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AMD XCV1600E-6FG900I
- Part No.:
- XCV1600E-6FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XCV1600E-6FG900I.pdf
- Description:
- IC FPGA 700 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,044
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Product details
Overview
XCV1600E-6FG900I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.19 million system gates, 34,992 logic cells, and 72 × 108 CLB array. It delivers up to 240 MHz synchronous system performance, supports 622 Mb/s LVDS differential I/O, and integrates eight digital Delay-Locked Loops (DLLs) for clock management in high-speed communication and signal processing systems.
For engineers reviewing the XCV1600E-6FG900I datasheet, pinout, applications, or equivalent options, this device is evaluated for PCI-compliant 33/66-MHz interfaces, DDR memory controller implementation, source-synchronous data capture at 622 Mb/s, and multi-standard I/O bank configuration requiring precise VCCO/VREF partitioning.
Technical Context
The XCV1600E-6FG900I implements a regular FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS, BLVDS, and LVPECL, with I/O banking enforced by shared VCCO and VREF per bank. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 2.19 M - determines maximum combinational logic capacity for ASIC replacement or complex state machines |
| Logic Cells | 34,992 - defines fine-grained logic resource count for HDL synthesis and place-and-route density |
| CLB Array | 72 × 108 - specifies physical grid dimensions governing floorplanning and interconnect latency |
| User I/O Pins | 724 - enables high-pin-count peripheral interfacing with banked voltage and standard constraints |
| Differential I/O Pairs | 344 - supports 688-pin-equivalent high-bandwidth links such as LVDS SerDes or parallel DDR buses |
| Block RAM Bits | 589,824 - provides 144 × 4096-bit true dual-port memory blocks for FIFOs, buffers, or lookup tables |
| Internal Clock Speed | 240 MHz - achievable synchronous system clock rate including I/O timing closure |
| Speed Grade | -6 - guarantees worst-case timing performance at 1.8 V VCCINT and industrial temperature range |
Pinout & Package
Package: Fine Pitch Ball Grid Array (FG900) with 900 balls, 1.0 mm pitch, and industrial-grade thermal profile (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs and CLBs for synchronous domain control |
| VCCINT | Core Supply | 1.8 V power for logic and memory arrays; requires tight regulation and local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Supply | Bank-specific 1.5–3.3 V outputs; each bank must use identical VCCO for compatible standards |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVCMOS inputs; internally tied within bank |
| IO_LxxN/IO_LxxP | Differential I/O Pair | LVDS/BLVDS-capable pins supporting 622 Mb/s source-synchronous signaling |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for configuration, debug, and production verification |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital DLLs | Enables jitter-free clock distribution, 50% duty cycle generation for DDR, and 4× frequency multiplication without external PLL |
| True Dual-Port BlockRAM | 144 independent 4096-bit RAM blocks with separate read/write clocks and addresses per port for pipelined data flow |
| SelectI/O+ Technology | Supports 20 I/O standards across 8 banks with mixed-voltage operation-enables single-device PCIe/DDR/ASIC co-interface |
| SRAM-Based Configuration | Unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode using external PROM |
| Dedicated Carry Logic | Two-bit-per-CLB carry chains accelerate arithmetic pipelines and enable efficient multiplier accumulation |
Applications
| High-Speed Communication Interface | DDR Memory Controller |
|---|---|
Use Scenario: Implementing a 622 Mb/s source-synchronous SERDES link between FPGA and optical transceiver using LVDS pairs. IC Role / Device Role / Timing Role: Configurable logic fabric with DLL-synchronized I/O timing, LVDS input/output buffers, and embedded FIFOs for elastic buffering. Use Value: Eliminates need for external clock recovery ICs and reduces board-level skew through on-die DLL alignment of transmit/receive clocks. | Use Scenario: Controlling two banks of 200 MHz DDR SDRAM with burst-length-4 reads/writes and refresh scheduling. IC Role / Device Role / Timing Role: Timing-critical memory controller with DLL-matched DQS strobes, address/command register staging, and write leveling logic. Use Value: Achieves full 200 MHz DDR bandwidth using internal block RAM for command queueing and distributed RAM for data masking registers. |
| PCI Bus Bridge | Multi-Standard I/O Aggregation |
Use Scenario: Bridging legacy 33/66-MHz 32-bit PCI bus to modern peripheral subsystem with DMA and interrupt arbitration. IC Role / Device Role / Timing Role: Protocol-aware bridge implementing PCI transaction layer, configuration space, and arbiter logic with timing-compliant setup/hold margins. Use Value: Meets PCI specification for 3.3 V signaling, hot-plug detection, and 66-MHz timing without external glue logic or level shifters. | Use Scenario: Aggregating HSTL, SSTL, and LVCMOS peripherals onto a single backplane with isolated voltage domains. IC Role / Device Role / Timing Role: I/O hub managing eight independent banks with distinct VCCO/VREF assignments and per-bank I/O standard selection. Use Value: Reduces PCB layer count and eliminates discrete level translators by supporting mixed-voltage I/O on one die with bank-isolated power rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV1600E-7FG900I | Same architecture and package but -7 speed grade: slower max clock (220 MHz vs. 240 MHz) and relaxed timing margins | Suitable for cost-sensitive designs where worst-case 240 MHz is not required; lower power at same VCCINT | Select when timing closure is achieved with margin and thermal budget favors lower static/dynamic power |
| XCV2000E-6FG900I | Higher density (518,400 logic cells vs. 419,904), same -6 speed grade, identical FG900 package footprint but increased I/O count (804 vs. 724) | Required for designs exceeding 34,992 logic cells or needing >344 differential pairs; same PCB layout with pin-compatible upgrade path | Choose for future-proofing or immediate scalability where additional CLBs and I/O are needed without board redesign |
Compared with XCV1600E-6FG900I, the -7 variant trades peak performance for reduced power and cost, while the XCV2000E-6FG900I offers direct pin-compatible expansion with +23% logic capacity and +11% I/O-both retain identical DLL count, memory hierarchy, and I/O banking architecture.
