AMD XCV150-5BG256I

Overview

XCV150-5BG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs configurable as 16-bit RAM/shift register/dual-port RAM, plus 49,152 bits of block SelectRAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV150-5BG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (guaranteed 200 MHz system performance), industrial temperature range (–40°C to +100°C), 2.5 V core voltage, multi-standard SelectIO™ interface support (including LVTTL, SSTL2, HSTL), and IEEE 1149.1 boundary-scan testability.

Technical Context

The XCV150-5BG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling high place-and-route efficiency. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and dual synchronous/asynchronous set/reset per flip-flop.

Each IOB supports programmable input/output standards via independent VCCO and optional VREF per I/O bank, with 5 V-tolerant inputs for LVTTL/PCI, 24 mA output drive, and weak-keeper circuitry. Configuration is SRAM-based with JTAG, SelectMAP™, slave serial, and master serial modes - all factory-tested and supported by Xilinx Foundation™ and Alliance development tools.

Key Specifications

Pinout & Package

The XCV150-5BG256I is housed in a 256-ball fine-pitch Ball Grid Array (BG256) package with 1.27 mm ball pitch, designed for high-density PCB layouts and thermal reliability in industrial applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV150-5BG256I, the -6 variant improves maximum operating frequency at the expense of higher static power and cost, while the XCV200-5BG256I offers scalable logic capacity with identical timing and packaging - making both viable alternatives depending on whether performance headroom or resource headroom is the primary constraint.

Availability

XCV150-5BG256I is available at Aetrix Electronics and suitable for industrial control systems, test instrumentation, legacy avionics upgrades, and Compact PCI embedded computing requiring stable component supply across extended product lifecycles.

Supply support for XCV150-5BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA toolchains widely adopted in high-reliability and high-performance electronics.

The Virtex family - including XCV150-5BG256I - was engineered for demanding applications requiring high logic density, deterministic timing, and multi-standard I/O flexibility in industrial, aerospace, and communications infrastructure.

FAQ

Is XCV150-5BG256I still in production or supported by Xilinx?

XCV150-5BG256I is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and listed under obsolescence notice. However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers engineering support for sustaining production. No new silicon is being manufactured, but existing stock meets original Xilinx specifications and is suitable for repair, replacement, and long-life program fulfillment.

What configuration modes does XCV150-5BG256I support?

XCV150-5BG256I supports four configuration modes: JTAG (for debugging and programming), SelectMAP™ (parallel master mode), slave serial (SPI-like interface), and master serial (autonomous boot from external PROM). All modes load the same SRAM-based bitstream; JTAG is used for boundary-scan testing and in-system reprogramming, while master serial enables standalone operation without host intervention.

Does XCV150-5BG256I require external configuration memory?

Yes - XCV150-5BG256I is SRAM-based and loses configuration on power loss. An external non-volatile memory (e.g., Xilinx XC18V00-series PROM or compatible SPI flash) is required for automatic reconfiguration at power-up in master serial mode. In JTAG or SelectMAP™ modes, configuration may be loaded dynamically by a host processor, eliminating need for persistent storage but requiring active control.

Can XCV150-5BG256I interface directly with DDR SDRAM?

Yes - XCV150-5BG256I supports SSTL2 Class I/II I/O standards (1.25 V VREF, 2.5 V VCCO) required for DDR SDRAM interfaces. Its 180 user I/O pins, programmable slew rates, and on-die termination support allow robust 100–133 MHz DDR data paths. However, no dedicated DDR controller IP is embedded; users must implement timing-critical logic (e.g., write leveling, read DQS capture) using CLBs and DLL-aligned clocks.

What thermal management guidance applies to XCV150-5BG256I in industrial use?

XCV150-5BG256I is rated for –40°C to +100°C junction temperature and uses a thermally enhanced BG256 package. For continuous operation at max ambient, a minimum 250 cm² copper pour with thermal vias beneath the package is recommended. Power dissipation depends on utilization - typical active power ranges from 1.2 W (light logic) to 3.8 W (full utilization at 200 MHz); thermal simulation using Xilinx XPower Analyzer is advised for final layout validation.