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AMD XCV2000E-7BG560I
- Part No.:
- XCV2000E-7BG560I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV2000E-7BG560I.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,411
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Product details
Overview
XCV2000E-7BG560I from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 2.54 million system gates, 43,200 logic cells, and 804 user I/Os in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing.
For engineers reviewing the XCV2000E-7BG560I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-temperature (-40°C to +100°C) operation requirements.
Technical Context
The XCV2000E-7BG560I implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its routing hierarchy includes a General Routing Matrix (GRM) and VersaRing I/O interconnect, enabling high fan-out and low-skew clock distribution across 80 × 120 CLB rows/columns.
It integrates eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction, and frequency multiplication (up to 4×); supports true dual-port block RAM (4096-bit blocks, configurable depth/width); and enforces strict I/O banking rules where VCCO and VREF voltages are bank-specific - e.g., LVCMOS18 and LVTTL cannot share a bank without voltage conflict.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 2.54 million - reflects total logic capacity equivalent to ASIC gate count for synthesis estimation. |
| Logic Cells | 43,200 - atomic programmable units each with LUT, carry, and storage; determines maximum combinational/sequential logic density. |
| User I/O Pins | 804 - maximum single-ended I/O count in BG560 package; enables high-pin-count interface consolidation. |
| Block RAM Bits | 655,360 - organized as 160 × 4096-bit true dual-port blocks; supports independent read/write clocks and bus-width conversion. |
| DLL Count | 8 - fully digital delay-locked loops; provide jitter-free clock deskew, 50% duty cycle generation for DDR, and LVPECL/LVDS input conditioning. |
| Speed Grade | -7 - guarantees worst-case internal register-to-register delay ≤ 4.3 ns and adder delay ≤ 6.3 ns at industrial temperature. |
| Supply Voltage (VCCINT) | 1.8 V ± 0.1 V - core logic voltage; reduces dynamic power vs. 2.5 V Virtex; requires tight regulation and decoupling. |
Pinout & Package
Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, industrial temperature grade (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs; must be driven by LVPECL/LVDS for >300 MHz operation. |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; requires separate low-ESR decoupling per bank. |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies; determines compatible I/O standards (e.g., VCCO=3.3 V enables LVTTL/PCI). |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL; must be externally sourced and stable within ±1%. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 compliant test interface; used for configuration, debugging, and in-system verification. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, SSTL3, HSTL IV, and PCI - with bank-isolated VCCO/VREF control. |
| SelectRAM+™ Hierarchy | 655,360 bits block RAM + 614,400 bits distributed RAM; true dual-port block RAM enables simultaneous read/write at full speed. |
| SelectLink™ DDR Interface | Hardened DDR link logic between CLBs and external memory controllers; eliminates external PHY for ZBT SRAM/DDR SDRAM interfacing. |
| Digital DLL Architecture | Eight DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock input conditioning - no external PLL required for clock domain bridging. |
| Die Temperature Sensor | On-die diode sensor calibrated for ±3°C accuracy; enables thermal throttling and reliability monitoring in sealed industrial enclosures. |
Applications
| High-Speed Communications Backplane | Radar Digital Beamforming |
|---|---|
|
Use Scenario: 10 GbE line card with SerDes aggregation, packet classification, and FEC offload. IC Role / Device Role / Timing Role: Programmable protocol engine implementing MAC, CRC, and Reed-Solomon decoding with deterministic <4.3 ns register-to-register latency. Use Value: 804 I/Os enable parallel 32-bit DDR2 interface to packet buffer RAM and LVDS links to 8x SerDes lanes - eliminating external glue logic. |
Use Scenario: Active electronically scanned array (AESA) radar with real-time phase/amplitude correction per antenna element. IC Role / Device Role / Timing Role: Real-time beamformer using 43,200 logic cells to execute 128-channel complex multiply-accumulate at 200 MHz sample rate. Use Value: Eight DLLs generate synchronized 200 MHz sampling clocks with <50 ps skew across all 128 channels - critical for coherent beam steering. |
| Industrial Machine Vision Controller | PCI Express Bridge Accelerator |
|
Use Scenario: GigE Vision camera controller with on-FPGA image preprocessing (defect detection, edge enhancement). IC Role / Device Role / Timing Role: High-bandwidth image pipeline using distributed RAM for line buffers and block RAM for lookup tables (LUTs) and histogram storage. Use Value: 614,400 bits distributed RAM provides 16-line deep 12-bit pixel buffering at 80 MHz - enabling real-time convolution without external memory access. |
Use Scenario: PCIe x4 gen1 endpoint for FPGA-accelerated data acquisition in test equipment. IC Role / Device Role / Timing Role: PCI-compliant endpoint with 33/66 MHz 32-bit bus interface, DMA controller, and scatter-gather descriptor engine. Use Value: Native PCI 3.3 V compliance and 804 I/Os allow direct connection to host bridge without level shifters - reducing BOM cost and signal integrity risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV2000E-8BG560I | Faster speed grade (-8): 3.8 ns register-to-register delay vs. 4.3 ns; same logic density, I/O count, and package. | Required for designs exceeding 133 MHz internal clocking or needing tighter setup/hold margins in industrial temp. | Select when timing closure fails at -7 grade or when migrating from prototype to volume production with margin headroom. |
| XCV2600E-7FG1156I | Higher density (685,584 logic cells), larger FG1156 package (1156 balls), 804 I/Os retained but with expanded bank count and VREF flexibility. | Suitable for designs requiring >43K logic cells or additional high-speed transceivers not present in Virtex-E family. | Choose only if logic utilization exceeds 95% on XCV2000E-7BG560I or if future scalability to 685K cells is mandated in roadmap. |
Compared with XCV2000E-7BG560I, the -8 variant offers guaranteed higher timing performance without layout change, while XCV2600E-7FG1156I trades package size and cost for significant logic expansion - neither is pin-compatible due to differing ball counts and bank layouts.
