AMD XCV150-6BG256C

Overview

XCV150-6BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV150-6BG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and real-world migration guidance from Virtex-1 family documentation (DS003-1 v4.0, DS003-2 v4.0).

Technical Context

The XCV150-6BG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class IV, and SSTL2-with independent programmable drive strength (up to 24 mA source/48 mA sink), slew rate control, and weak-keeper circuitry. I/O banks enforce shared VCCO and single-VREF per bank, with eight banks defined across the BG256 package footprint.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DOUT, DONE), and VCCO/VREF pins assigned per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV150-6BG256C, XCV150-6BG352C offers scalable I/O without logic upgrade, while XCV200-6BG256C delivers higher logic density in identical packaging-both require validation of thermal dissipation and power delivery under worst-case timing conditions.

Availability

XCV150-6BG256C is available at Aetrix Electronics and suitable for industrial control systems, communications infrastructure, test equipment, and legacy FPGA replacement programs requiring stable component supply and long-term obsolescence management.

Supply support for XCV150-6BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was designed for demanding applications requiring high logic density, fast I/O, and advanced clock management-targeting communications, aerospace, and high-end computing where SRAM-based reconfigurability and system-level integration are critical.

FAQ

What is the maximum operating frequency supported by the XCV150-6BG256C?

The XCV150-6BG256C supports synchronous system clock rates up to 200 MHz, including I/O timing, as guaranteed by its -6 speed grade. This is validated across register-to-register paths, pipelined multipliers, and address decoders per DS003-1 Table 2. Actual achievable frequency depends on design complexity, placement, and routing-but worst-case timing analysis confirms 200 MHz operation under commercial temperature and voltage conditions.

Does the XCV150-6BG256C support hot-swap functionality for Compact PCI systems?

Yes, the XCV150-6BG256C is explicitly designed for Compact PCI hot-swapping, as stated in DS003-1 Feature list and Higher Performance section. Its IOBs provide controlled slew rate, programmable drive strength, and bus-hold capability-ensuring safe insertion/removal without disrupting backplane signaling integrity or damaging adjacent slots.

How many block RAMs does the XCV150-6BG256C include, and what are their configurations?

The XCV150-6BG256C contains 12 block SelectRAM units totaling 49,152 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independent address/data buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible bus-width conversion and ping-pong buffering in high-speed data acquisition systems.

Can the XCV150-6BG256C be configured via JTAG, and what other modes are supported?

Yes, the XCV150-6BG256C supports JTAG configuration mode per IEEE 1149.1, alongside three other methods: master serial (from external PROM), slave serial (host-driven), and SelectMAP™ (parallel host interface). All modes load the same SRAM-based configuration bitstream; JTAG is commonly used for debugging and in-system programming during development and field updates.

Is the XCV150-6BG256C still in active production, and what obsolescence status applies?

No-the XCV150-6BG256C is obsolete, as confirmed in DS003-1 v4.0 (March 2013) Revision History and Product Obsolete/Under Obsolescence headers. Xilinx discontinued the Virtex family in favor of Spartan and Virtex-II successors. Aetrix Electronics maintains limited legacy inventory and provides obsolescence mitigation support, including cross-reference analysis and migration path guidance for XCV150-6BG256C replacements.