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across Virtex family members. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class I/III/IV, SSTL3, and GTL+-with independent VCCO per I/O bank, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. Eight I/O banks constrain VREF and VCCO voltage mixing, requiring compatible standards within each bank per Table 2.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 164,674 - defines logic capacity for complex state machines and datapaths
Logic Cells 3,888 - provides fine-grained, register-rich resources for pipelined control logic
Max User I/O 260 - enables high-pin-count interface consolidation (e.g., parallel bus + multiple serial links)
Block RAM 49,152 bits - supports dual-port synchronous buffering for video frame stores or FIFOs
Speed Grade -4 - guarantees 160 MHz system clock performance (worst-case, 25°C, VCC = 2.5 V ± 3%)
DLL Count 4 - allows independent clock domain management for multi-rate interfaces (e.g., PCI + DDR + UART)
Package PQ240 - 240-pin Plastic Quad Flat Pack with 0.5 mm pitch; requires standard QFP reflow profile

Pinout & Package

Package: PQ240 (Plastic Quad Flat Pack, 240 pins, 0.5 mm pitch, 32.0 × 32.0 mm body size). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables. I/O banks are distributed across four edges (Bank 0–7), with dedicated global clock inputs (GCLK0–GCLK3) on Bank 0/1 and Bank 6/7.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Low-skew primary clock nets feeding all DLLs and CLB clock trees
INIT, PROGRAM_B Configuration Control Asynchronous reset and reconfiguration trigger; drives internal SRAM reload sequence
CCLK, DIN, DOUT JTAG/SelectMAP Interface Serial configuration port (master/slave modes); supports in-system programming via microcontroller
VCCINT Core Supply 2.5 V ± 3% supply for CLBs, DLLs, and routing; decoupling required per Xilinx AN11
VCCO_0–VCCO_7 I/O Bank Supply Independent 1.5 V / 2.5 V / 3.3 V outputs per bank; determines supported I/O standards
VREF_0–VREF_7 I/O Threshold Reference External reference for SSTL/HSTL/GTL input receivers; one per bank, shared across all pins

Key Features

Feature Design Value
Four DLLs Enables zero-hold-time clock forwarding, phase alignment across I/O banks, and jitter reduction for 66-MHz PCI timing closure
Configurable LUT RAM LUTs serve as 16×1-bit synchronous RAM or 16×2-bit dual-port RAM-eliminates need for external SRAM in small buffers
Carry chain arithmetic Two-bit-per-CLB carry height supports fast 32-bit adders and accumulators without LUT resource consumption
IEEE 1149.1 Boundary Scan Full JTAG TAP compliance enables board-level testability and in-circuit debugging without additional test fixtures
Die temperature sensor diode Analog output pin (TEMP) provides real-time junction temperature monitoring for thermal throttling or fan control

Applications

PCI Bridge Controller Industrial Motion Control

Use Scenario: FPGA acts as host-to-peripheral bridge in CompactPCI backplane, interfacing CPU with custom I/O modules.

IC Role / Device Role / Timing Role: Configurable PCI target interface with 66-MHz compliance, DLL-synchronized address/data capture, and hot-swap state management.

Use Value: Enables legacy CPU systems to integrate proprietary motion I/O without ASIC development; supports field-upgradable firmware.

Use Scenario: Real-time servo loop controller synchronizing encoder feedback, PWM generation, and safety monitoring.

IC Role / Device Role / Timing Role: Deterministic logic fabric executing 100 kHz PID loops with sub-microsecond jitter, using CLB carry chains for fast position math.

Use Value: Replaces microcontroller + CPLD combo; eliminates interrupt latency and enables adaptive tuning via reconfigurable datapath.

Video Frame Buffer Communications Protocol Gateway

Use Scenario: Dual-port memory buffer between camera sensor (LVDS) and display controller (RGB/TTL).

IC Role / Device Role / Timing Role: Block SelectRAM configured as 256×192×16-bit dual-port frame store with independent read/write clocks.

Use Value: Eliminates external video RAM; supports seamless frame swapping and overlay compositing in single device.

Use Scenario: Protocol translator between RS-485 Modbus network and Ethernet TCP/IP stack running on ARM host.

