AMD XCV2000E-6FG1156C

Overview

XCV2000E-6FG1156C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.54 million system gates, 43,200 logic cells, and 804 user I/O pins in an 1156-ball fine-pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV2000E-6FG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include internal clock performance (130 MHz, four LUT levels), differential I/O count (344 pairs), 0.18 μm 6-layer metal process, 1.8 V core voltage (VCCINT), and support for true dual-port block RAM at 250 MHz.

Technical Context

The XCV2000E-6FG1156C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.

Its IO subsystem supports 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and shared VREF. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV2000E-6FG1156C, the -7 variant improves worst-case timing margin without layout changes, while the XCV2600E-6 offers scalable logic capacity within identical mechanical and I/O constraints-enabling design reuse across performance tiers.

Availability

XCV2000E-6FG1156C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, medical imaging systems, defense radar signal processing, and industrial protocol bridging requiring stable component supply over extended production lifecycles.

Supply support for XCV2000E-6FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density digital systems demanding advanced I/O flexibility, integrated memory, and deterministic clock management-targeting communications, test equipment, and aerospace applications.

FAQ

What is the maximum differential I/O bandwidth supported by the XCV2000E-6FG1156C?

The XCV2000E-6FG1156C supports up to 344 differential I/O pairs, enabling >100 Gb/s aggregate bandwidth when operating at LVDS speeds of 622 Mb/s per pair. This bandwidth is realized through bank-isolated routing and matched trace length requirements defined in the Virtex-E Pinout Tables (DS022-4). The FG1156 package provides sufficient ball count and signal integrity for full utilization of this capability.

Does the XCV2000E-6FG1156C support true dual-port block RAM operation?

Yes, the XCV2000E-6FG1156C includes 160 block RAM modules totaling 655,360 bits, each configured as true dual-port synchronous RAM with independent address, data, and control lines per port. This allows simultaneous read and write operations at up to 250 MHz, enabling applications such as FIFOs, ping-pong buffering, and bus-width conversion without external memory.

Can the XCV2000E-6FG1156C be used in PCI 66 MHz systems?

Yes, the XCV2000E-6FG1156C is fully compliant with 3.3 V PCI specifications for both 33 MHz and 66 MHz operation. Its I/O banks support PCI33_3 and PCI66_3 standards with 16 mA drive strength and fast slew rate control. The device meets timing requirements including tVAL, tSD, and tHD without external components when powered at VCCO = 3.3 V.

How many digital DLLs does the XCV2000E-6FG1156C integrate, and what are their key capabilities?

The XCV2000E-6FG1156C integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply (up to 4×), divide, 50% duty cycle correction for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard. DLL outputs feed global clock networks with sub-nanosecond skew across the die.

Is the XCV2000E-6FG1156C pin-compatible with other Virtex-E devices in the FG1156 package?

Yes, the XCV2000E-6FG1156C shares identical pinout and package dimensions with XCV2600E-6FG1156C and XCV3200E-6FG1156C per DS022-4 Pinout Tables. All three devices use the same FG1156 mechanical footprint, power pin allocation, and I/O bank structure-enabling hardware reuse across density tiers without PCB revision.