AMD XCV2000E-8FG1156C

Overview

XCV2000E-8FG1156C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 2.54 million system gates, 43,200 logic cells in an 80 × 120 CLB array, and 804 user I/O pins in an 1156-ball Fine-Pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV2000E-8FG1156C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-performance reconfigurable logic solution for telecom line cards, radar signal processors, and protocol bridging platforms requiring deterministic timing, differential I/O, and embedded memory bandwidth exceeding 1.66 Tb/s.

Technical Context

The XCV2000E-8FG1156C implements a regular array architecture with configurable logic blocks (CLBs) and programmable input/output blocks (IOBs) interconnected via a general routing matrix and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset, and optional input delay for zero pad-to-pad hold time.

Its eight fully digital DLLs provide clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS clocks to any I/O standard. I/O banking enforces VCCO and VREF voltage grouping across eight banks, supporting mixed standards like LVTTL, SSTL3, HSTL IV, and LVDS within compatible voltage domains.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV2000E-8FG1156C, the -7 variant trades 3 MHz timing margin for lower cost, while the XCV2600E-8FG1156C retains pin compatibility but adds 32% more logic and 15% more block RAM-enabling larger state machines and deeper buffering without PCB redesign.

Availability

XCV2000E-8FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar, industrial automation, and protocol gateway applications requiring stable component supply across extended product lifecycles.

Supply support for XCV2000E-8FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined solutions for high-performance computing and embedded systems.

The Virtex-E family was designed for high-speed, high-capacity reconfigurable logic in communications and signal processing applications, leveraging 0.18 μm CMOS process and advanced I/O architecture to replace ASICs in rapidly evolving standards environments.

FAQ

What is the maximum supported LVDS data rate for XCV2000E-8FG1156C?

The XCV2000E-8FG1156C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Table 2 and functional description. This rate applies to both input and output differential I/O pairs, enabled by internal termination and DLL-synchronized capture. The device achieves this using source-synchronous architectures with programmable input delays to eliminate pad-to-pad hold time constraints. XCV2000E-8FG1156C does not support higher rates such as 1.25 Gb/s found in later Virtex families.

Does XCV2000E-8FG1156C support PCI 66 MHz operation?

Yes, XCV2000E-8FG1156C is fully compliant with 3.3 V PCI specification for both 33 MHz and 66 MHz operation, as stated in DS022-1 Feature list and General Description. Its I/O buffers meet PCI electrical requirements including drive strength, slew rate, and noise immunity. The device uses LVTTL-compatible I/O banks powered by VCCO, and supports hot-plug detection when configured with appropriate external resistors. XCV2000E-8FG1156C does not support 5 V PCI signaling.

How many DLLs are integrated into XCV2000E-8FG1156C and what functions do they perform?

XCV2000E-8FG1156C integrates eight fully digital Delay-Locked Loops (DLLs), as documented in DS022-1 Features and DS022-2 Architectural Description. Each DLL provides clock multiply/divide (up to 4×), 50% duty cycle correction for DDR applications, zero-delay clock conversion from LVPECL/LVDS to any I/O standard, and clock mirroring. These DLLs operate independently and are mapped to dedicated global clock pins (GCLK0–GCLK7), enabling multi-domain timing control without external clock synthesizers.

What is the block RAM capacity of XCV2000E-8FG1156C and how is it structured?

XCV2000E-8FG1156C contains 160 block SelectRAM units totaling 655,360 bits, organized as true dual-port synchronous RAM with independent address/data/control per port, as specified in DS022-2 Table 4 and Figure 6. Each block is 4096 bits with configurable depth/width (e.g., 256×16, 512×8, 1024×4). These blocks are arranged in columns adjacent to CLB columns (Table 3), providing dedicated routing to CLBs and other block RAMs for low-latency access. Distributed RAM adds 614,400 bits in CLB LUTs.

Is XCV2000E-8FG1156C pin-compatible with other Virtex-E devices in FG1156 package?

Yes, XCV2000E-8FG1156C shares identical pinout with XCV2600E-8FG1156C and XCV3200E-8FG1156C in the FG1156 package, as confirmed in DS022-1 Table 3 and Pinout Tables Module 4. All three devices allocate 804 user I/O pins across the same ball map, with identical placement of power, ground, clock, JTAG, and configuration pins. Differences exist only in internal resource count (logic cells, RAM), not pin function or assignment - enabling drop-in migration within the same package footprint.