IC Role / Device Role / Timing Role: Hardware-accelerated packet parsing, CRC generation, and DMA arbitration between UART and Ethernet MAC.

Use Value: Offloads 85% of protocol processing from host CPU; ensures deterministic response under network congestion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV150-5PQ240C Higher speed grade (-5 vs. -4): 180 MHz max system clock; tighter setup/hold margins Required for designs exceeding 160 MHz timing closure; same pinout and configuration interface Select when targeting worst-case 180 MHz operation or needing margin for future frequency scaling
XCV200-4PQ240C Higher density: 236,666 system gates, 5,292 logic cells, 284 max I/O; identical PQ240 package Supports larger state machines and wider datapaths; retains same footprint for board-level upgrade path Choose for design scalability where logic utilization exceeds 85% on XCV150-4PQ240C

Compared with XCV150-4PQ240C, the -5 variant offers higher timing margin at identical packaging, while the XCV200-4PQ240C provides headroom for logic growth without PCB redesign-both maintain full functional and pin compatibility for drop-in replacement in existing layouts.

Availability

XCV150-4PQ240C is available at Aetrix Electronics and suitable for industrial motion control, PCI bridge integration, video frame buffering, and communications protocol gateway applications requiring stable component supply amid long-life product cycles.

Supply support for XCV150-4PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it delivers FPGA, SoC, and adaptive compute platforms.

The Virtex family-including XCV150-4PQ240C-was engineered for high-performance, high-density logic implementation in telecommunications infrastructure, industrial automation, and military/aerospace systems demanding reconfigurable hardware acceleration.

FAQ

Is XCV150-4PQ240C still in production?

No. XCV150-4PQ240C is obsolete per Xilinx Notice XCN10016 (2013). Aetrix Electronics maintains legacy inventory with full traceability and offers technical migration paths to Spartan-7 or Artix-7 FPGAs with compatible toolchains and pinout adaptation support.

What configuration modes does XCV150-4PQ240C support?

XCV150-4PQ240C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial (bitstream loaded via FPGA's DIN pin), SelectMAP (8-bit parallel interface), and JTAG (boundary-scan programming). Mode selection is controlled by M0–M2 pins at power-up.

Can XCV150-4PQ240C interface directly with 3.3 V peripherals?

Yes. XCV150-4PQ240C IOBs support LVTTL and PCI 3.3 V standards with 3.3 V VCCO. However, 3.3 V-tolerant inputs require VCCO = 3.3 V and disable 5 V tolerance; mixing 3.3 V and 5 V-tolerant standards in the same I/O bank is prohibited per DS003-2 Section "I/O Banking".

Does XCV150-4PQ240C include on-chip memory for data storage?

Yes. XCV150-4PQ240C contains 49,152 bits of block SelectRAM (12 × 4096-bit dual-port RAM blocks) plus distributed LUT RAM (16-bit per LUT). This enables synchronous FIFOs, lookup tables, and frame buffers without external memory chips.

What is the role of the die temperature sensor diode in XCV150-4PQ240C?

The die temperature sensor diode in XCV150-4PQ240C provides an analog voltage output (TEMP pin) proportional to junction temperature. Used with external ADC, it enables real-time thermal monitoring for dynamic clock gating or fan speed control in thermally constrained enclosures.

XCV150-4PQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
864
Number of Logic Elements/Cells:
3888
Total RAM Bits:
49152
Number of I/O:
166
Number of Gates:
164674
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV150-4PQ240C FAQ

1.How can I place an order for XCV150-4PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV150-4PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV150-4PQ240C reliable?

The price and inventory of XCV150-4PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV150-4PQ240C is usually 5 days.

3.What payment methods are accepted for XCV150-4PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV150-4PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV150-4PQ240C?

XCV150-4PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV150-4PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV150-4PQ240C?

For technical support, including XCV150-4PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV150-4PQ240C requirements.

6.How does Aetrix verify that XCV150-4PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV150-4PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV150-4PQ240C meets industry standards.

7.What is the process for return or replacement of XCV150-4PQ240C?

All XCV150-4PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV150-4PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV150-4PQ240C part is unused and in its original packaging.

Return procedure for XCV150-4PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV150-4PQ240C Tags

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