AMD XCV1600E-7BG560I

Overview

XCV1600E-7BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.19 million system gates, 34,992 logic cells, and 724 user I/O pins in a 560-ball BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 589.8 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV1600E-7BG560I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom line cards, video processing pipelines, and industrial real-time control where deterministic timing, multi-standard I/O, and on-chip memory bandwidth >1.6 Tb/s are required.

Technical Context

The XCV1600E-7BG560I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-organized across eight voltage-banked I/O groups. Each bank requires shared VCCO and, where applicable, a single VREF; input buffers for LVTTL/LVCMOS/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage I/O operation within bank constraints.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV1600E-7BG560I, the –6 variant trades speed grade for timing margin while maintaining identical functionality, whereas the XCV2000E-7BG560I extends logic capacity within the same footprint - both preserve pin compatibility, I/O banking rules, and DLL configuration flow, simplifying migration paths.

Availability

XCV1600E-7BG560I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial motion controllers, and defense radar systems requiring stable component supply over extended product lifecycles.

Supply support for XCV1600E-7BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and delivers programmable silicon solutions for high-performance computing, communications, and embedded systems.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic applications demanding advanced I/O flexibility, integrated memory, and deterministic clock management - targeting systems where ASIC economics or time-to-market preclude custom silicon.

FAQ

What is the maximum differential I/O pair count supported by XCV1600E-7BG560I?

XCV1600E-7BG560I supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This enables high-bandwidth differential interfaces such as LVDS camera links, JESD204B-like serialization, or multi-lane source-synchronous buses. The 344 pairs are distributed across eight I/O banks, each supporting standards like LVDS, BLVDS, and LVPECL with matched trace routing requirements.

Does XCV1600E-7BG560I support PCI-X or only conventional PCI?

XCV1600E-7BG560I is explicitly specified for PCI 3.3 V, 32/64-bit, 33/66 MHz compliance - not PCI-X. Its I/O structure meets PCI SIG Class I electrical requirements for 66 MHz operation, including setup/hold timing, drive strength (24 mA source / 48 mA sink), and noise immunity. PCI-X (133 MHz) requires stricter jitter and skew control not guaranteed by the Virtex-E DLL architecture or I/O timing models.

How many DLLs are integrated into XCV1600E-7BG560I and what are their key capabilities?

XCV1600E-7BG560I integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply (up to 4×), divide, duty-cycle correction to 50%, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any supported I/O standard. These DLLs operate independently, enabling multiple synchronous domains - for example, one DLL for a 200 MHz DDR interface and another for a 125 MHz SerDes clock.

Is XCV1600E-7BG560I pin-compatible with earlier Virtex devices?

XCV1600E-7BG560I is not bitstream-compatible with Virtex devices, and while some packages share ball counts (e.g., BG560), pin assignments differ due to architectural changes in I/O banking, VCCO/VREF distribution, and global clock routing. The datasheet states "same device in same package … are pin-compatible with some minor exceptions" - but XCV1600E has no Virtex predecessor in BG560, making direct pin mapping invalid without verification against Module 4 pinout tables.

What is the maximum block RAM capacity of XCV1600E-7BG560I and how is it structured?

XCV1600E-7BG560I provides 589,824 bits of block RAM, organized as 144 independent 4096-bit true dual-port memory blocks. Each block supports simultaneous read/write on separate ports with configurable data widths (1–36 bits per port), enabling efficient FIFOs, frame buffers, or lookup tables. This structure is distinct from distributed RAM (497,664 bits) implemented in CLB LUTs and optimized for shallow, wide-access patterns.