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AMD XCV2000E-7FG860C
- Part No.:
- XCV2000E-7FG860C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 860-BGA Exposed Pad
- Datasheet:
-
XCV2000E-7FG860C.pdf
- Description:
- IC FPGA 660 I/O 860FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,359
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Product details
Overview
XCV2000E-7FG860C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 2.54 million system gates, 43,200 logic cells, and 804 user I/Os in an 860-ball fine-pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing.
For engineers reviewing the XCV2000E-7FG860C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade–specific performance limits per DS022-1 (v2.3) and DS022-2 (v2.8).
Technical Context
The XCV2000E-7FG860C implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice, enabling high-speed arithmetic and wide-input logic. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - critical for source-synchronous interfaces.
I/O functionality is organized into eight banks, each supporting mixed standards only when sharing VCCO (e.g., LVTTL + PCI33_3 at 3.3 V) or VREF (e.g., SSTL3 I/II at 1.5 V). Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO-not VCCINT-enabling 3 V tolerance without external resistors and enforcing strict bank-level voltage partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 2.54 M - reflects silicon capacity for complex logic integration, validated via Xilinx's gate-count methodology |
| Logic Cells | 43,200 - CLB-based resource count enabling large datapaths and control units |
| User I/O Pins | 804 - maximum single-ended I/Os in FG860 package; supports up to 344 differential pairs |
| Block RAM Bits | 655,360 - organized as 160 × 4096-bit true dual-port blocks for independent read/write addressing |
| DLL Count | 8 - fully digital delay-locked loops for jitter reduction, clock domain crossing, and DDR timing alignment |
| Internal Voltage | VCCINT = 1.8 V - core logic supply enabling lower dynamic power vs. 2.5 V Virtex family |
| Speed Grade | -7 - guarantees worst-case register-to-register delay ≤ 4.3 ns and adder delay ≤ 6.3 ns per DS022-1 Table 2 |
Pinout & Package
The XCV2000E-7FG860C uses an 860-ball fine-pitch ball grid array (FG860) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and eight I/O banks (Bank 0–7) arranged across device edges. Each bank has dedicated VCCO and VREF pins; Bank 0 includes GCLK0–GCLK3 global clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew clock routing entry points tied to DLL inputs; require LVPECL/LVDS-compatible termination |
| VCCO_0–VCCO_7 | I/O Supply Voltage | Bank-specific VCCO pins powering output drivers and input buffers; must be uniform per bank (e.g., 3.3 V for LVTTL) |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage inputs for SSTL/HSTL/GTL standards; internally connected within bank |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration verification and in-system debugging |
| INIT_DONE | Configuration Status | Open-drain output indicating successful bitstream loading; pulled high externally after configuration |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz - enables direct interfacing to memory, SERDES, and backplane ICs |
| SelectRAM+™ Hierarchy | 655,360 bits block RAM + 614,400 bits distributed RAM - provides on-chip memory bandwidth >1.66 Tb/s for real-time buffering |
| SelectLink™ DDR Interface | Double Data Rate link between CLBs and block RAM - eliminates external FIFOs in high-throughput data pipelines |
| Digital DLL Architecture | Eight DLLs with 4× multiplication and duty-cycle correction - removes need for external clock synthesizers in DDR and source-synchronous designs |
| 0.18 μm 6-Layer Metal Process | Enables 240 MHz synchronous system performance and 133 MHz internal operation - reduces die area and dynamic power vs. prior Virtex generation |
Applications
| High-Speed Communications Backplane | Radar Digital Beamforming |
|---|---|
Use Scenario: 10 GbE line card implementing packet classification, header parsing, and traffic shaping using parallel TCAM-like logic. IC Role / Device Role / Timing Role: Primary programmable fabric handling multi-gigabit SerDes-to-processor data path with sub-5 ns register-to-register timing. Use Value: 804 I/Os enable full-width parallel bus to network processors; LVDS support allows direct connection to 622 Mb/s framer ICs without level-shifting. |
Use Scenario: Phased-array radar subsystem performing real-time FFT, beam steering, and pulse compression on digitized IF samples. IC Role / Device Role / Timing Role: Real-time signal processor executing pipelined arithmetic on 16-bit complex samples with deterministic latency. Use Value: 43,200 logic cells implement 1K-point FFT cores; 655,360-bit block RAM stores coefficient tables and intermediate results with true dual-port access. |
| PCI Express Gen1 Endpoint | Industrial Machine Vision Controller |
Use Scenario: Embedded vision acquisition board with PCIe x4 host interface, camera sensor bridging, and onboard image preprocessing. IC Role / Device Role / Timing Role: PCIe endpoint controller + custom DMA engine + pixel pipeline accelerator co-located on single die. Use Value: PCI 3.3 V/66 MHz compliance enables plug-and-play compatibility; eight DLLs synchronize multiple clock domains (camera, memory, host interface). |
Use Scenario: Smart camera running real-time blob detection, OCR, and Ethernet/IP protocol stack on factory floor. IC Role / Device Role / Timing Role: System-on-programmable-chip integrating sensor interface, algorithm acceleration, and industrial networking MAC. Use Value: 1.8 V VCCINT reduces thermal load in sealed enclosures; I/O banking allows mixing LVCMOS18 (sensor interface) and 3.3 V LVTTL (Ethernet PHY) on same device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV2000E-6FG860C | Same architecture and pinout; -6 speed grade offers 10–15% faster timing (e.g., 3.8 ns adder delay vs. 4.3 ns) | Suitable where design meets timing margin with lower clock frequencies or relaxed setup/hold windows | Select when targeting 200 MHz system clocks with headroom; requires re-verification of critical paths |
| XCV2600E-7FG860C | Higher density (3.26 M gates, 57,132 logic cells); identical FG860 package and I/O count but larger die and higher static power | Required when design exceeds XCV2000E resource utilization (e.g., >95% CLB usage or >600 kbit RAM demand) | Choose for future-proofing or incremental design growth; no PCB change needed but thermal management must be reassessed |
Compared with XCV2000E-7FG860C, the -6 variant trades guaranteed timing margin for cost-sensitive deployments, while the XCV2600E-7 offers scalable logic capacity within the same footprint - both retain identical I/O banking rules, DLL configuration, and configuration mode compatibility.