Availability
XCV2000E-7BG560I is available at Aetrix Electronics and suitable for high-speed communications backplanes, radar digital beamformers, industrial machine vision controllers, and PCIe bridge accelerators requiring stable component supply across extended lifecycle programs.
Supply support for XCV2000E-7BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for aerospace, defense, and high-performance computing.
The Virtex-E family was designed for high-speed, high-density system integration in industrial and communications infrastructure - delivering 1.8 V core efficiency, advanced I/O flexibility, and hardened memory/clock subsystems before 90 nm node adoption.
FAQ
What is the maximum differential I/O pair count supported by XCV2000E-7BG560I?
XCV2000E-7BG560I supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability enables high-bandwidth LVDS or BLVDS interfaces - for example, 172-lane source-synchronous data capture at 622 Mb/s - without requiring external serializers.
Does XCV2000E-7BG560I support true dual-port block RAM operation?
Yes, XCV2000E-7BG560I supports true dual-port block RAM: each 4096-bit block allows independent read and write operations on separate ports with distinct addresses, clocks, and enables. This is validated in DS022-2 (v2.8) Section "Block SelectRAM" and enables applications like FIFOs with concurrent producer/consumer access.
Can XCV2000E-7BG560I operate with 5 V tolerant I/Os?
No, XCV2000E-7BG560I I/O pins are not 5 V tolerant by default. They are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin - as stated in DS022-1 (v2.3) page 2. Direct 5 V connection will damage the device.
How many DLLs are integrated into XCV2000E-7BG560I and what are their key functions?
XCV2000E-7BG560I integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 (v2.3) Features section. These provide zero-delay clock conversion, 50% duty-cycle correction for DDR, frequency multiplication (up to 4×), and LVPECL/LVDS clock input conditioning - eliminating need for external clock ICs.
Is XCV2000E-7BG560I pin-compatible with earlier Virtex family devices?
XCV2000E-7BG560I is not bitstream-compatible with Virtex devices, but is pin-compatible with same-package Virtex devices "with some minor exceptions", per DS022-1 (v2.3) page 2. However, differences in VCCO/VREF banking, I/O buffer power domains, and DLL count require PCB redesign for migration - not drop-in replacement.
XCV2000E-7BG560I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9600
- Number of Logic Elements/Cells:
- 43200
- Total RAM Bits:
- 655360
- Number of I/O:
- 404
- Number of Gates:
- 2541952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV2000E-7BG560I FAQ
1.How can I place an order for XCV2000E-7BG560I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV2000E-7BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV2000E-7BG560I reliable?
The price and inventory of XCV2000E-7BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV2000E-7BG560I is usually 5 days.
3.What payment methods are accepted for XCV2000E-7BG560I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV2000E-7BG560I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV2000E-7BG560I?
XCV2000E-7BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV2000E-7BG560I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV2000E-7BG560I?
For technical support, including XCV2000E-7BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV2000E-7BG560I requirements.
6.How does Aetrix verify that XCV2000E-7BG560I is sourced from the original manufacturer or authorized distributors?
All XCV2000E-7BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV2000E-7BG560I meets industry standards.
7.What is the process for return or replacement of XCV2000E-7BG560I?
All XCV2000E-7BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV2000E-7BG560I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV2000E-7BG560I part is unused and in its original packaging.
Return procedure for XCV2000E-7BG560I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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