AMD XCV2000E-6FG680I

Overview

XCV2000E-6FG680I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.54 million system gates, 43,200 logic cells, and 804 user I/O pins in a 680-ball Fine-Pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV2000E-6FG680I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom line cards, radar signal processors, and industrial real-time control systems requiring deterministic timing, multi-standard I/O, and on-chip memory bandwidth exceeding 1.66 Tb/s.

Technical Context

The XCV2000E-6FG680I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix and VersaRing I/O routing. Each CLB contains four 4-input LUTs with dedicated carry chains, arithmetic XOR/AND logic, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-with banked VCCO/VREF management. Eight fully digital DLLs provide clock multiply/divide, zero-delay conversion of LVPECL/LVDS clocks, and 50% duty-cycle synthesis for DDR applications.

Key Specifications

Pinout & Package

Package: 680-ball Fine-Pitch Ball Grid Array (FG680), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV2000E-6FG680I, the -7 variant improves timing margin without changing layout, while XCV2600E-6FG680I retains pin compatibility but adds logic capacity-making both viable for design evolution, though neither is drop-in replaceable without recompilation and timing verification.

Availability

XCV2000E-6FG680I is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar, industrial motion control, and medical imaging systems requiring stable component supply over extended production lifecycles.

Supply support for XCV2000E-6FG680I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGAs and advanced development toolchains for high-performance digital design.

The Virtex-E family was designed for high-speed, high-density reconfigurable computing in applications demanding multi-gigabit I/O bandwidth, deterministic timing, and integrated memory-targeting telecom, aerospace, and industrial automation markets.

FAQ

What is the maximum supported LVDS data rate for XCV2000E-6FG680I?

The XCV2000E-6FG680I supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to both input and output operation and is achievable using source-synchronous architectures with proper PCB layout and termination. The -6 speed grade ensures timing compliance at this rate under worst-case industrial temperature conditions.

Does XCV2000E-6FG680I support true dual-port block RAM?

Yes, XCV2000E-6FG680I supports true dual-port block RAM, as documented in DS022-2 (v2.8) Section "Block SelectRAM". Each 4096-bit block allows independent read/write operations on two ports simultaneously, with configurable data widths (e.g., 256×16 on port A and 512×8 on port B). This capability is essential for FIFOs, ping-pong buffers, and memory-mapped peripherals in XCV2000E-6FG680I designs.

How many Delay-Locked Loops (DLLs) does XCV2000E-6FG680I integrate?

XCV2000E-6FG680I integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 (v2.3) "Features" section and confirmed in DS022-2 (v2.8) "Architectural Description". These DLLs provide clock multiply/divide, duty-cycle correction for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs-enabling independent clock domain management across XCV2000E-6FG680I's I/O banks and logic fabric.

Is XCV2000E-6FG680I pin-compatible with other Virtex-E devices in FG680 packaging?

XCV2000E-6FG680I shares the FG680 package footprint with XCV1600E-6FG680I and XCV2600E-6FG680I, but pin assignments differ due to increased I/O count and bank layout. DS022-4 (Pinout Tables) confirms that XCV2000E-6FG680I uses all 680 balls for I/O, VCCO, VREF, and power, whereas smaller Virtex-E devices leave certain balls as no-connect. Thus, XCV2000E-6FG680I is not pin-compatible with lower-density FG680 Virtex-E parts.

What I/O standards are supported by XCV2000E-6FG680I's SelectI/O+™ technology?

XCV2000E-6FG680I supports 20 I/O standards via SelectI/O+™, including LVTTL, LVCMOS18/25, SSTL3/I-II, SSTL2/I-II, HSTL I/III/IV, GTL/GTL+, CTT, AGP-2X, PCI33_3, PCI66_3, BLVDS, LVDS, and LVPECL. DS022-2 (v2.8) Table 1 lists all supported standards, with voltage and termination requirements per bank. LVPECL and LVDS require differential pair routing and proper VCCO/VREF assignment per I/O bank.