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AMD XCV150-5FG256I

Part No.:
XCV150-5FG256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXCV150-5FG256I.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,704

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Product details

Overview

XCV150-5FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets plus 24 local clock nets, and 49,152 bits of block SelectRAM for high-speed synchronous dual-port memory applications in industrial control and communications infrastructure.

For engineers reviewing the XCV150-5FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from Virtex-1 generation devices.

Technical Context

The XCV150-5FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 single-length lines, 12 buffered Hex lines, and 12 bidirectional Longlines - enabling worst-case synchronous operation up to 200 MHz. Its CLBs contain four logic cells each, with dedicated carry chains per slice and F5/F6 multiplexers supporting 5- and 6-input functions.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only when sharing VCCO voltage (e.g., LVTTL and PCI at 3.3 V), while GTL/GTL+ are compatible across all VCCO levels due to open-drain output topology.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 164,674 - defines total logic capacity for ASIC replacement or complex digital system integration
Logic Cells 3,888 - provides granular, routable resources for register-intensive or combinatorial-heavy designs
User I/O Pins 260 - enables high-pin-count interface consolidation (e.g., parallel bus + multiple serial links)
Block RAM Bits 49,152 - supports dual-port 4k×12-bit or 2k×24-bit configurations without external memory
Speed Grade -5 - guarantees 6.0 ns pipelined multiplier delay and 5.4 ns 16:1 multiplexer propagation under worst-case industrial conditions
Operating Temperature –40°C to +100°C - validated for industrial environments including motor drives and base station equipment
Supply Voltage 2.5 V core / 3.3 V I/O - separates logic and interface power domains to reduce noise coupling and enable mixed-voltage signaling

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 solder balls, 1.27 mm pitch, and 260 user I/O pins distributed across eight I/O banks. Thermal pad on underside supports industrial thermal dissipation requirements.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Dedicated Global Clock Input Low-skew inputs routed directly to four DLLs; required for synchronous domain synchronization
IO_LxxN/IO_LxxP Differential I/O Pair Supports LVDS, LVDSEXT, or BLVDS signaling when configured as differential pair in same bank
VCCO_0–VCCO_7 Bank-Specific I/O Supply Each powers one I/O bank; must be set identically across all pins in bank (e.g., 3.3 V for LVTTL)
VREF_0–VREF_7 Input Threshold Reference Required for SSTL/HSTL input standards; shared internally across all pins in bank
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port for configuration verification and in-system debugging

Key Features

Feature Design Value
Four DLLs Enables zero hold-time clock distribution and phase alignment across multiple clock domains
Configurable LUT-as-RAM Each 4-input LUT operates as 16×1-bit RAM, 16×2-bit RAM, or 16-bit shift register - ideal for FIFOs and DSP buffers
Synchronous Dual-Port Block RAM 4k-bit blocks support independent read/write addresses and widths per port - eliminates external SRAM in video frame buffers
SelectIO™ Interface 16 supported standards including HSTL Class IV (200 MHz), SSTL2, and PCI 66-MHz compliance - reduces level-shifter count
Dedicated Carry Logic Two per-slice carry chains enable 100+ MHz arithmetic pipelines without LUT resource penalty

Applications

Industrial Motor Control PCI-Based Data Acquisition

Use Scenario: Real-time position loop closure and PWM waveform generation for servo drives operating at 20 kHz switching frequency.

IC Role / Device Role / Timing Role: Configurable logic fabric executes custom motion algorithms; DLLs synchronize encoder sampling and gate drive timing.

Use Value: 260 I/O pins route encoder A/B/Z, analog feedback, and isolated digital outputs; 200 MHz system clock meets tight jitter budgets for <100 ns timing resolution.

Use Scenario: High-throughput sensor data capture from 16-channel ADCs via 66 MHz PCI bus to host CPU.

IC Role / Device Role / Timing Role: PCI interface controller and DMA engine implemented in CLBs; block RAM buffers burst transfers before PCI posting.

Use Value: Native 66-MHz PCI compliance eliminates external bridge IC; 49,152-bit block RAM absorbs 128-sample bursts without host intervention.

Baseband Signal Processing Programmable Protocol Converter

Use Scenario: Channelization and filtering of multi-carrier CDMA signals using real-time FIR filter banks.

IC Role / Device Role / Timing Role: Distributed LUTs implement coefficient storage and multiply-accumulate units; carry chains accelerate arithmetic pipelines.

Use Value: 3,888 logic cells support >32 parallel 16-tap filters; 2.5 V core voltage reduces dynamic power in thermally constrained RF modules.

