AMD XCV2000E-8BG560C

Overview

XCV2000E-8BG560C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 2.54 million system gates, 43,200 logic cells, and 804 user I/Os in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing.

For engineers reviewing the XCV2000E-8BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade –8 DC/AC electrical limits per DS022-3 (v2.3).

Technical Context

The XCV2000E-8BG560C implements a regular array of 80 × 120 CLBs, each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - all operating independently per bank.

I/O functionality is partitioned across eight banks with voltage-referenced standards (LVTTL, SSTL, HSTL, LVDS, LVPECL); VCCO per bank powers output drivers and input buffers for LVTTL/LVCMOS/PCI, while VREF is required for SSTL/HSTL inputs. Each IOB supports programmable slew rate, drive strength (up to 24 mA source / 48 mA sink), and optional weak-keeper or pull-up/pull-down.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, thermally enhanced ceramic substrate.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV2000E-8BG560C, the -7 variant trades 7% speed for lower cost and power, while the XCV2600E-8FG1156C adds 33% logic capacity and routing headroom at the expense of mechanical compatibility - making the XCV2000E-8BG560C optimal for fixed-footprint, timing-critical 43K-LC deployments.

Availability

XCV2000E-8BG560C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, radar signal processing, and optical transport network equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV2000E-8BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically responsible for commercializing SRAM-based FPGAs and EDA toolchains.

The Virtex-E family was designed for high-performance, high-capacity reconfigurable computing in telecommunications, defense, and scientific instrumentation - emphasizing I/O bandwidth, clock management, and memory hierarchy over raw gate count alone.

FAQ

What is the maximum differential I/O pair count supported by XCV2000E-8BG560C?

XCV2000E-8BG560C supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capacity is enabled by its 804 total user I/Os and SelectI/O+™ architecture, which allocates two pins per differential signal. The BG560 package physically accommodates this count within its 560-ball layout, with I/O banks configured to meet LVDS or LVPECL termination requirements.

Does XCV2000E-8BG560C support 5 V tolerant I/Os?

No, XCV2000E-8BG560C does not support native 5 V tolerant I/Os. Its I/O pins are rated for 3.3 V operation and tolerate 3.3 V LVTTL/LVCMOS levels. While external 100 Ω resistors can extend tolerance to 5 V for specific pins, PCI 5 V signaling is explicitly unsupported per DS022-1 Section "Virtex-E Compared to Virtex Devices" - making XCV2000E-8BG560C unsuitable for legacy 5 V bus interfacing without level-shifting circuitry.

How many DLLs are integrated into XCV2000E-8BG560C, and what clock frequencies do they support?

XCV2000E-8BG560C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Feature list and Module 2 Architectural Description. Each DLL supports input frequencies up to 300+ MHz for LVPECL/LVDS clock inputs and provides 4× multiplication capability. They deliver zero-delay conversion to any I/O standard and generate 50% duty-cycle clocks essential for DDR applications - all verified in DS022-3 timing tables.

Is XCV2000E-8BG560C pin-compatible with earlier Virtex family devices?

XCV2000E-8BG560C is not bitstream-compatible with Virtex family devices, but it is pin-compatible with equivalent Virtex devices in the same BG560 package - subject to minor exceptions documented in DS022-1 Pinout Tables (Module 4). Critical differences include VCCO-powered I/O buffers (vs. VCCINT in Virtex) and revised banking rules, requiring schematic and constraint file updates even when footprint matches.

What is the block RAM configuration capability of XCV2000E-8BG560C?

XCV2000E-8BG560C contains 160 block SelectRAM units totaling 655,360 bits, each structured as a true dual-port 4096-bit RAM with independent clocks, addresses, and data widths per port. As detailed in DS022-2 Module 2, this enables simultaneous read/write operations, built-in bus-width conversion (e.g., 32-bit write / 8-bit read), and integration with CLBs via dedicated routing - critical for high-throughput buffering in communication protocols.