AMD XCV150-5FG256C

Overview

XCV150-5FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), hierarchical memory (LUTs as 16-bit RAM/shift register/dual-port RAM, plus 49,152 bits of block SelectRAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV150-5FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (guaranteed 200 MHz system performance), FG256 package thermal and routing constraints, dual-port block RAM configuration flexibility, and SelectIO™ support for LVTTL, SSTL2, HSTL, and GTL standards across eight I/O banks.

Technical Context

The XCV150-5FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains per slice and F5/F6 multiplexers supporting up to 19-input logic functions.

Each IOB supports independent input/output flip-flops with programmable synchronous/asynchronous set/reset, clock enable, and polarity control. Block SelectRAM provides configurable dual-port 4k-bit RAMs (12 blocks totaling 49,152 bits), while LUTs serve as 16-bit shift registers or 16×2-bit synchronous RAM - critical for DSP data capture and buffering.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 17 mm × 17 mm body size. Designed for high-density PCB layouts with thermal and signal integrity optimization for 2.5 V core operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV150-5FG256C, the XCV150-6FG256C offers improved timing margin at identical density and package, while the XCV200-5FG256C delivers scalable logic capacity within the same mechanical and thermal envelope - both require no PCB changes but differ in cost, power, and design headroom.

Availability

XCV150-5FG256C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure hardware, automated test equipment, and legacy FPGA-based embedded platforms requiring stable component supply and long-term lifecycle support.

Supply support for XCV150-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in high-performance digital systems.

The Virtex family - including XCV150-5FG256C - was engineered for high-speed, high-density logic implementation in communications, computing, and industrial applications where flexibility, performance, and I/O versatility are critical.

FAQ

Is XCV150-5FG256C still in production or supported for new designs?

XCV150-5FG256C is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. However, Aetrix Electronics maintains verified legacy inventory with full traceability and offers engineering support for sustaining production, repair, and obsolescence mitigation programs involving XCV150-5FG256C.

What configuration modes does XCV150-5FG256C support?

XCV150-5FG256C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial (bitstream loaded via dedicated pins), SelectMAP™ (parallel programming using 8- or 16-bit bus), and JTAG (boundary-scan programming and debugging). All modes use SRAM-based configuration, requiring re-loading at power-up.

Can XCV150-5FG256C interface directly with 3.3 V LVTTL and 2.5 V SSTL2 buses simultaneously?

Yes - XCV150-5FG256C supports concurrent LVTTL (3.3 V VCCO) and SSTL2 (2.5 V VCCO) I/O standards, provided they are assigned to separate I/O banks. Each of the eight banks has independent VCCO and VREF pins; mixing standards within one bank is prohibited unless they share identical VCCO and VREF requirements.

What is the maximum operating junction temperature for XCV150-5FG256C?

The 'C' suffix in XCV150-5FG256C denotes Commercial temperature range: junction temperature (T_J) from 0°C to +85°C. This rating applies under specified VCCINT = 2.5 V ± 3%, VCCO = 2.5/3.3 V, and proper PCB thermal design per Xilinx AN119 guidelines for FG256 packages.

Does XCV150-5FG256C include on-die temperature sensing?

Yes - XCV150-5FG256C integrates a die-temperature sensor diode as part of its built-in monitoring circuitry. This analog output requires external measurement circuitry (e.g., ADC with bias current source) and is documented in Xilinx Application Note XAPP138 for thermal management calibration of Virtex devices including XCV150-5FG256C.