Availability
XCV1600E-6FG900I is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and defense electronics requiring stable component supply across extended lifecycle planning horizons.
Supply support for XCV1600E-6FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for reconfigurable computing.
The Virtex-E family was designed for high-performance system-on-chip integration in communications, imaging, and compute acceleration-emphasizing I/O flexibility, clock management, and memory bandwidth over raw gate count.
FAQ
What is the maximum differential I/O bandwidth supported by the XCV1600E-6FG900I?
The XCV1600E-6FG900I supports up to 344 differential I/O pairs, enabling aggregate bandwidth exceeding 100 Gb/s when operating at 622 Mb/s per LVDS lane. This capability is realized using source-synchronous timing architectures and is validated under worst-case -6 speed grade conditions at industrial temperature.
Does the XCV1600E-6FG900I support true dual-port block RAM operation?
Yes, the XCV1600E-6FG900I includes 144 block RAM units, each configured as a true dual-port 4096-bit memory with independent clocks, addresses, and data buses for both ports. This allows concurrent read and write operations without contention, essential for FIFOs and ping-pong buffering in real-time systems.
How many Delay-Locked Loops (DLLs) does the XCV1600E-6FG900I integrate, and what are their key functions?
The XCV1600E-6FG900I integrates eight fully digital DLLs. These provide zero-delay clock conversion from high-speed LVPECL/LVDS inputs, 50% duty cycle synthesis for DDR applications, clock multiplication up to 4×, and phase alignment across multiple I/O banks-eliminating external clock conditioning ICs.
Can the XCV1600E-6FG900I be used in PCI 66-MHz compliant designs?
Yes, the XCV1600E-6FG900I is explicitly designed for PCI compliance at both 33 MHz and 66 MHz with 3.3 V signaling. Its I/O buffers meet PCI electrical specifications, and its DLLs ensure timing closure for setup/hold requirements across temperature and voltage corners in industrial environments.
What is the core supply voltage requirement for the XCV1600E-6FG900I, and how is I/O voltage managed?
The XCV1600E-6FG900I requires a 1.8 V ±3% VCCINT supply for its core logic and memory. I/O voltage is managed per bank via eight independent VCCO supplies (1.5 V to 3.3 V), allowing simultaneous operation of LVTTL, SSTL, HSTL, and LVDS standards-subject to bank-level VCCO/VREF compatibility rules.
XCV1600E-6FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7776
- Number of Logic Elements/Cells:
- 34992
- Total RAM Bits:
- 589824
- Number of I/O:
- 700
- Number of Gates:
- 2188742
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XCV1600E-6FG900I FAQ
1.How can I place an order for XCV1600E-6FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV1600E-6FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV1600E-6FG900I reliable?
The price and inventory of XCV1600E-6FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV1600E-6FG900I is usually 5 days.
3.What payment methods are accepted for XCV1600E-6FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV1600E-6FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV1600E-6FG900I?
XCV1600E-6FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV1600E-6FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV1600E-6FG900I?
For technical support, including XCV1600E-6FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV1600E-6FG900I requirements.
6.How does Aetrix verify that XCV1600E-6FG900I is sourced from the original manufacturer or authorized distributors?
All XCV1600E-6FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV1600E-6FG900I meets industry standards.
7.What is the process for return or replacement of XCV1600E-6FG900I?
All XCV1600E-6FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XCV1600E-6FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV1600E-6FG900I part is unused and in its original packaging.
Return procedure for XCV1600E-6FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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