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AMD XCV2000E-6BG560I
- Part No.:
- XCV2000E-6BG560I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV2000E-6BG560I.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,386
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Product details
Overview
XCV2000E-6BG560I from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 2.54 million system gates, 43,200 logic cells, and 804 user I/Os in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.
For engineers reviewing the XCV2000E-6BG560I datasheet, pinout, applications, or equivalent options, this device is selected for demanding applications requiring deterministic clock management, high-bandwidth I/O, and reconfigurable logic at industrial temperature range (–40°C to +100°C).
Technical Context
The XCV2000E-6BG560I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice.
Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×. I/O banking enforces VCCO- and VREF-based voltage domain separation across eight banks, supporting mixed standards including SSTL, HSTL, LVCMOS18/25, and differential LVDS/LVPECL on shared pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 2.54 M - defines total logic capacity for large-scale digital systems |
| Logic Cells | 43,200 - provides granular, routable logic resources for complex RTL implementation |
| User I/O Pins | 804 - enables high-pin-count interface consolidation (e.g., memory buses, SerDes parallel lanes) |
| Block RAM Bits | 655,360 - supports >100 kB of true dual-port synchronous memory for buffering and dataflow acceleration |
| DLL Count | 8 - allows independent clock domain management for multi-clock subsystems (e.g., PCIe PHY + MAC + processor) |
| Max I/O Speed | 622 Mb/s (LVDS) - meets source-synchronous timing for high-speed ADC/DAC interfaces and optical line cards |
| Internal Performance | 130 MHz (4-LUT levels) - delivers predictable timing closure for pipelined datapaths in DSP and packet processing |
| Supply Voltage | VCCINT = 1.8 V - reduces dynamic power vs. 2.5 V Virtex, critical for thermally constrained telecom modules |
Pinout & Package
Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, industrial temperature grade (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Dedicated Global Clock Inputs | Low-skew clock distribution inputs tied directly to DLLs; enable synchronous multi-domain timing control |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; decoupling required per Xilinx layout guidelines |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Independent 1.5–3.3 V supplies per bank; define output voltage and input threshold compatibility |
| VREF_0–VREF_7 | I/O Reference Voltage Inputs | Provide threshold reference for SSTL/HSTL/LVCMOS inputs; must be stable and filtered per bank |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for configuration, debug, and in-system verification |
| PROGRAM_B / INIT_B / DONE | Configuration Control Signals | Asynchronous reset, configuration status, and completion handshake for master serial or SelectMAP mode |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, SSTL3, HSTL, PCI, LVCMOS) with per-bank VCCO/VREF control |
| SelectRAM+™ Memory Hierarchy | 655,360-bit true dual-port block RAM + 614,400-bit distributed RAM enables concurrent read/write with no arbitration overhead |
| SelectLink™ DDR Interconnect | Hardened DDR-capable routing paths between CLBs and block RAM reduce skew and simplify high-speed memory controller design |
| Digital DLL Clock Management | Eight DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock input support eliminate external clock ICs |
| Die-Temperature Sensor Diode | On-die thermal diode enables real-time junction temperature monitoring for thermal throttling in fanless systems |
| SRAM-Based In-System Reconfiguration | Unlimited reprogramming via JTAG or SelectMAP; supports partial reconfiguration for dynamic function swapping |
Applications
| Wireless Baseband Processing | Optical Transport Line Card |
|---|---|
Use Scenario: Real-time channel coding, FFT, and modulation/demodulation in 3G/4G LTE base stations. IC Role / Device Role / Timing Role: Programmable datapath accelerator implementing custom PHY-layer algorithms with deterministic latency. Use Value: 43,200 logic cells and 655,360-bit block RAM enable full 2048-point FFT pipeline with on-chip coefficient storage and dual-port access. |
Use Scenario: SONET/SDH framer, mapping engine, and forward error correction (FEC) in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: High-speed parallel-to-serial converter interfacing to 10 Gb/s optical transceivers via LVDS I/O. Use Value: 622 Mb/s LVDS I/O and eight DLLs support precise 155.52 MHz/622.08 MHz clock domain bridging with sub-nanosecond jitter tolerance. |
| Industrial Machine Vision Controller | High-Performance Test Equipment |
Use Scenario: Real-time image preprocessing (edge detection, histogram equalization) and ROI extraction in automated inspection systems. IC Role / Device Role / Timing Role: Reconfigurable vision coprocessor synchronizing camera sensor interface, frame buffer, and PCIe host transfer. Use Value: 804 I/Os allow direct connection to multiple CMOS image sensors and DDR SDRAM; 1.8 V core reduces thermal load in sealed enclosures. |
Use Scenario: Pattern generation, response analysis, and protocol validation in ATE platforms for ASIC and SoC testing. IC Role / Device Role / Timing Role: High-fidelity vector generator with precise timing control for multi-MHz digital stimulus and capture. Use Value: Eight DLLs and 130 MHz internal performance enable <1 ns setup/hold margin for 100+ MHz test vectors with programmable delays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV2000E-7BG560I | Higher speed grade (–7 vs –6): 10–15% faster timing closure; same pinout, package, and feature set | Suitable for designs requiring tighter hold time margins or higher clock frequencies beyond 130 MHz | Select when timing closure fails at –6 grade or when targeting >140 MHz system clocks |
| XCV2600E-6BG560I | Higher density (3.26 M gates, 57,132 logic cells); identical BG560 package and I/O count but larger die | Required for designs exceeding 43,200 logic cells or needing >753,664 block RAM bits | Choose only if logic utilization exceeds 90% on XCV2000E-6BG560I; no PCB change needed due to pin compatibility |
Compared with XCV2000E-6BG560I, the –7 variant improves timing margin without altering power or thermal behavior, while the XCV2600E-6BG560I offers headroom for logic expansion within the same footprint-both retain identical I/O banking rules and DLL functionality.