Use Scenario: Translation between RS-422 serial telemetry and CAN FD bus in avionics subsystems.

IC Role / Device Role / Timing Role: Dual-ported block RAM stores protocol state machines; SelectIO supports both 3.3 V RS-422 drivers and CAN transceiver interfaces.

Use Value: Eight I/O banks isolate 3.3 V and 5 V tolerant domains; no level shifters needed between legacy and modern vehicle networks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV200-6FG256I Higher density (236,666 gates), faster speed grade (-6), same FG256 package Supports larger designs requiring >3,888 logic cells or tighter timing closure Select when migrating upward within same PCB footprint and thermal envelope
XCV150-6FG256I Same logic capacity and package, but -6 speed grade (5.1 ns multiplier delay vs. 6.0 ns) Better suited for 200 MHz system clocks with margin-critical paths Choose for new designs targeting maximum performance headroom at industrial temperature

Compared with XCV150-5FG256I, the XCV200-6FG256I offers higher gate count and speed for scalability, while the XCV150-6FG256I delivers identical logic resources with improved timing margins - both retain full pin compatibility and I/O banking structure.

Availability

XCV150-5FG256I is available at Aetrix Electronics and suitable for industrial motor control, PCI-based data acquisition, baseband signal processing, and programmable protocol conversion requiring stable component supply across extended lifecycle planning.

Supply support for XCV150-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and delivers programmable logic solutions for aerospace, industrial, and communications markets.

The Virtex family was designed specifically for high-performance, high-density reconfigurable computing - balancing place-and-route efficiency, clock management, and I/O flexibility in 0.22 μm CMOS process technology.

FAQ

What is the maximum operating frequency of the XCV150-5FG256I?

The XCV150-5FG256I achieves synchronous system clock rates up to 200 MHz, including I/O timing, as verified by Xilinx worst-case timing analysis. This applies to register-to-register paths and supported I/O standards like HSTL Class IV. The -5 speed grade specifies 6.0 ns pipelined multiplier delay and 5.4 ns 16:1 multiplexer propagation under industrial temperature conditions.

Does the XCV150-5FG256I support hot-swap operation in Compact PCI systems?

Yes, the XCV150-5FG256I is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture complies with PCI electrical specifications, including 66-MHz operation and robust ESD protection. The device supports master serial configuration mode, enabling safe insertion/removal without disrupting system power rails.

How many block RAMs does the XCV150-5FG256I contain, and what are their configurations?

The XCV150-5FG256I contains 12 block SelectRAMs totaling 49,152 bits. Each block is a fully synchronous dual-ported 4,096-bit RAM with independent address and data buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion and ping-pong buffering in communication protocols.

Can the XCV150-5FG256I interface directly with ZBTRAM devices?

Yes, the XCV150-5FG256I supports direct connection to ZBTRAM devices via its Multi-standard SelectIO™ interface. This capability is enabled by dedicated high-speed I/O circuitry and programmable slew rate control, allowing seamless integration with zero-bus-turnaround SRAMs for low-latency memory access in real-time control applications.

What I/O standards are supported by the XCV150-5FG256I, and how are they grouped?

The XCV150-5FG256I supports 16 I/O standards including LVTTL, LVCMOS2, PCI (3.3 V and 5 V), HSTL Classes I/III/IV, SSTL2/SSTL3, GTL/GTL+, and CTT. These are grouped into eight I/O banks, each with independent VCCO and VREF supplies. Standards sharing the same VCCO (e.g., LVTTL and PCI at 3.3 V) may coexist in one bank, while GTL/GTL+ are compatible across all VCCO levels.

XCV150-5FG256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
864
Number of Logic Elements/Cells:
3888
Total RAM Bits:
49152
Number of I/O:
176
Number of Gates:
164674
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XCV150-5FG256I FAQ

1.How can I place an order for XCV150-5FG256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV150-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV150-5FG256I reliable?

The price and inventory of XCV150-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV150-5FG256I is usually 5 days.

3.What payment methods are accepted for XCV150-5FG256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV150-5FG256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV150-5FG256I?

XCV150-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV150-5FG256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV150-5FG256I?

For technical support, including XCV150-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV150-5FG256I requirements.

6.How does Aetrix verify that XCV150-5FG256I is sourced from the original manufacturer or authorized distributors?

All XCV150-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV150-5FG256I meets industry standards.

7.What is the process for return or replacement of XCV150-5FG256I?

All XCV150-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV150-5FG256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV150-5FG256I part is unused and in its original packaging.

Return procedure for XCV150-5FG256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV150-5FG256I Tags

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