AMD XCV2000E-8FG680C

Overview

XCV2000E-8FG680C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 518,400 logic cells, 80 × 120 CLB array, and 804 user I/Os in a 680-ball fine-pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 655,360 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and radar signal processing.

For engineers reviewing the XCV2000E-8FG680C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade –8 DC/switching specifications aligned to DS022-1 (v2.3) and DS022-2 (v2.8).

Technical Context

The XCV2000E-8FG680C implements a regular array architecture with 80 × 120 configurable logic blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and 4× frequency multiplication - enabling synchronous system operation up to 240 MHz.

I/O functionality is organized across eight banks, each supporting mixed standards only when sharing VCCO (e.g., LVTTL + PCI33_3 at 3.3 V) or VREF (e.g., SSTL3 I/II at 1.5 V). Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO-not VCCINT-enforcing strict bank-level voltage partitioning and prohibiting cross-bank VREF sharing.

Key Specifications

Pinout & Package

Package: 680-ball Fine-Pitch Ball Grid Array (FG680), 1.0 mm pitch, RoHS-compliant, thermal performance optimized for industrial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV2000E-8FG680C, the -7 variant trades 7% timing margin for lower power, while the XCV2600E-8 offers 32% more logic cells in pin-compatible form - making both viable alternatives depending on whether timing headroom or resource headroom is the primary constraint.

Availability

XCV2000E-8FG680C is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, high-speed test equipment, and industrial machine vision requiring stable component supply across extended product lifecycles.

Supply support for XCV2000E-8FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for demanding compute and interface applications.

The Virtex-E product line was engineered specifically for high-speed communications and signal processing systems requiring integrated clock management, differential I/O, and large on-chip memory - delivering up to 43,200 logic cells with 30% higher performance than prior Virtex devices.

FAQ

What is the maximum supported LVDS data rate for XCV2000E-8FG680C?

The XCV2000E-8FG680C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to both input and output directions and is achievable using source-synchronous architectures with proper PCB impedance control (100 Ω differential) and termination. The -8 speed grade ensures setup/hold timing compliance at this rate across commercial temperature range.

Does XCV2000E-8FG680C support true dual-port block RAM operation?

Yes, XCV2000E-8FG680C implements true dual-port block RAM with independent read/write addresses, enables, and clocks per port. Each of its 160 block RAMs (655,360 total bits) can be configured for asymmetric data widths - for example, 512 × 36 on port A and 1024 × 18 on port B - enabling efficient bus-width conversion in video frame buffering and packet switching applications.

How many DLLs does XCV2000E-8FG680C include, and what are their key capabilities?

XCV2000E-8FG680C integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Section "High-Performance Built-In Clock Management Circuitry". Each DLL provides zero-delay clock conversion, 4× frequency multiplication, 50% duty-cycle correction for DDR applications, and LVPECL/LVDS clock input conditioning - eliminating need for external clock synthesizers in high-speed memory and serial interface designs.

Is XCV2000E-8FG680C pin-compatible with other Virtex-E devices in FG680 packaging?

XCV2000E-8FG680C shares the same FG680 mechanical footprint and ball map with XCV1600E-8FG680C and XCV2600E-8FG680C, as documented in DS022-4 Pinout Tables. However, I/O banking assignments and VCCO/VREF pin allocations differ across densities - requiring PCB redesign if migrating to or from XCV2000E-8FG680C due to bank-specific voltage routing constraints.

What I/O standards are supported by XCV2000E-8FG680C, and how are they grouped?

XCV2000E-8FG680C supports 20 I/O standards including LVDS, LVPECL, SSTL3 I/II, HSTL IV, LVTTL, and PCI66_3 - grouped into eight I/O banks (two per side). Standards sharing the same VCCO (e.g., LVTTL + PCI66_3 at 3.3 V) or VREF (e.g., SSTL3 I/II at 1.5 V) may coexist within a bank, but mixing incompatible voltages (e.g., 3.3 V and 1.8 V outputs) in one bank is prohibited per DS022-2 Section "I/O Banking".