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AMD XCV2000E-6FG680C
- Part No.:
- XCV2000E-6FG680C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 680-LBGA Exposed Pad
- Datasheet:
-
XCV2000E-6FG680C.pdf
- Description:
- IC FPGA 512 I/O 680FTEBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,035
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Product details
Overview
XCV2000E-6FG680C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 43,200 logic cells, 804 user I/Os, and eight digital Delay-Locked Loops (DLLs), designed for high-speed synchronous systems up to 240 MHz and source-synchronous data transmission at 622 Mb/s in telecom and test equipment interfaces.
For engineers reviewing the XCV2000E-6FG680C datasheet, pinout, applications, or equivalent options, this device supports LVDS, LVPECL, and HSTL I/O standards, features true dual-port block RAM (655,360 bits), and delivers internal performance up to 130 MHz across four LUT levels - critical for DDR interface design, protocol bridging, and real-time signal processing.
Technical Context
The XCV2000E-6FG680C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×; I/O banks support mixed voltage standards (VCCO = 1.5 V to 3.3 V) with bank-specific VREF requirements, and all IOBs include IEEE 1149.1 boundary-scan logic and ESD protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,200 - defines maximum combinational and sequential logic capacity for complex state machines and datapaths. |
| User I/O Pins | 804 - supports high-bandwidth parallel interfaces including 64-bit PCI, DDR SDRAM, and multi-channel LVDS links. |
| Block RAM Bits | 655,360 - enables 160 × 4096-bit true dual-port memory blocks for simultaneous read/write operations in FIFOs and buffering. |
| Internal Performance | 130 MHz (4-LUT level) - guarantees timing closure for deeply pipelined arithmetic and control logic without manual retiming. |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., separate DDR, LVDS, and system clocks). |
| Process Technology | 0.18 μm, 6-layer metal CMOS - enables lower dynamic power and higher gate density versus prior Virtex families. |
| Supply Voltage (VCCINT) | 1.8 V - reduces core power consumption by ~30% vs. 2.5 V Virtex, critical for thermally constrained embedded systems. |
Pinout & Package
Package: Fine Pitch Ball Grid Array (FG680) with 680 solder balls, 1.0 mm pitch, RoHS-compliant, thermal pad option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Dedicated global clock inputs | Low-skew routing to all DLLs and CLBs; required for synchronous timing-critical designs. |
| VCCINT | Core logic supply | 1.8 V input powering CLBs, RAM, and routing; must be decoupled within 1 cm of each pin pair. |
| VCCO_0–VCCO_7 | I/O bank power supplies | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O (e.g., HSTL + LVTTL on same device). |
| VREF_0–VREF_7 | I/O threshold reference | Required for SSTL/HSTL/GTL inputs; each bank uses one shared VREF voltage for all input buffers. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables in-system configuration, debug, and production testing per IEEE 1149.1. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, HSTL, SSTL) with 622 Mb/s differential signaling - eliminates external level shifters in high-speed serial links. |
| SelectRAM+™ Memory Hierarchy | 655,360 bits block RAM + 614,400 bits distributed RAM - enables on-chip protocol engines with deep packet buffering and dual-clock domain bridging. |
| SelectLink™ DDR Interface | Hardened DDR I/O path with DLL-synchronized capture - achieves reliable 200 Mb/s DDR SDRAM interfacing without external PHY. |
| Digital DLL Clock Management | Eight independent DLLs with 4× multiplication and duty-cycle correction - replaces external clock synthesizers in multi-clock domain systems. |
| IEEE 1149.1 Boundary Scan | Fully compliant JTAG TAP controller integrated into IOBs - enables PCB-level interconnect testing and in-field reconfiguration. |
Applications
| Telecom Line Card Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time packet classification and header modification in OC-48/STM-16 line cards. IC Role / Device Role / Timing Role: Programmable logic fabric implementing custom parser, classifier, and rewrite engines with deterministic latency. Use Value: 804 I/Os enable parallel 16-bit SerDes framing interfaces; 130 MHz internal speed ensures sub-100 ns packet processing latency. |
Use Scenario: Multi-channel digital pattern generation and acquisition in ATE platforms. IC Role / Device Role / Timing Role: Timing controller and data formatter synchronizing >32 channels at 200+ MHz using DLL-locked clocks. Use Value: Eight DLLs allow independent phase alignment per channel group; LVDS I/O supports 622 Mb/s vector rates. |
| PCI Express Bridge Logic | Medical Imaging Data Pipeline |
Use Scenario: Protocol translation between legacy PCI and PCIe endpoints in diagnostic imaging subsystems. IC Role / Device Role / Timing Role: Configurable bridge ASIC handling address mapping, transaction splitting, and error reporting. Use Value: 32/64-bit 33/66 MHz PCI compliance plus 1.8 V core reduces power in fanless enclosures; 655 kbit block RAM buffers burst transfers. |
Use Scenario: Real-time preprocessing of ultrasound beamformed data before GPU transfer. IC Role / Device Role / Timing Role: High-throughput FIR filter bank and pixel interpolation engine operating on 16-bit parallel streams. Use Value: Dedicated carry logic accelerates 16-tap filters; distributed RAM provides 614 kbit of low-latency coefficient storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV2000E-7FG680C | Higher speed grade (-7 vs. -6): 10% faster internal timing (e.g., 143 MHz vs. 130 MHz register-to-register), identical pinout and feature set. | Suitable for designs requiring margin in worst-case temperature/voltage corners or tighter setup/hold slack. | Select when timing closure fails at -6 grade or when targeting 240 MHz system clock with aggressive I/O timing. |
| XCV2600E-6FG680C | Higher density (57,132 logic cells vs. 43,200), same FG680 package, 804 I/Os, but larger die area and higher static power. | Better suited for designs needing >20% more logic resources while retaining identical board layout and I/O constraints. | Choose when migrating from XCV2000E-6FG680C to accommodate additional IP cores without PCB redesign. |
Compared with XCV2000E-6FG680C, the -7 variant offers guaranteed timing headroom without hardware change, while the XCV2600E-6FG680C provides scalable logic capacity within the same footprint - both preserve full toolchain compatibility with Xilinx Foundation and Alliance Series tools.