Availability
XCV2000E-7FG860C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, radar signal processing, PCI Express endpoint development, and industrial machine vision systems requiring stable component supply over extended production lifecycles.
Supply support for XCV2000E-7FG860C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for demanding compute and interface applications.
The Virtex-E product line was engineered specifically for high-bandwidth, low-latency digital systems requiring integrated clock management, flexible I/O, and scalable memory - targeting communications, defense, and industrial automation markets.
FAQ
What is the maximum supported I/O standard speed for XCV2000E-7FG860C?
XCV2000E-7FG860C supports LVDS signaling at up to 622 Mb/s and LVPECL clock inputs exceeding 300 MHz, as confirmed in DS022-1 Section "Differential Signalling Support". These rates are achievable under source-synchronous architectures with proper PCB layout and termination, and are validated across all speed grades including -7.
Does XCV2000E-7FG860C support true dual-port block RAM operation?
Yes, XCV2000E-7FG860C includes 160 block RAM modules, each configured as a true dual-port 4096-bit memory with independent address, data, and control lines per port. This capability is documented in DS022-2 Module 2, Table 4 and Figure 6, enabling simultaneous read/write operations without arbitration logic.
Can XCV2000E-7FG860C be used in PCI 5 V environments?
No, XCV2000E-7FG860C does not support PCI 5 V. Its I/O pins are 3 V tolerant and can be made 5 V tolerant only with external 100 Ω series resistors - but official documentation explicitly states "PCI 5 V is not supported" (DS022-1 p.2). Designs requiring native 5 V PCI must use alternative devices.
How many DLLs are available in XCV2000E-7FG860C and what are their key functions?
XCV2000E-7FG860C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Features section and DS022-2 Architectural Description. Each DLL provides clock multiply/divide, zero-delay conversion of LVPECL/LVDS inputs, and 50% duty-cycle synthesis - essential for DDR memory interfaces and high-speed serial links.
Is XCV2000E-7FG860C pin-compatible with earlier Virtex family devices?
XCV2000E-7FG860C is not bitstream-compatible with Virtex devices, but the same package (e.g., FG860) offers pin compatibility with minor exceptions - detailed in DS022-1 Pinout section. Migration requires recompilation but preserves PCB layout; however, VCCINT (1.8 V vs. 2.5 V) and I/O banking rules differ significantly.
XCV2000E-7FG860C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 860-BGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9600
- Number of Logic Elements/Cells:
- 43200
- Total RAM Bits:
- 655360
- Number of I/O:
- 660
- Number of Gates:
- 2541952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 860-FBGA (42.5x42.5)
XCV2000E-7FG860C FAQ
1.How can I place an order for XCV2000E-7FG860C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV2000E-7FG860C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV2000E-7FG860C reliable?
The price and inventory of XCV2000E-7FG860C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV2000E-7FG860C is usually 5 days.
3.What payment methods are accepted for XCV2000E-7FG860C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV2000E-7FG860C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV2000E-7FG860C?
XCV2000E-7FG860C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV2000E-7FG860C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV2000E-7FG860C?
For technical support, including XCV2000E-7FG860C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV2000E-7FG860C requirements.
6.How does Aetrix verify that XCV2000E-7FG860C is sourced from the original manufacturer or authorized distributors?
All XCV2000E-7FG860C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV2000E-7FG860C meets industry standards.
7.What is the process for return or replacement of XCV2000E-7FG860C?
All XCV2000E-7FG860C units undergo pre-shipment inspection (PSI). If there is an issue with XCV2000E-7FG860C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV2000E-7FG860C part is unused and in its original packaging.
Return procedure for XCV2000E-7FG860C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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