AMD XCV150-6PQ240C

Overview

XCV150-6PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 164,674 system gates, 3,888 logic cells in a 24×36 CLB array, and 166 user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP). It features four delay-locked loops (DLLs), hierarchical memory (including 49,152 bits of block SelectRAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV150-6PQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and real-world migration guidance from Virtex-1 generation designs.

Technical Context

The XCV150-6PQ240C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class IV, and SSTL2-with independent programmable drive strength (up to 24 mA source/48 mA sink), slew rate control, weak-keeper, and IEEE 1149.1 boundary-scan. Eight I/O banks enforce VCCO/VREF voltage segregation: all VCCO pins in PQ240 are internally bonded, requiring a single 2.5 V or 3.3 V supply per bank.

Key Specifications

Pinout & Package

Package: 240-pin Plastic Quad Flat Pack (PQ240), 0.5 mm pitch, 32.0 × 32.0 mm body size, JEDEC MS-026 compliant. Thermal pad not present; thermal dissipation relies on PCB copper area and airflow.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV150-6PQ240C, XCV150-6BG256C offers greater I/O flexibility and thermal efficiency at the cost of board-level redesign, while XCV200-6PQ240C delivers scalable logic capacity within identical mechanical and thermal constraints-making it the only true drop-in density upgrade option.

Availability

XCV150-6PQ240C is available at Aetrix Electronics and suitable for industrial motion control, telecom line card interface, medical imaging data aggregation, and PCI bridge controller applications requiring stable component supply amid long product lifecycles.

Supply support for XCV150-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools now integral to adaptive computing.

The Virtex family was designed as high-performance, high-capacity SRAM-based FPGAs targeting demanding applications in telecommunications infrastructure, industrial automation, and high-end computing-emphasizing place-and-route efficiency and silicon utilization.

FAQ

What is the maximum operating frequency supported by the XCV150-6PQ240C?

The XCV150-6PQ240C supports synchronous system clock rates up to 200 MHz when using delay-locked loops (DLLs) and optimized placement/routing. This includes I/O timing; representative circuits such as register-to-register paths achieve 5.0 ns propagation delay at speed grade -6, and HSTL Class IV interfaces operate reliably at 200 MHz. Actual frequency depends on design complexity and resource usage.

Does the XCV150-6PQ240C support hot-swap functionality?

Yes, the XCV150-6PQ240C supports hot-swapping for Compact PCI applications. Its I/O architecture includes robust electrostatic discharge (ESD) protection, programmable weak-keeper circuits to maintain bus states during insertion/removal, and compatible signaling standards (e.g., 3.3 V PCI) that meet Compact PCI hot-swap electrical requirements. System-level implementation requires proper power sequencing and connector design.

How many block RAMs does the XCV150-6PQ240C contain, and what are their configurations?

The XCV150-6PQ240C contains twelve 4k-bit block SelectRAMs, totaling 49,152 bits. Each block is a fully synchronous dual-ported RAM with independent address, data, and control signals per port. Port widths are programmable from 1 to 16 bits (depth inversely adjusted), supporting configurations such as 16×256, 8×512, or 4×1024-enabling flexible FIFO depth/width trade-offs in communication and buffering applications.

Can the XCV150-6PQ240C be configured via JTAG, and what modes are supported?

Yes, the XCV150-6PQ240C supports JTAG configuration in addition to master serial, slave serial, and SelectMAP™ modes. JTAG mode uses TCK/TMS/TDI/TDO pins per IEEE 1149.1 for in-system programming, boundary-scan testing, and configuration readback. It does not require external configuration PROM and enables field updates without hardware modification-critical for maintenance in deployed systems.

Is the XCV150-6PQ240C still in active production, and what is its obsolescence status?

No, the XCV150-6PQ240C is obsolete. Per Xilinx documentation DS003-1 (v4.0) dated March 1, 2013, all Virtex devices-including XCV150-6PQ240C-are listed as "Product Obsolete/Under Obsolescence." Xilinx recommends migration to Spartan-6 or Artix-7 families for new designs. Aetrix Electronics maintains limited legacy inventory with full traceability for sustaining engineering and repair programs.