Availability
XCV2000E-6FG680C is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, medical imaging, and industrial protocol gateway applications requiring stable component supply and long-term lifecycle support.
Supply support for XCV2000E-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, SoC, and adaptive compute acceleration platforms.
The Virtex-E family was engineered for high-performance, high-capacity reconfigurable computing in wireline communications, test instrumentation, and digital signal processing - emphasizing speed, I/O flexibility, and memory-rich architectures.
FAQ
What is the maximum system clock frequency supported by the XCV2000E-6FG680C?
The XCV2000E-6FG680C supports synchronous system clock rates up to 240 MHz including I/O paths, with internal logic performance rated at 130 MHz across four LUT levels. This is achieved using its eight digital DLLs for precise clock deskew and duty-cycle correction, enabling reliable operation in high-speed DDR and source-synchronous interfaces. The -6 speed grade specifies worst-case timing under commercial temperature conditions.
Does the XCV2000E-6FG680C support LVDS I/O, and what is the maximum data rate?
Yes, the XCV2000E-6FG680C supports LVDS I/O with a maximum data rate of 622 Mb/s, as confirmed in DS022-1 and DS022-2 documentation. It provides dedicated differential I/O pairs (up to 344 pairs) with matched trace routing support, and LVDS clock inputs capable of accepting 300+ MHz signals - essential for high-speed serial links in telecom and test equipment.
How many block RAMs does the XCV2000E-6FG680C contain, and what is their configuration capability?
The XCV2000E-6FG680C contains 160 block SelectRAM units totaling 655,360 bits, each configured as a true dual-port 4096-bit RAM. These blocks support independent data widths per port (e.g., 32-bit write / 64-bit read), built-in bus-width conversion, and dedicated routing to CLBs - enabling efficient FIFOs, frame buffers, and protocol translation engines without external memory.
Is the XCV2000E-6FG680C pin-compatible with other Virtex-E devices in the FG680 package?
Yes, the XCV2000E-6FG680C shares identical pinout and package dimensions with other Virtex-E devices offered in the FG680 package, including XCV1600E-6FG680C and XCV2600E-6FG680C. However, I/O bank assignments and VCCO/VREF pin usage vary by device density, so PCB design must verify bank-specific voltage and termination requirements per DS022-4 pinout tables.
What development tools support the XCV2000E-6FG680C, and is it still actively maintained?
The XCV2000E-6FG680C is fully supported by Xilinx Foundation Series™ and Alliance Series™ development systems, including synthesis, place-and-route, and bitstream generation. Though superseded by newer Virtex families, it remains in production status per DS022-1 v2.3 (July 2002), and legacy toolchains retain full compatibility - critical for sustaining long-lifecycle industrial and defense programs.
XCV2000E-6FG680C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 680-LBGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9600
- Number of Logic Elements/Cells:
- 43200
- Total RAM Bits:
- 655360
- Number of I/O:
- 512
- Number of Gates:
- 2541952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 680-FTEBGA (40x40)
XCV2000E-6FG680C FAQ
1.How can I place an order for XCV2000E-6FG680C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV2000E-6FG680C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV2000E-6FG680C reliable?
The price and inventory of XCV2000E-6FG680C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV2000E-6FG680C is usually 5 days.
3.What payment methods are accepted for XCV2000E-6FG680C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV2000E-6FG680C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV2000E-6FG680C?
XCV2000E-6FG680C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV2000E-6FG680C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV2000E-6FG680C?
For technical support, including XCV2000E-6FG680C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV2000E-6FG680C requirements.
6.How does Aetrix verify that XCV2000E-6FG680C is sourced from the original manufacturer or authorized distributors?
All XCV2000E-6FG680C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV2000E-6FG680C meets industry standards.
7.What is the process for return or replacement of XCV2000E-6FG680C?
All XCV2000E-6FG680C units undergo pre-shipment inspection (PSI). If there is an issue with XCV2000E-6FG680C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV2000E-6FG680C part is unused and in its original packaging.
Return procedure for XCV2000E-6FG680C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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