AMD XCV200-4BG256C

Overview

XCV200-4BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 236,666 system gates in a 28×42 CLB array with 5,292 logic cells and 284 user I/O pins. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-4BG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from legacy Virtex devices in commercial temperature range (0°C to +85°C).

Technical Context

The XCV200-4BG256C implements a hierarchical routing architecture with General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual-port synchronous storage elements.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, SSTL2/3, HSTL Classes I/III/IV, GTL/GTL+, and PCI 3.3 V/5 V, with banked VCCO (1.5 V / 2.5 V / 3.3 V) and VREF (0.75–1.5 V) constraints. All 284 I/O pins are IEEE 1149.1 boundary-scan compliant and include programmable pull-up/pull-down, weak-keeper, and ESD protection.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FBGA), 1.27 mm pitch, RoHS-compliant, body size 17 mm × 17 mm. Pinout conforms to DS003-4 (v4.0) Module 4 - all 284 user I/O pins distributed across eight I/O banks (Bank 0–7), with dedicated GCLK0–GCLK3, configuration (INIT_B, PROGRAM_B, CCLK, DIN, DOUT), JTAG (TCK/TMS/TDI/TDO), and power/ground balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-4BG256C, the -5 and -6 variants offer progressively tighter timing budgets and lower clock jitter but require identical PCB layout and power delivery - making them drop-in upgrades for performance-limited designs without hardware revision.

Availability

XCV200-4BG256C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, industrial motion control platforms, and protocol translation gateways requiring stable component supply across long-life production cycles.

Supply support for XCV200-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference acceleration solutions for aerospace, communications, and industrial markets.

The Virtex family - including XCV200-4BG256C - was engineered for high-performance, high-density logic replacement in systems demanding 200 MHz+ operation, mixed-voltage I/O, and on-chip memory, targeting ASIC prototyping and production deployment.

FAQ

What is the maximum operating frequency supported by XCV200-4BG256C?

XCV200-4BG256C supports synchronous system clock rates up to 200 MHz, including I/O timing, as verified under worst-case conditions with DLL enabled. This rating applies to register-to-register paths and I/O interfaces meeting PCI 66-MHz specifications. Actual achievable frequency depends on design complexity, placement, and routing; benchmarked adder and multiplier circuits achieve 5.0–6.0 ns propagation delays.

Does XCV200-4BG256C support hot-swap capability for Compact PCI systems?

Yes, XCV200-4BG256C is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets the electrical and timing requirements for insertion/removal while powered, including controlled slew rates, bus-hold functionality via weak-keeper circuits, and robust ESD protection. Configuration logic ensures safe state retention during transient power events.

How many block RAMs does XCV200-4BG256C provide, and what configurations are supported?

XCV200-4BG256C contains 14 block SelectRAM units totaling 57,344 bits. Each block is a fully synchronous dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096). Supported aspect ratios include 16×256, 8×512, 4×1024, 2×2048, and 1×4096, enabling flexible FIFO, buffer, and lookup table implementations.

Can XCV200-4BG256C interface directly with 5 V TTL logic?

XCV200-4BG256C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, allowing direct connection to 5 V outputs without level shifters. However, its outputs are not 5 V capable - VCCO must be set to 3.3 V for LVTTL compatibility, and external clamping or series resistors are required for safe interfacing with legacy 5 V buses driving into XCV200-4BG256C inputs.

Is XCV200-4BG256C still in active production or subject to obsolescence?

XCV200-4BG256C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support, including cross-reference guidance to Virtex-II or Spartan-3 alternatives where functionally appropriate.