AMD XCV1600E-7FG1156C

Overview

XCV1600E-7FG1156C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.19 million system gates, 34,992 logic cells, and 724 user I/O pins in an 1156-ball fine-pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 589.8 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV1600E-7FG1156C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic platform for telecom line cards, video processing pipelines, and protocol bridging where deterministic timing, multi-standard I/O, and embedded memory bandwidth are critical.

Technical Context

The XCV1600E-7FG1156C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-organized across eight voltage-defined I/O banks. Each bank requires shared VCCO and, where applicable, a single VREF; input buffers for LVTTL/LVCMOS/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage I/O operation within bank constraints.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV1600E-7FG1156C, the XCV2000E-7FG1156C provides headroom for logic expansion while maintaining compatibility, whereas the XCV1600E-8FG1156C delivers improved timing closure at the cost of stricter power delivery and thermal design requirements.

Availability

XCV1600E-7FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial motion controllers, and protocol bridge modules requiring stable component supply over extended production lifecycles.

Supply support for XCV1600E-7FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as its flagship high-performance programmable logic platform for demanding system-level applications.

The Virtex-E product line was engineered to deliver evolutionary improvements over Virtex-higher density, lower 1.8 V core voltage, enhanced I/O flexibility, and integrated DLLs-targeting wireline communications, video processing, and high-end embedded computing.

FAQ

What is the maximum LVDS data rate supported by the XCV1600E-7FG1156C?

The XCV1600E-7FG1156C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and the SelectI/O+™ feature list. This rate applies to source-synchronous interfaces using dedicated differential I/O pairs; actual achievable throughput depends on PCB layout quality, termination, and clock stability. The XCV1600E-7FG1156C achieves this via calibrated I/O drivers and DLL-assisted clock recovery.

Does the XCV1600E-7FG1156C support true dual-port block RAM?

Yes, the XCV1600E-7FG1156C includes 144 block RAM units, each configured as a true dual-port 4096-bit synchronous RAM with independent address, write-enable, and clock signals per port. This capability is documented in DS022-2 Module 2, Table 4 and Figure 6, enabling simultaneous read and write operations without contention-critical for video frame buffering and FIFO implementations in the XCV1600E-7FG1156C.

How many digital DLLs does the XCV1600E-7FG1156C integrate?

The XCV1600E-7FG1156C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in the Features section of DS022-1 and confirmed in the Virtex-E Compared to Virtex Devices summary. These DLLs provide clock multiply/divide, zero-delay conversion of LVPECL/LVDS inputs, and 50% duty-cycle synthesis for DDR applications-key timing resources in the XCV1600E-7FG1156C architecture.

Is the XCV1600E-7FG1156C pin-compatible with other Virtex-E devices in the FG1156 package?

The XCV1600E-7FG1156C shares the FG1156 package footprint and pinout with XCV2000E-7FG1156C and XCV2600E-7FG1156C, as verified in DS022-1 Table 3 and Module 4 pinout diagrams. However, I/O bank assignments and VCCO/VREF pin allocations differ across densities; direct substitution requires validation of power delivery and signal integrity for unused pins in smaller devices.

What I/O standards are supported by the XCV1600E-7FG1156C's SelectI/O+™ technology?

The XCV1600E-7FG1156C supports 20 I/O standards via SelectI/O+™, including LVTTL, LVCMOS2, LVCMOS18, SSTL3/I-II, SSTL2/I-II, HSTL/I-III-IV, GTL/GTL+, CTT, AGP-2X, PCI33_3, PCI66_3, BLVDS, LVDS, and LVPECL. These are listed in DS022-2 Table 1 and enabled through bank-specific VCCO and optional VREF configuration-core interoperability features of the XCV1600E-7FG1156C.