AMD XCV150-5FG456I

Overview

XCV150-5FG456I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 456-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), dual-ported 4k-bit block RAMs, and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV150-5FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include its industrial temperature range (–40°C to +100°C), -5 speed grade (max 200 MHz system performance), SelectIO™ interface compatibility with LVTTL/LVCMOS2/HSTL/SSTL standards, and support for hot-swappable Compact PCI systems.

Technical Context

The XCV150-5FG456I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each-each with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register-and dedicated carry chains for arithmetic acceleration.

Each IOB supports IEEE 1149.1 boundary-scan, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and independent polarity control. I/O banking enforces VCCO and VREF voltage grouping across eight banks, enabling mixed-standard operation only within compatible voltage domains (e.g., 3.3 V for LVTTL/PCI, 1.5 V for HSTL Class IV).

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG456) with 456 balls, 260 user I/O pins, and dedicated power/ground/bank-reference pins arranged in eight I/O banks. Pin functions follow Xilinx Virtex standard mapping per DS003-4 (v4.0) Pinout Tables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV150-5FG456I, the -6 variant offers improved timing margin without changing PCB layout, while the XCV200-5FG456I provides scalable logic and memory headroom-both retain identical FG456 packaging and I/O banking structure for migration-friendly upgrades.

Availability

XCV150-5FG456I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and communications infrastructure requiring stable component supply across extended product lifecycles.

Supply support for XCV150-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed for high-performance, high-density logic implementation in demanding applications such as wired/wireless infrastructure, military systems, and industrial control-emphasizing speed, routing efficiency, and multi-standard I/O flexibility.

FAQ

What is the maximum operating frequency supported by the XCV150-5FG456I?

The XCV150-5FG456I is rated for system performance up to 200 MHz, including I/O paths. This is guaranteed under worst-case conditions for the -5 speed grade per DS003-3 (v4.0). Internal logic paths commonly achieve >100 MHz, and register-to-register delays are specified at 5.0 ns for critical paths. The four DLLs enable precise clock deskew and phase alignment to sustain this frequency across large designs.

Does the XCV150-5FG456I support hot-swap functionality in Compact PCI systems?

Yes, the XCV150-5FG456I is explicitly designed for hot-swappable Compact PCI applications. Its I/O buffers meet PCI electrical specifications, and its configuration architecture supports safe power-up/power-down sequencing. The device includes dedicated circuitry for detecting insertion/removal events and managing I/O tri-state behavior during transition-verified per Xilinx Application Note XAPP151.

How many block RAMs does the XCV150-5FG456I contain, and what are their configurations?

The XCV150-5FG456I contains 12 block SelectRAMs totaling 49,152 bits. Each block is a fully synchronous dual-ported 4,096-bit RAM with independent address/data/control per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible FIFO depth/width trade-offs and built-in bus-width conversion without external logic.

Can the XCV150-5FG456I operate with mixed I/O standards on the same device?

Yes, but only within I/O banking constraints. The XCV150-5FG456I has eight I/O banks, each requiring a single VCCO voltage and optionally one VREF voltage. Standards sharing the same VCCO (e.g., LVTTL and PCI at 3.3 V) can coexist in one bank; standards requiring different VCCO (e.g., HSTL at 1.5 V and SSTL2 at 2.5 V) must be assigned to separate banks. VREF-dependent inputs (e.g., HSTL) cannot mix with 5 V-tolerant inputs (e.g., LVTTL) in the same bank.

Is the XCV150-5FG456I still in production, and what is its obsolescence status?

The XCV150-5FG456I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with no new production. However, Aetrix Electronics maintains verified legacy inventory with full traceability and extended lifecycle support-including configuration bitstream validation, replacement guidance, and cross-reference to pin-compatible Virtex-II alternatives-for ongoing maintenance of installed industrial and defense systems.