AMD XCV150-6FG456C

Overview

XCV150-6FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 260 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV150-6FG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation (DS003-1 v4.0, DS003-2 v4.0).

Technical Context

The XCV150-6FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain two slices each with four logic cells (LCs), carry chains, F5/F6 multiplexers for 5–19-input logic, and dual-port 4k-bit block RAMs organized in two full-height columns.

I/O functionality is managed via SelectIO™-enabled IOBs supporting 16 standards-including LVTTL (5 V tolerant), SSTL2/3, HSTL Class I/III/IV, and GTL+-with per-bank VCCO and shared VREF constraints. Each IOB includes three storage elements (configurable as flip-flops or latches), programmable slew rate, drive strength up to 24 mA source / 48 mA sink, and weak-keeper circuitry.

Key Specifications

Pinout & Package

Package: FG456 (Fine-pitch Ball Grid Array, 1.0 mm pitch, 26×26 array excluding corner balls). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables, with 260 user I/O distributed across eight I/O banks (Bank 0–7), plus dedicated power (VCCINT, VCCO), ground (GND), configuration (INIT, CCLK, DONE), and global clock (GCLK0–GCLK3) pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV150-6FG456C, XCV200-6FG456C offers higher gate count in identical packaging for seamless scalability, while XCV150-6BG352C retains functional equivalence in a mechanically distinct package-neither is pin-compatible, but both share identical I/O banking rules and DLL architecture.

Availability

XCV150-6FG456C is available at Aetrix Electronics and suitable for industrial automation backplanes, telecom line card memory controllers, medical ultrasound DSP acceleration, and avionics protocol gateways requiring stable component supply across extended product lifecycles.

Supply support for XCV150-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex family was engineered for high-speed, high-density reconfigurable computing in infrastructure applications-delivering SRAM-based flexibility with ASIC-like performance through hierarchical routing, dedicated arithmetic logic, and multi-standard I/O.

FAQ

What is the maximum operating frequency supported by the XCV150-6FG456C?

The XCV150-6FG456C supports synchronous system clock rates up to 200 MHz, including I/O timing closure, as confirmed by worst-case timing analysis in DS003-3 (v4.0). This applies to register-to-register paths and validated I/O standards like LVTTL (180 MHz) and HSTL Class IV (200 MHz). The -6 speed grade guarantees this performance under commercial temperature conditions (0°C to +85°C).

Does the XCV150-6FG456C support hot-swap functionality for Compact PCI systems?

Yes, the XCV150-6FG456C is explicitly designed for hot-swappable Compact PCI applications, as stated in DS003-1 (v4.0) Feature section. Its I/O structure, power sequencing behavior, and IEEE 1149.1 boundary-scan support enable safe insertion/removal while the backplane remains powered - critical for carrier-grade telecom and industrial control systems.

How many block RAMs does the XCV150-6FG456C include, and what are their configurations?

The XCV150-6FG456C contains 12 block SelectRAM units totaling 49,152 bits, as specified in DS003-2 Table 3. Each block is a fully synchronous dual-ported 4096-bit RAM with independent address/data/control per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 bit depths/widths - enabling flexible FIFO, buffer, or lookup table implementations without consuming CLB resources.

Can the XCV150-6FG456C interface directly with 5 V TTL logic?

Yes, the XCV150-6FG456C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, as documented in DS003-2 Table 1. However, output drivers are not 5 V tolerant - they operate at VCCO levels of 1.5 V, 2.5 V, or 3.3 V only. For bidirectional 5 V interfacing, external level-shifting circuitry is required on output paths.

What configuration modes are supported by the XCV150-6FG456C?

The XCV150-6FG456C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial, SelectMAP™ (8- or 16-bit parallel), and JTAG (IEEE 1149.1 boundary scan). All modes load SRAM-based configuration data on power-up or reset, enabling unlimited reprogramming - a core advantage over mask-programmed gate arrays.