AMD XCV150-6FG256C

Overview

XCV150-6FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 256-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM and LUT-configurable RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable CompactPCI operation.

For engineers reviewing the XCV150-6FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV150-6FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual-port synchronous storage elements.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI (3.3 V and 5 V tolerant variants), with per-bank VCCO and VREF constraints, programmable slew rate, drive strength up to 24 mA source / 48 mA sink, and IEEE 1149.1 boundary-scan testability.

Key Specifications

Pinout & Package

Package: 256-ball Fine-pitch Ball Grid Array (FG256), 1.0 mm ball pitch, RoHS-compliant, thermal pad optional. Pinout conforms to DS003-4 (v4.0) Module 4 - full pin function tables available for FG256 package across all Virtex devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV150-6FG256C, the -5 variant trades 8% timing performance for lower power and cost, while the XCV200-6FG256C increases gate count by 44% but mandates pinout-aware layout changes - making XCV150-6FG256C optimal for balanced performance, I/O, and migration path in commercial-grade embedded systems.

Availability

XCV150-6FG256C is available at Aetrix Electronics and suitable for high-reliability industrial control, medical imaging subsystems, and defense electronics requiring stable component supply amid obsolescence management.

Supply support for XCV150-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it delivers FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex family was designed for high-performance, high-capacity reconfigurable logic applications demanding >100 MHz system clocks, multi-standard I/O, and embedded memory - targeting communications infrastructure, aerospace, and test equipment.

FAQ

Is XCV150-6FG256C still in production or supported by Xilinx?

XCV150-6FG256C is obsolete per Xilinx documentation DS003-1 (v4.0, March 2013) and XCN10016. Xilinx no longer manufactures or warrants the part, but Aetrix Electronics maintains legacy inventory with full traceability and extended lifecycle support for existing designs.

What development tools support XCV150-6FG256C configuration and verification?

XCV150-6FG256C is fully supported by Xilinx Foundation Series and Alliance Series design tools (v3.x–v5.x), including schematic entry, VHDL/Verilog simulation, automatic place-and-route, and bitstream generation. JTAG programming via Xilinx Parallel Cable III or compatible adapters remains functional with modern OS drivers.

Can XCV150-6FG256C operate with 3.3 V I/O while using 2.5 V core voltage?

Yes - XCV150-6FG256C requires 2.5 V on VCCINT (core) and supports 3.3 V on VCCO (I/O) for LVTTL, PCI, and SSTL3 standards. Each I/O bank must use a single VCCO voltage; mixing 3.3 V and 2.5 V standards requires physical separation into different banks per DS003-2 Section "I/O Banking".

Does XCV150-6FG256C include internal configuration memory or require external PROM?

XCV150-6FG256C is SRAM-based and has no non-volatile configuration memory. It requires external configuration source: master serial PROM (e.g., Xilinx XC18V02), SelectMAP parallel flash, or JTAG download. Configuration is loaded on power-up and must be repeated after each reset.

What thermal considerations apply to XCV150-6FG256C in commercial temperature operation?

XCV150-6FG256C is rated for 0°C to +85°C junction temperature. Thermal design must ensure case temperature stays below 75°C under full utilization; the integrated die-temperature sensor diode (described in DS003-1 Features) enables real-time monitoring via external circuitry when calibrated.