AMD XCV150-5BG352C

Overview

XCV150-5BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces. It is used in high-speed digital signal processing, communications infrastructure, and reconfigurable computing systems requiring deterministic clock management and multi-standard I/O.

For engineers reviewing the XCV150-5BG352C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and migration guidance from Virtex-1 to later families - all grounded in DS003-1 (v4.0) and DS003-4.

Technical Context

The XCV150-5BG352C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for wide-function synthesis, and dual-port synchronous RAM capability per LUT.

It supports eight I/O banks with independent VCCO and VREF assignments, enabling mixed-voltage signaling (e.g., LVTTL at 3.3 V and SSTL2 at 2.5 V) within defined bank boundaries. Each IOB includes three storage elements configurable as D-flip-flops or latches, with independent clock enable, synchronous/asynchronous set/reset, and programmable polarity on all control signals.

Key Specifications

Pinout & Package

The XCV150-5BG352C is housed in a 352-ball fine-pitch Ball Grid Array (BG352) package with 260 user I/O pins distributed across eight I/O banks. Pin functions follow Xilinx's standard Virtex-1 pinout convention, with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan pins (TCK, TMS, TDI, TDO), and bank-specific VCCO/VREF supply pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV150-5BG352C, the XCV200-5BG352C offers scalable logic capacity within identical mechanical and electrical constraints, while the XCV150-6BG352C delivers tighter timing margins at the cost of increased power - both validated as production alternatives in Xilinx's Virtex-1 migration guide XCN10016.

Availability

XCV150-5BG352C is available at Aetrix Electronics and suitable for telecommunications infrastructure, industrial control systems, and test equipment requiring stable component supply amid obsolescence transitions.

Supply support for XCV150-5BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and established industry standards for reconfigurable computing.

The Virtex family, including XCV150-5BG352C, was designed for high-performance system integration - delivering ASIC-like density and speed with FPGA flexibility for communications, aerospace, and instrumentation applications.

FAQ

Is XCV150-5BG352C still in production?

No, XCV150-5BG352C is obsolete per Xilinx documentation DS003-1 (v4.0) dated March 2013 and XCN10016. Aetrix Electronics maintains limited legacy stock with full traceability and offers engineering support for migration paths to Spartan-6 or Artix-7 families based on functional equivalence and pin compatibility analysis.

What are the thermal limitations of XCV150-5BG352C?

XCV150-5BG352C operates in the commercial temperature range (0°C to +85°C junction). Its integrated die-temperature sensor diode provides analog output proportional to junction temperature, enabling closed-loop thermal management. Maximum power dissipation depends on I/O activity and clock frequency; typical active power at 100 MHz is 1.8 W, requiring ≥2.5 cm² copper pour on inner layers for reliable operation.

Can XCV150-5BG352C interface directly with 5 V TTL logic?

Yes, XCV150-5BG352C supports 5 V-tolerant inputs for LVTTL, PCI 5 V, and LVCMOS2 standards per DS003-2 Table 1. However, its outputs are not 5 V capable - they drive only up to VCCO (max 3.3 V). To drive 5 V loads, external level-shifting buffers or open-collector configurations with pull-up resistors are required.

How does the DLL in XCV150-5BG352C improve I/O timing?

The four DLLs in XCV150-5BG352C eliminate pad-to-pad hold time by matching input buffer delay to internal clock distribution skew. This enables zero-hold-time operation for source-synchronous interfaces like SDR SDRAM or camera sensors, allowing reliable sampling at 133 MHz without external delay elements or complex PCB trace tuning.

What configuration modes does XCV150-5BG352C support?

XCV150-5BG352C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (controlled by external processor), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming). All modes use the same 2.5 V VCCINT supply and require proper power sequencing per DS003-3 Section 3.2.