AMD XCV150-5FG456C

Overview

XCV150-5FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM and LUTs configurable as RAM/shift registers), and supports 16 SelectIO™ interface standards including PCI 66 MHz compliance and hot-swap capability for Compact PCI.

For engineers reviewing the XCV150-5FG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV150-5FG456C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain two slices each with four logic cells (LCs), carry chains, F5/F6 multiplexers for 5–19-input functions, and dual-port 4k-bit block RAMs.

I/O functionality is organized into eight banks with bank-specific VCCO and VREF requirements; compatible output standards per bank include LVTTL, SSTL3, HSTL Class I/III/IV, and GTL/GTL+, while input standards require matching VREF or tolerate 5 V depending on configuration. The device uses a 0.22 μm 5-layer metal CMOS process and is 100% factory tested.

Key Specifications

Pinout & Package

Package: FG456 (Fine-pitch Ball Grid Array, 456 balls, 1.0 mm pitch). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables, with eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), and dual-purpose configuration pins (e.g., INIT, PROGRAM, CCLK, DONE).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV150-5FG456C, the -6 variant improves worst-case timing margin by ~12% for high-frequency control loops, while the XCV200-5FG456C adds 44% more logic and 17% more I/O within identical FG456 packaging - enabling seamless migration without layout changes.

Availability

XCV150-5FG456C is available at Aetrix Electronics and suitable for industrial motion control systems, medical imaging front-ends, avionics sensor hubs, and high-speed communication interfaces requiring stable component supply throughout extended product lifecycles.

Supply support for XCV150-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for high-performance digital system design.

The Virtex family, including XCV150-5FG456C, was engineered for high-speed, high-density applications such as telecommunications infrastructure, military/aerospace systems, and medical imaging - emphasizing silicon efficiency, clock management, and multi-standard I/O flexibility.

FAQ

What is the maximum system clock frequency supported by XCV150-5FG456C?

XCV150-5FG456C supports synchronous system clock rates up to 200 MHz, including I/O timing, as verified under worst-case conditions for the -5 speed grade. This performance is enabled by four dedicated DLLs, low-skew global clock networks, and optimized carry logic. Actual achievable frequency depends on design complexity, placement, and routing; representative circuits like pipelined multipliers achieve 5.1 ns propagation delay at this grade.

Does XCV150-5FG456C support hot-swap operation in Compact PCI systems?

Yes, XCV150-5FG456C is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets PCI 66 MHz electrical specifications and includes robust ESD protection, programmable slew rate control, and configurable weak-keeper circuits to maintain signal integrity during insertion/removal. These features are documented in DS003-1 Section "Features" and confirmed in DS003-2 I/O banking guidelines.

How many block RAMs does XCV150-5FG456C contain, and what are their configurations?

XCV150-5FG456C contains 12 block SelectRAM units totaling 49,152 bits. Each block is a fully synchronous dual-ported 4k-bit RAM with independent address and data buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion and simultaneous read/write access for applications like video line buffers or protocol translation tables.

What I/O standards are supported by XCV150-5FG456C, and how are they assigned to banks?

XCV150-5FG456C supports 16 SelectIO™ standards including LVTTL, SSTL3, HSTL Class I/III/IV, GTL/GTL+, and PCI 66 MHz. These are assigned across eight I/O banks (Bank 0–7), with VCCO and VREF voltages bank-specific. For example, Bank 0 supports LVTTL at 3.3 V VCCO, while Bank 2 may use 1.5 V VCCO for HSTL Class IV - per Table 2 in DS003-2. Mixing incompatible standards within one bank violates voltage constraints.

Is XCV150-5FG456C still in production, and what is its obsolescence status?

No, XCV150-5FG456C is obsolete. Per DS003-1 (v4.0, March 2013), "The products listed in this data sheet are obsolete. See XCN10016 for further information." Xilinx issued discontinuation notices prior to 2013, and no new manufacturing lots have been released since. Aetrix Electronics supplies remaining inventory with full traceability and supports lifecycle management for legacy system maintenance.