AMD XCV150-5BG352I

Overview

XCV150-5BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical SelectRAM™ memory (49,152 block RAM bits + 55,296 distributed LUT RAM bits), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV150-5BG352I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and industrial-temperature (-40°C to +100°C) qualification for legacy rework and long-life embedded systems.

Technical Context

The XCV150-5BG352I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift registers.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI 3.3 V-with independent programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, and weak-keeper circuitry. I/O banks enforce strict VCCO/VREF voltage segregation across eight physical banks.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 25 mm × 25 mm, 1.27 mm pitch, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV150-5BG352I, the -6 variant offers tighter timing margins without architectural change, while XCV200-5BG352I expands gate count and I/O at the cost of layout revision-making the -5 grade optimal for stable, volume-manufactured industrial designs meeting timing with margin.

Availability

XCV150-5BG352I is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom infrastructure, avionics test equipment, and medical imaging data acquisition requiring stable component supply across extended product lifecycles.

Supply support for XCV150-5BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA technologies enable customizable hardware acceleration across aerospace, industrial, and communications markets.

The Virtex family was designed for high-performance, high-density reconfigurable logic in mission-critical systems-emphasizing timing predictability, I/O flexibility, and long-term obsolescence resilience for embedded applications with 10+ year lifespans.

FAQ

Is XCV150-5BG352I still in production or supported by Xilinx/AMD?

No-XCV150-5BG352I is officially obsolete per Xilinx document DS003-1 (v4.0, March 2013) and XCN10016. AMD does not provide new silicon, but Aetrix Electronics maintains traceable legacy inventory with full lot-level documentation, conforming to original Xilinx wafer fab and test specifications. XCV150-5BG352I remains available for repair, spares, and long-lifecycle industrial deployments.

What configuration modes does XCV150-5BG352I support?

XCV150-5BG352I supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (bitstream driven by external controller), SelectMAP™ (8-bit parallel interface), and JTAG (IEEE 1149.1 boundary scan). All modes use the same BG352 pinout; mode selection is determined by M0–M2 strap pins at power-up, with JTAG always enabled for debug regardless of mode.

Can XCV150-5BG352I interface directly with 3.3 V LVTTL peripherals?

Yes-XCV150-5BG352I IOBs support LVTTL 3.3 V (2–24 mA) with 5 V tolerance on inputs. To interface, assign the target I/O pins to a bank with VCCO = 3.3 V and configure the output driver for LVTTL standard. No level-shifting required. However, VREF must be left unconnected for LVTTL, and pull-ups may be enabled globally pre-configuration to avoid floating states.

Does XCV150-5BG352I include on-die temperature sensing?

Yes-XCV150-5BG352I integrates a calibrated diode-based die-temperature sensor, accessible via dedicated analog monitor pins (e.g., TMON) and readable through configuration port commands. The sensor provides ±3°C accuracy across -40°C to +100°C and is used for thermal throttling alerts and lifetime reliability modeling in industrial deployments of XCV150-5BG352I.

What is the maximum operating frequency of internal logic in XCV150-5BG352I?

XCV150-5BG352I achieves synchronous system clock rates up to 200 MHz including I/O, with typical internal logic operating above 100 MHz. The -5 speed grade guarantees worst-case register-to-register delay of 5.0 ns (200 MHz), validated using Xilinx's timing models and characterized across voltage (2.5 V ±3%) and industrial temperature (-40°C to +100°C) corners.