AMD XCV1600E-6BG560C

Overview

XCV1600E-6BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.19 million system gates, 34,992 logic cells, and 72 × 108 CLB array. It delivers up to 240 MHz synchronous system performance, supports 622 Mb/s LVDS differential I/O, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communications infrastructure and reconfigurable computing platforms requiring PCI-compliant 33/66 MHz interfaces.

For engineers reviewing the XCV1600E-6BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its 589.8 kbit true dual-port block RAM, 724 user I/O pins in BG560 package, -6 speed grade timing (e.g., 4.3 ns register-to-register), 1.8 V core voltage with 3.3 V I/O tolerance, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools.

Technical Context

The XCV1600E-6BG560C implements a flexible architecture built on a 0.18 μm 6-layer metal CMOS process, featuring configurable logic blocks (CLBs) with four LCs per slice, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling up to 19-input logic functions. Its IOBs support SelectI/O+™ with programmable delay, weak-keeper, and independent polarity control per buffer.

It uses eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction for DDR, and frequency multiplication (up to 4×); each DLL operates independently with mirrored clock capability. The device organizes block RAM into 144 columns of 4096-bit true dual-port memory, placed adjacent to CLB columns per Table 3, and supports distributed RAM via LUTs configured as 16×1, 16×2, or 32×1 synchronous RAM.

Key Specifications

Pinout & Package

Package: 560-ball Ball Grid Array (BG560), 1.27 mm pitch, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV1600E-6BG560C, the -7 variant improves worst-case timing margin while maintaining identical power and thermal profile, whereas XCV2000E-6BG560C trades higher static power for scalable logic capacity-both alternatives retain full toolchain compatibility with Xilinx Foundation Series™.

Availability

XCV1600E-6BG560C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, reconfigurable DSP platforms, and automated test equipment requiring stable component supply over extended production lifecycles.

Supply support for XCV1600E-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and EDA tool integration for hardware acceleration.

The Virtex-E family was designed for high-performance reconfigurable computing applications demanding >200 MHz system clocks, multi-standard I/O, and large on-chip memory - targeting telecom, military, and instrumentation markets where flexibility and time-to-market outweigh ASIC NRE costs.

FAQ

What is the maximum operating frequency of the XCV1600E-6BG560C core logic?

The XCV1600E-6BG560C achieves up to 240 MHz synchronous system performance in optimized designs, with worst-case register-to-register delay specified at 4.3 ns for the -6 speed grade. This timing is validated under commercial temperature conditions (0°C to +85°C) with 1.8 V VCCINT and proper PCB layout decoupling.

Does the XCV1600E-6BG560C support LVDS input and output simultaneously on the same differential pair?

Yes, the XCV1600E-6BG560C supports LVDS bidirectional operation: each IO_LxxN/IO_LxxP pair can be configured as LVDS input, LVDS output, or LVDS I/O using the IOB control registers. This enables point-to-point or bus-topology LVDS links without external direction control logic.

How many true dual-port block RAMs does the XCV1600E-6BG560C contain?

The XCV1600E-6BG560C contains 144 block RAM units, each providing 4096 bits of true dual-port memory (2 ports, independent clocks/address/data). Total block RAM capacity is 589,824 bits, organized in columns aligned with CLB arrays as defined in Table 3 of DS022-2.

Is the XCV1600E-6BG560C pin-compatible with other Virtex-E devices in the BG560 package?

Yes, the XCV1600E-6BG560C shares identical pinout with XCV400E, XCV600E, and XCV1000E in the BG560 package per Table 3 of DS022-1. All use the same 724-user-I/O ball map, though unused balls may be marked NC or reserved for larger devices' VCCO/VREF requirements.

What development tools support the XCV1600E-6BG560C?

The XCV1600E-6BG560C is supported by Xilinx Foundation Series™ and Alliance Series™ design tools (v3.1+), including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. These tools provide 50% faster compile times versus prior generations and support Internet Team Design (ITD) for collaborative million-gate projects.