AMD XCV1600E-8BG560C

Overview

XCV1600E-8BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 419,904 logic cells, 72 × 108 CLB array, and 589,824 bits of synchronous block RAM. It supports up to 404 user I/Os in a 560-ball BGA package, features eight digital Delay-Locked Loops (DLLs), and delivers internal performance up to 130 MHz (four LUT levels) for high-density digital signal processing and communication infrastructure applications.

For engineers reviewing the XCV1600E-8BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -8 speed grade (130 MHz internal, 240 MHz system clock), 1.8 V core voltage with 3.3 V I/O tolerance, LVDS/LVPECL differential signaling support up to 622 Mb/s, and compatibility with PCI 33/66 MHz interfaces.

Technical Context

The XCV1600E-8BG560C implements a flexible architecture built on a 0.18 μm 6-layer metal CMOS process, featuring configurable logic blocks (CLBs) with four LCs per slice, dedicated carry logic for arithmetic, and dual-port block RAM. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication - enabling precise timing control across high-speed I/O standards including LVDS, BLVDS, and LVPECL.

Each IOB supports independent input/output flip-flops with programmable delay, synchronous/asynchronous set/reset, and configurable drive strength (up to 24 mA source / 48 mA sink). I/O banking enforces VCCO/VREF grouping: all 404 user I/Os are distributed across eight banks, with bank-specific voltage constraints governing mixed-standard operation (e.g., LVTTL and SSTL3 I both require 3.3 V VCCO).

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, thermal performance optimized for industrial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV1600E-8BG560C, the -7 variant trades 5 MHz internal speed for lower static power, while the XCV2000E-8BG560C adds 23% more logic cells and 11% more block RAM within identical mechanical and thermal constraints - enabling scalable design reuse across product tiers.

Availability

XCV1600E-8BG560C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial automation, and broadcast video equipment requiring stable component supply across extended production lifecycles.

Supply support for XCV1600E-8BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for adaptive computing solutions.

The Virtex-E family was designed for high-performance, high-density system-on-chip replacements in wired/wireless infrastructure, delivering 30% higher speed and 1.8 V core efficiency versus prior Virtex generations.

FAQ

What is the maximum differential I/O pair count supported by XCV1600E-8BG560C?

XCV1600E-8BG560C supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability enables high-bandwidth serial links such as LVDS camera interfaces or backplane interconnects without external serializers. The 344 pairs are distributed across eight I/O banks, with bank-specific VCCO and VREF constraints applying to differential standard usage.

Does XCV1600E-8BG560C support 5 V tolerant I/Os?

XCV1600E-8BG560C does not natively support 5 V tolerant I/Os. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as stated in the "Virtex-E Compared to Virtex Devices" section of DS022-1. PCI 5 V operation is explicitly unsupported, and no internal clamping diodes connect to 5 V rails.

How many Delay-Locked Loops (DLLs) are integrated in XCV1600E-8BG560C?

XCV1600E-8BG560C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in the Features section of DS022-1 and confirmed in the "Virtex-E Compared to Virtex Devices" comparison table. Each DLL supports clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS inputs - enabling independent clock domain management for multiple high-speed peripherals.

Is XCV1600E-8BG560C pin-compatible with earlier Virtex family devices?

XCV1600E-8BG560C is not pin-compatible with earlier Virtex family devices. While the same package (BG560) may host equivalent Virtex devices, the Virtex-E family has different banking rules, VCCO/VREF pin assignments, and I/O buffer power domains (VCCO instead of VCCINT for LVTTL/LVCMOS inputs). DS022-1 explicitly states "The Virtex-E family is not bitstream-compatible with the Virtex family" and notes minor pin exceptions even within same-package comparisons.

What is the block RAM configuration capability of XCV1600E-8BG560C?

XCV1600E-8BG560C contains 144 block SelectRAM units, each providing 4096 bits of true dual-port synchronous RAM. As documented in Table 4 of DS022-2 (v2.8), this yields 589,824 total block RAM bits. Each block supports independent data width configuration per port (e.g., 36-bit write / 18-bit read), enabling efficient bus-width conversion and frame buffering without external memory.