AMD XCV2000E-6FG1156I

Overview

XCV2000E-6FG1156I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.54 million system gates, 43,200 logic cells, and 804 user I/O pins in an 1156-ball fine-pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communications infrastructure and embedded signal processing.

For engineers reviewing the XCV2000E-6FG1156I datasheet, pinout, applications, or equivalent options, this device delivers verified timing performance up to 240 MHz system clock rate, 130 MHz internal logic speed (four LUT levels), and differential I/O bandwidth exceeding 100 Gb/s - critical for FPGA-based protocol bridging, real-time video processing, and reconfigurable computing platforms.

Technical Context

The XCV2000E-6FG1156I implements a regular array architecture of configurable logic blocks (CLBs) and input/output blocks (IOBs), interconnected by a hierarchical programmable routing matrix optimized for place-and-route efficiency. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its IO subsystem features SelectI/O+™ technology with banked VCCO and VREF support across eight I/O banks, enabling concurrent use of LVTTL, SSTL, HSTL, LVDS, and LVPECL standards on a single device. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - all operating at 1.8 V core voltage with 3.3 V I/O tolerance.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV2000E-6FG1156I, the -7 variant improves timing headroom without layout changes, while the XCV2600E-6FG1156I adds logic and memory headroom at identical footprint - both preserve JTAG configuration, I/O banking rules, and DLL usage models.

Availability

XCV2000E-6FG1156I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial machine vision applications requiring stable component supply over extended product lifecycles.

Supply support for XCV2000E-6FG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance alternatives to ASICs, emphasizing silicon efficiency, routing flexibility, and system-level integration.

The Virtex-E product line was designed specifically for applications demanding higher speed, greater I/O bandwidth, and lower power than prior Virtex devices - targeting next-generation communications, video, and signal processing systems.

FAQ

What is the maximum supported LVDS data rate for XCV2000E-6FG1156I?

The XCV2000E-6FG1156I supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and validated by its differential I/O architecture with matched trace routing support. This rate satisfies OC-12/STM-4 serial interface requirements and is achievable using the device's built-in LVDS I/O buffers without external level shifters or terminators beyond standard 100 Ω differential pairs.

Is XCV2000E-6FG1156I pin-compatible with other Virtex-E devices in the FG1156 package?

Yes, XCV2000E-6FG1156I shares identical FG1156 mechanical dimensions and ball map with XCV2600E-6FG1156I and XCV3200E-6FG1156I, including identical placement of VCCINT, VCCO, GCLK, and JTAG pins. However, unused balls differ per device density, and I/O bank assignments must be verified against Module 4 pinout tables to ensure signal integrity compliance.

How many DLLs does XCV2000E-6FG1156I include, and what clock frequencies do they support?

XCV2000E-6FG1156I integrates eight fully digital Delay-Locked Loops (DLLs), each capable of clock multiply (up to 4×), divide, and duty-cycle correction. They accept LVPECL or LVDS reference inputs up to 300+ MHz and generate zero-delay outputs across all I/O standards - enabling simultaneous DDR memory interfaces, high-speed SERDES, and multi-domain system clocks.

Does XCV2000E-6FG1156I support partial reconfiguration?

XCV2000E-6FG1156I supports partial reconfiguration through its SRAM-based configuration architecture and JTAG/SelectMAP interfaces, but requires external controller logic and bitstream partitioning using Xilinx Foundation or Alliance Series tools. The device itself provides no native hardware support for runtime module swapping - all reconfiguration is full or frame-based, not true dynamic partial.

What is the block RAM organization in XCV2000E-6FG1156I?

XCV2000E-6FG1156I contains 160 block SelectRAM units, each providing 4096 bits of true dual-port synchronous RAM. These blocks are arranged in columns adjacent to CLB arrays, supporting independent read/write operations at up to 200 MHz with configurable data widths (1–36 bits per port) - delivering 1.66 Tb/s aggregate memory bandwidth as measured in DS022-1 Section 1.