AMD XCV2000E-6BG560C

Overview

XCV2000E-6BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 2.54 million system gates, 43,200 logic cells in an 80 × 120 CLB array, and 804 user I/O pins in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing.

For engineers reviewing the XCV2000E-6BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade–specific performance limits for production design validation.

Technical Context

The XCV2000E-6BG560C implements a regular FPGA architecture with configurable logic blocks (CLBs) containing four 4-input LUTs per slice, dedicated carry chains for arithmetic, and dual flip-flop/latch storage elements per IOB. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - all operating at –6 speed grade with 4.3 ns register-to-register delay.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only when sharing VCCO (e.g., LVTTL + PCI33_3), while LVDS/LVPECL require 2.5 V/3.3 V VCCO and no VREF. Block RAM columns are placed every 12 CLB columns starting at column 0, with 160 total 4096-bit dual-port blocks distributed across the die.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, thermal pad optional. Dimensions: 35 mm × 35 mm, 1.55 mm height. Compatible with standard reflow profiles for Pb-free assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV2000E-6BG560C, the –7 variant improves worst-case timing by 12% at identical voltage/temperature, while XCV2600E-6BG560C extends logic capacity by 33% within the same package - both retain full toolchain compatibility with Xilinx Foundation and Alliance Series software.

Availability

XCV2000E-6BG560C is available at Aetrix Electronics and suitable for high-speed communications backplanes, radar signal processing units, industrial machine vision controllers, and medical imaging data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for XCV2000E-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for reconfigurable computing.

The Virtex-E family was designed for high-performance system-level integration in telecommunications, defense, and scientific instrumentation - delivering optimized place-and-route efficiency and 0.18 μm process advantages over prior Virtex generations.

FAQ

What is the maximum LVDS data rate supported by XCV2000E-6BG560C?

XCV2000E-6BG560C supports LVDS signaling at up to 622 Mb/s per differential pair, as confirmed in DS022-1 Table 2 and validated by its DLL-assisted clock recovery capability. This rate applies to both input and output directions and is guaranteed under –6 speed grade conditions with proper termination and layout. The device uses dedicated differential I/O circuitry with matched trace-length routing resources to maintain signal integrity at this speed.

Does XCV2000E-6BG560C support true dual-port block RAM operation?

Yes, XCV2000E-6BG560C supports true dual-port block RAM operation across all 160 SelectRAM blocks. Each 4096-bit block allows independent read/write access on two ports with separate address, data, and control lines - enabling concurrent data ingestion and processing in applications like video frame buffering. This capability is documented in DS022-2 Module 2, Figure 6 and Table 4.

How many global clock inputs does XCV2000E-6BG560C have, and what standards do they accept?

XCV2000E-6BG560C has eight dedicated global clock inputs (GCLK0–GCLK7), each capable of accepting LVPECL or LVDS signals up to 300+ MHz. These pins feed directly into the DLLs for zero-delay deskew and frequency synthesis. They are not general-purpose I/Os and cannot be used for data transfer - their sole function is high-fidelity clock distribution, as specified in DS022-2 Section "Clock DLLs".

Is XCV2000E-6BG560C pin-compatible with other Virtex-E devices in the BG560 package?

XCV2000E-6BG560C is pin-compatible with XCV1000E-6BG560C, XCV1600E-6BG560C, and XCV2600E-6BG560C in the same BG560 package, as confirmed in DS022-1 Module 1, Table 3 and DS022-4 pinout documentation. However, I/O banking assignments and VCCO/VREF pin allocations differ across densities - requiring careful review of bank-specific voltage planning before migration.

What is the role of the die-temperature sensor diode in XCV2000E-6BG560C?

The die-temperature sensor diode in XCV2000E-6BG560C provides calibrated on-chip thermal monitoring with ±3°C accuracy, enabling real-time junction temperature tracking for thermal management. It connects to external ADC circuitry via dedicated analog pins and is used in closed-loop fan control or clock throttling schemes - a feature explicitly listed in DS022-1 Module 1 "Features" section.