AMD XCV2000E-6FG860I

Overview

XCV2000E-6FG860I from Xilinx is a 1.8 V, 2.54 million-system-gate SRAM-based FPGA with 43,200 logic cells, 80 × 120 CLB array, and 804 user I/Os in an 860-ball fine-pitch BGA package. It delivers 240 MHz system clock performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital DLLs for zero-delay clock conversion-used in high-speed communications infrastructure and radar signal processing.

For engineers reviewing the XCV2000E-6FG860I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, block RAM configuration, DLL timing behavior, and industrial-temperature (-40°C to +100°C) operation context for legacy Virtex-E system migration and obsolescence-aware design reuse.

Technical Context

The XCV2000E-6FG860I implements a regular, scalable architecture with 43,200 logic cells arranged in an 80 × 120 CLB grid, each CLB containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice. Its eight fully digital Delay-Locked Loops (DLLs) support 50% duty-cycle generation, clock multiply/divide, and LVPECL/LVDS clock domain translation without external PLLs.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only when sharing VCCO (e.g., LVTTL + PCI33_3 at 3.3 V), while input thresholds require bank-wide VREF consistency. Block SelectRAM is arranged in 160 columns of 4096-bit dual-port memory, enabling true dual-port synchronous access with configurable data widths per port.

Key Specifications

Pinout & Package

Package: 860-ball Fine-Pitch Ball Grid Array (FG860), 1.0 mm pitch, RoHS-compliant, industrial temperature grade (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV2000E-6FG860I, the XCV2000E-6FG680C trades I/O count and temperature range for smaller board area, while the XCV2600E-6FG860I retains full pin compatibility and thermal spec while delivering 33% more logic cells-making it the only direct scalability option for production systems requiring extended functionality.

Availability

XCV2000E-6FG860I is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, defense electronics, and industrial automation requiring stable component supply amid end-of-life transitions.

Supply support for XCV2000E-6FG860I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-E family was designed for high-performance, high-capacity reconfigurable computing in wireline communications, radar, and scientific instrumentation-emphasizing I/O flexibility, clock management, and memory integration before the advent of modern transceiver-based FPGAs.

FAQ

Is XCV2000E-6FG860I still in production?

No. XCV2000E-6FG860I was discontinued per Xilinx Notices XCN09001 and XCN12026, with final shipment in March 2014. Aetrix Electronics maintains limited legacy inventory with full traceability and offers lifecycle management support-including cross-reference guidance and migration paths-to sustain existing designs using XCV2000E-6FG860I.

What is the maximum differential I/O data rate supported by XCV2000E-6FG860I?

XCV2000E-6FG860I supports LVDS signaling at up to 622 Mb/s per differential pair, as confirmed in DS022-1 Table 2 and the "Differential Signalling Support" feature list. This rate applies to source-synchronous interfaces such as Camera Link Base/Medium and custom high-speed serializers implemented in the FPGA fabric.

Does XCV2000E-6FG860I support PCI-X or only conventional PCI?

XCV2000E-6FG860I is compliant with 3.3 V, 32/64-bit, 33/66 MHz PCI (conventional PCI), as stated in its "Features" section. It does not support PCI-X (133 MHz) or PCIe, which were introduced in later Virtex-II and Virtex-4 families. Designs requiring PCI-X must migrate to newer FPGA families or use bridge ICs.

Can XCV2000E-6FG860I be configured via JTAG in-system?

Yes. XCV2000E-6FG860I supports IEEE 1149.1 boundary-scan JTAG configuration in slave serial mode, enabling in-system programming, debugging, and verification without requiring external PROM. The TCK/TMS/TDI/TDO pins are dedicated and fully compliant with JTAG standards per DS022-4 pinout tables.

What is the VCCO requirement for using LVCMOS18 I/O on XCV2000E-6FG860I?

LVCMOS18 outputs require VCCO = 1.8 V per bank, and LVCMOS18 inputs are powered by that same VCCO-not VCCINT-as clarified in the "Virtex-E Compared to Virtex Devices" section. Mixing LVCMOS18 with LVTTL in the same bank is prohibited unless both share identical VCCO, which they do not (LVTTL requires 3.3 V).