Availability
XCV2000E-6BG560I is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, industrial automation, and high-end test equipment requiring stable component supply over extended product lifecycles.
Supply support for XCV2000E-6BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions since 1984.
The Virtex-E family was designed specifically for high-performance, high-bandwidth communication and computing applications where reconfigurability, I/O flexibility, and deterministic timing are critical.
FAQ
What is the maximum operating temperature range for the XCV2000E-6BG560I?
The XCV2000E-6BG560I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is confirmed in the DS022-1 Production Product Specification revision 2.3, and applies to all BG560-package Virtex-E devices with 'I' suffix. Thermal design must ensure die temperature remains within this limit under worst-case power dissipation.
Does the XCV2000E-6BG560I support LVDS I/O at 622 Mb/s bidirectionally?
Yes, the XCV2000E-6BG560I supports LVDS signaling at up to 622 Mb/s in input, output, and bidirectional modes per the DS022-1 datasheet. Its IOBs include matched delay elements and differential termination controls, enabling reliable source-synchronous LVDS interfaces without external components.
How many block RAMs does the XCV2000E-6BG560I contain, and what is their configuration capability?
The XCV2000E-6BG560I contains 160 block SelectRAM units totaling 655,360 bits. Each block is a true dual-port 4096-bit RAM with independently configurable data widths per port (1–36 bits), enabling built-in bus-width conversion and simultaneous read/write operations without arbitration logic.
Is the XCV2000E-6BG560I pin-compatible with other Virtex-E devices in the BG560 package?
Yes, the XCV2000E-6BG560I shares identical pinout and ball assignment with XCV600E-6BG560I, XCV1000E-6BG560I, and XCV1600E-6BG560I per Table 3 in DS022-1 Module 1. All use the same BG560 mechanical footprint and I/O banking structure, enabling scalable FPGA selection on fixed PCBs.
What configuration modes are supported by the XCV2000E-6BG560I?
The XCV2000E-6BG560I supports master serial (via external PROM), slave serial, SelectMAP™ parallel (up to 8-bit wide), and IEEE 1149.1 JTAG boundary-scan configuration. Configuration bitstream loading is SRAM-based and volatile, requiring reload on power-up unless paired with nonvolatile configuration memory.
XCV2000E-6BG560I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9600
- Number of Logic Elements/Cells:
- 43200
- Total RAM Bits:
- 655360
- Number of I/O:
- 404
- Number of Gates:
- 2541952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV2000E-6BG560I FAQ
1.How can I place an order for XCV2000E-6BG560I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV2000E-6BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV2000E-6BG560I reliable?
The price and inventory of XCV2000E-6BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV2000E-6BG560I is usually 5 days.
3.What payment methods are accepted for XCV2000E-6BG560I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV2000E-6BG560I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV2000E-6BG560I?
XCV2000E-6BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV2000E-6BG560I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV2000E-6BG560I?
For technical support, including XCV2000E-6BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV2000E-6BG560I requirements.
6.How does Aetrix verify that XCV2000E-6BG560I is sourced from the original manufacturer or authorized distributors?
All XCV2000E-6BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV2000E-6BG560I meets industry standards.
7.What is the process for return or replacement of XCV2000E-6BG560I?
All XCV2000E-6BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV2000E-6BG560I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV2000E-6BG560I part is unused and in its original packaging.
Return procedure for XCV2000E-6BG560I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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