AMD XCV150-6BG352C

Overview

XCV150-6BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV150-6BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility, and migration guidance for Virtex family replacements.

Technical Context

The XCV150-6BG352C implements a regular array architecture with configurable logic blocks (CLBs) arranged in a 24×36 grid and surrounded by programmable input/output blocks (IOBs). Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for wide-function synthesis, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its routing hierarchy includes local VersaBlock interconnect, general-purpose routing matrix (GRM), 24 secondary clock nets, four primary low-skew global clocks, and peripheral VersaRing I/O routing. The device supports eight I/O banks with bank-specific VCCO and VREF requirements, enabling mixed-voltage signaling such as LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL Class IV (1.5 V).

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV150-6BG352C, XCV200-6BG352C provides headroom in logic and memory while maintaining identical footprint and timing, whereas XCV150-6FG456C trades package compatibility for greater I/O flexibility and routing isolation-both require design validation but serve distinct scalability vectors.

Availability

XCV150-6BG352C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure equipment, and medical imaging devices requiring stable component supply amid long product lifecycles.

Supply support for XCV150-6BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family-including XCV150-6BG352C-was engineered for high-performance, high-capacity reconfigurable computing in demanding applications such as wired/wireless infrastructure, defense signal processing, and high-end test equipment.

FAQ

What does the "-6" suffix indicate in XCV150-6BG352C?

The "-6" in XCV150-6BG352C denotes the speed grade, specifying worst-case timing performance: for example, a 5.0 ns register-to-register delay and 5.4 ns 16:1 multiplexer propagation under commercial temperature and voltage conditions. This grade ensures timing closure for synchronous designs targeting up to 200 MHz system clocks, and is validated across all logic paths and I/O standards supported by the device.

Is XCV150-6BG352C still in production or obsolete?

XCV150-6BG352C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with no new production planned. However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination support-including cross-reference guidance and migration paths-to sustain existing designs through end-of-life transitions.

Can XCV150-6BG352C support both 3.3 V and 2.5 V I/O standards simultaneously?

Yes, XCV150-6BG352C supports simultaneous 3.3 V (e.g., LVTTL, PCI) and 2.5 V (e.g., SSTL2, LVCMOS2) I/O standards-but only when assigned to separate I/O banks. Each bank requires uniform VCCO; mixing voltages within one bank violates electrical specifications. The device has eight banks, allowing up to eight independent VCCO domains, provided VREF is managed per bank where required.

What configuration modes does XCV150-6BG352C support?

XCV150-6BG352C supports four configuration modes: Master Serial (autonomous PROM boot), Slave Serial (host-controlled bitstream load), SelectMAP™ (8-bit parallel host interface), and JTAG (IEEE 1149.1 boundary scan). Mode selection is controlled by M0–M2 pins at power-up, and all modes use SRAM-based configuration, enabling unlimited in-system reprogramming without external nonvolatile storage.

Does XCV150-6BG352C include on-die temperature sensing?

Yes, XCV150-6BG352C integrates a calibrated die-temperature sensor diode, accessible via dedicated analog monitoring circuitry. This allows real-time thermal profiling during operation-critical for thermal management in fanless industrial enclosures-and supports dynamic throttling or alarm triggering when junction temperature approaches the 85°C commercial limit.