AMD XCV2000E-7FG1156C

Overview

XCV2000E-7FG1156C from Xilinx is a 1.8 V SRAM-based FPGA with 2.54 million system gates, 43,200 logic cells, and 804 user I/Os in an 1156-ball fine-pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV2000E-7FG1156C datasheet, pinout, applications, or equivalent options, this device is selected for demanding reconfigurable logic tasks requiring >240 MHz synchronous system performance, differential signaling at 622 Mb/s, and flexible I/O banking across eight voltage domains.

Technical Context

The XCV2000E-7FG1156C implements a regular array architecture with 80 × 120 CLBs, each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and 4× frequency multiplication - all digitally synthesized without analog components.

I/O functionality is organized into eight banks, each supporting mixed standards (e.g., LVTTL, SSTL3, LVDS) under shared VCCO and single VREF constraints. Input buffers for LVTTL/LVCMOS/PCI are powered by VCCO (not VCCINT), and all IOBs include programmable weak-keeper, pull-up/pull-down, and IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV2000E-7FG1156C, the -6 variant trades timing margin for lower cost and power, while the XCV2600E-7FG1156C extends logic capacity without changing PCB layout - both maintain identical I/O banking structure and DLL architecture.

Availability

XCV2000E-7FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial motion control applications requiring stable component supply over extended production lifecycles.

Supply support for XCV2000E-7FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneer in programmable logic technology and was acquired by AMD in 2022; its FPGA products serve high-performance computing, aerospace, and communications markets.

The Virtex-E family was designed specifically for high-speed, high-density reconfigurable logic applications demanding >240 MHz system clocks, differential I/O, and integrated memory - targeting wireline telecom and test equipment.

FAQ

What is the maximum operating junction temperature for XCV2000E-7FG1156C?

The XCV2000E-7FG1156C is rated for commercial temperature range (0°C to +85°C). Its junction temperature must not exceed +105°C under steady-state operation. Thermal design requires attention to FG1156 package thermal resistance (θJA ≈ 12°C/W typical) and adequate PCB copper area for heat dissipation.

Does XCV2000E-7FG1156C support JTAG configuration?

Yes, XCV2000E-7FG1156C fully supports IEEE 1149.1 JTAG configuration via TCK/TMS/TDI/TDO pins. It enables boundary-scan testing, in-system programming, and debug access without requiring external configuration PROMs.

Can XCV2000E-7FG1156C interface directly with 5 V TTL devices?

No, XCV2000E-7FG1156C I/O pins are not 5 V tolerant by default. They support 3.3 V LVTTL/PCI and 2.5 V/1.8 V standards. For 5 V interfacing, external level-shifting circuitry or series 100 Ω resistors (per Xilinx DS022 guidance) are required.

How many DLLs are available in XCV2000E-7FG1156C and what are their key capabilities?

XCV2000E-7FG1156C integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply/divide, 50% duty-cycle correction for DDR, zero-delay conversion of LVPECL/LVDS inputs, and clock mirroring - all without external components or analog tuning.

Is XCV2000E-7FG1156C pin-compatible with other Virtex-E devices in FG1156 package?

Yes, XCV2000E-7FG1156C shares identical FG1156 pinout with XCV2600E-7FG1156C and XCV3200E-7FG1156C per DS022 Module 4. However, smaller Virtex-E devices (e.g., XCV1000E) in FG1156 have fewer I/Os and unused balls - full compatibility requires matching device density and I/O bank usage.