AMD XCV1600E-6FG900C

Overview

XCV1600E-6FG900C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.188 million system gates, 34,992 logic cells, and 72 × 108 CLB array. It supports up to 724 user I/O pins in FG900 package, integrates eight digital Delay-Locked Loops (DLLs), and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication infrastructure applications.

For engineers reviewing the XCV1600E-6FG900C datasheet, pinout, applications, or equivalent options, this FPGA offers verified support for LVDS (622 Mb/s), PCI 3.3 V/33–66 MHz, synchronous DDR SDRAM interfaces, and true dual-port block RAM - critical for protocol bridging, baseband processing, and reconfigurable computing systems requiring deterministic timing and multi-standard I/O flexibility.

Technical Context

The XCV1600E-6FG900C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its eight fully digital DLLs provide clock multiply/divide, zero-delay LVPECL/LVDS clock conversion, and 50% duty-cycle synthesis for DDR applications. I/O banking enforces VCCO- and VREF-based grouping across eight banks, enabling concurrent use of LVTTL, SSTL, HSTL, LVDS, and LVPECL standards - subject to voltage compatibility per bank.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG900), 900-ball, 1.0 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV1600E-6FG900C, the -7 variant improves timing margin without layout change, while XCV2000E-6FG900C increases logic capacity at the cost of full hardware redesign - making the -6 grade optimal for cost-sensitive, timing-critical deployments where density suffices.

Availability

XCV1600E-6FG900C is available at Aetrix Electronics and suitable for high-speed communication infrastructure, PCI bridge acceleration, reconfigurable DSP, and test instrumentation requiring stable component supply and long-term obsolescence management.

Supply support for XCV1600E-6FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic applications in communications, computing, and instrumentation - emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count alone.

FAQ

What is the maximum supported LVDS data rate for XCV1600E-6FG900C?

XCV1600E-6FG900C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to source-synchronous interfaces using dedicated differential I/O pairs (IO_LxxN/IO_LxxP) with proper PCB layout (100 Ω differential impedance, length matching). The -6 speed grade ensures timing closure at this rate under worst-case conditions.

Does XCV1600E-6FG900C support true dual-port block RAM?

Yes, XCV1600E-6FG900C includes 144 block RAM units, each providing true dual-port synchronous access (independent read/write addresses, clocks, and enables per port). As documented in DS022-2 (v2.8) Section "Block SelectRAM", this enables simultaneous read and write operations - essential for ping-pong buffering, FIFOs, and memory-mapped peripheral interfaces without arbitration logic.

How many DLLs does XCV1600E-6FG900C integrate, and what are their key functions?

XCV1600E-6FG900C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 (v2.3) "High-Performance Built-In Clock Management Circuitry". Each DLL provides clock multiply/divide, zero-delay conversion of LVPECL/LVDS inputs to any I/O standard, and 50% duty-cycle synthesis - critical for DDR I/O timing, clock deskew, and multi-domain synchronization in high-speed designs.

Is XCV1600E-6FG900C pin-compatible with other Virtex-E devices in FG900 package?

XCV1600E-6FG900C shares the FG900 package footprint with XCV1000E-6FG900C and XCV2000E-6FG900C, but is not fully pin-compatible due to differing VREF pin allocations and CLB column layout. DS022-1 states "The same device in the same package for the Virtex-E and Virtex families are pin-compatible with some minor exceptions", and Module 4 pinout tables confirm unique VREF and I/O bank assignments per density grade.

What I/O standards are supported by XCV1600E-6FG900C, and how are they grouped?

XCV1600E-6FG900C supports 20 I/O standards including LVTTL, SSTL3, HSTL, LVDS, and LVPECL via SelectI/O+™ technology. Standards are grouped into eight I/O banks (two per edge), each requiring shared VCCO and - where applicable - a single VREF voltage. Compatible standards per bank are defined by VCCO value (e.g., 3.3 V bank supports LVTTL, PCI, SSTL3, LVPECL), as detailed in DS022-2 Table 1 and I/O Banking section.