AMD XCV1600E-7FG860C

Overview

XCV1600E-7FG860C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.19 million system gates, 34,992 logic cells, and 724 user I/O pins in an 860-ball Fine-Pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 589.8 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV1600E-7FG860C datasheet, pinout, applications, or equivalent options, this device is selected for designs requiring >240 MHz synchronous system clocking, differential I/O bandwidth >100 Gb/s, and reconfigurable logic density exceeding 400 k logic cells - particularly in protocol bridging, packet processing, and FPGA-based DSP acceleration.

Technical Context

The XCV1600E-7FG860C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-organized across eight voltage-banked I/O groups. Each bank requires shared VCCO and, where applicable, a single VREF; input buffers for LVTTL/LVCMOS/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage I/O operation within bank constraints.

Key Specifications

Pinout & Package

Package: 860-ball Fine-Pitch Ball Grid Array (FG860), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XCV1600E-7FG860C, the -8 variant delivers measurable timing margin improvement without layout change, while the XCV2000E-7FG860C offers headroom for logic growth but increases cost and power - both remain pin-compatible and bitstream-incompatible with Virtex-E family constraints.

Availability

XCV1600E-7FG860C is available at Aetrix Electronics and suitable for telecom infrastructure, test instrumentation, and medical imaging systems requiring stable component supply, long-lifecycle support, and traceable sourcing for Class B industrial deployments.

Supply support for XCV1600E-7FG860C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in wireline communications and signal processing - emphasizing I/O bandwidth, clock management, and memory hierarchy over raw gate count alone.

FAQ

What is the maximum supported LVDS data rate for XCV1600E-7FG860C?

The XCV1600E-7FG860C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and DS022-2 Section "Differential Signalling Support". This rate applies to point-to-point links using dedicated differential I/O pairs (IO_LxxN/P) with proper PCB impedance control and termination. The 622 Mb/s capability aligns with OC-12/STM-4 SONET/SDH line rates and enables direct interface with common SerDes PHYs without external retiming.

Does XCV1600E-7FG860C support true dual-port block RAM?

Yes, XCV1600E-7FG860C includes 144 block SelectRAM units, each providing true dual-port 4096-bit RAM with independent address, data, and control lines per port. As specified in DS022-2 Table 4 and Figure 6, this allows simultaneous read and write operations at different addresses - essential for applications like asynchronous FIFOs, video frame buffers, and ping-pong memory architectures without arbitration logic.

Is XCV1600E-7FG860C pin-compatible with other Virtex-E devices in FG860 packaging?

XCV1600E-7FG860C shares the FG860 package footprint with XCV2000E-7FG860C and XCV2600E-7FG860C, and is pin-compatible per DS022-1 Module 1 ("The same device in the same package for the Virtex-E and Virtex families are pin-compatible with some minor exceptions"). However, it is not pin-compatible with smaller Virtex-E devices (e.g., XCV600E) in FG860, as I/O count and ball assignments differ - verified via DS022-4 Pinout Tables.

What are the VCCO requirements for mixing LVTTL and LVDS outputs on XCV1600E-7FG860C?

LVTTL outputs require VCCO = 3.3 V; LVDS outputs require VCCO = 2.5 V. Because these standards demand different VCCO voltages, they cannot be placed in the same I/O bank. Per DS022-2 Table 2 and "I/O Banking" section, LVTTL and LVDS must be assigned to separate banks - e.g., Bank 0 for LVTTL (3.3 V), Bank 1 for LVDS (2.5 V) - with corresponding VCCO and no shared VREF.

Can XCV1600E-7FG860C be configured via JTAG after power-up?

Yes, XCV1600E-7FG860C supports IEEE 1149.1 boundary-scan configuration in JTAG mode, as stated in DS022-1 Module 1 ("SRAM-Based In-System Configuration") and DS022-2 Section "Input/Output Block". JTAG enables programming, debugging, and verification without requiring external PROMs - ideal for lab validation and field updates. Configuration occurs through TDI/TDO/TCK/TMS pins, with TCK supporting up to 25 MHz per DS022-3 timing specs.