AMD XCV2000E-7BG560C

Overview

XCV2000E-7BG560C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 2.54 million system gates, 43,200 logic cells, and 804 user I/Os in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing.

For engineers reviewing the XCV2000E-7BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (130 MHz internal performance, 240 MHz system clock), 1.8 V core voltage with 3.3 V I/O tolerance, 0.18 μm 6-layer metal process, and support for source-synchronous data transmission architectures.

Technical Context

The XCV2000E-7BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL-with banked VCCO/VREF management, programmable drive strength (up to 24 mA source / 48 mA sink), and optional weak-keeper circuits. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV2000E-7BG560C, the -8 variant offers guaranteed timing headroom without layout change, while the XCV2600E-7FG1156C trades package compatibility for scalable logic capacity - making the XCV2000E-7BG560C optimal for cost-constrained, space-limited high-speed I/O applications.

Availability

XCV2000E-7BG560C is available at Aetrix Electronics and suitable for high-speed communications backplanes, radar signal processing engines, industrial machine vision controllers, and medical imaging data pipelines requiring stable component supply across extended product lifecycles.

Supply support for XCV2000E-7BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and advanced programmable logic solutions for aerospace, defense, and communications markets.

The Virtex-E family was designed specifically for high-performance, high-capacity system-on-chip replacements in applications demanding >200 MHz clock rates, multi-standard I/O, and integrated memory bandwidth exceeding 1 Tb/s.

FAQ

What is the maximum supported LVDS data rate for XCV2000E-7BG560C?

The XCV2000E-7BG560C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to both input and output directions and is achievable using source-synchronous clocking architectures with proper PCB layout and termination. The device's eight DLLs enable precise clock-to-data alignment required for reliable 622 Mb/s operation.

Does XCV2000E-7BG560C support PCI 66 MHz operation?

Yes, XCV2000E-7BG560C is fully PCI 3.3 V compliant for both 33 MHz and 66 MHz operation, as stated in DS022-1 Section "Features". Its I/O banks support LVTTL and PCI standards with 3.3 V tolerance, and it meets PCI specification timing requirements including setup/hold and skew limits when configured with appropriate drive strength and slew control.

How many block RAMs does XCV2000E-7BG560C contain?

XCV2000E-7BG560C contains 160 block SelectRAM units, totaling 655,360 bits of true dual-port synchronous memory, per Table 4 in DS022-2 (v2.8). Each block is 4096 bits organized as configurable depths (e.g., 256×16, 512×8, 1024×4) with independent read/write ports - enabling efficient FIFOs, coefficient tables, or frame buffers without consuming CLB resources.

Is XCV2000E-7BG560C pin-compatible with other Virtex-E devices in BG560 package?

Yes, XCV2000E-7BG560C shares identical pinout with other Virtex-E devices offered in the BG560 package, including XCV400E, XCV600E, and XCV1000E, as verified in DS022-4 Pinout Tables. However, I/O bank assignments and VCCO/VREF pin allocations scale with device size - unused pins on smaller devices become functional VCCO/VREF or I/O on XCV2000E-7BG560C.

What development tools support XCV2000E-7BG560C?

XCV2000E-7BG560C is supported by Xilinx Foundation™ and Alliance Series™ development systems, as documented in DS022-1 Section "Features". These tools provide behavioral and schematic entry, timing-driven place-and-route, simulation, and bitstream generation - with specific device libraries and speed files for the -7 speed grade and BG560 package.