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AMD XCV200-4BG352C
- Part No.:
- XCV200-4BG352C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV200-4BG352C.pdf
- Description:
- IC FPGA 260 I/O 352MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,367
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Product details
Overview
XCV200-4BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 maximum user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.
For engineers reviewing the XCV200-4BG352C datasheet, pinout, applications, or equivalent options, key selection considerations include its -4 speed grade (200 MHz system performance), BG352 package thermal and routing constraints, SelectIO™ multi-standard I/O support, and obsolescence status requiring lifecycle-aware sourcing.
Technical Context
The XCV200-4BG352C implements a hierarchical architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and dedicated block RAM columns. Its CLBs contain four logic cells each, with 4-input LUTs usable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers, and dual carry chains per slice for high-speed arithmetic.
It integrates four DLLs for clock skew compensation across four global clock nets and 24 local clock nets, supporting synchronous dual-ported 4k-bit RAMs and direct interfaces to ZBTRAM devices. The IOBs support 16 SelectIO™ standards-including LVTTL, HSTL Class IV, and SSTL2-with programmable drive strength, slew rate, and weak-keeper circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 236,666 - defines total logic capacity for complex digital system integration |
| Logic Cells | 5,292 - provides granular, place-and-route-efficient implementation of combinatorial and sequential logic |
| Max User I/O | 284 - enables high-pin-count interface bridging (e.g., PCI, memory buses, sensor arrays) |
| Block RAM Bits | 57,344 - delivers on-chip synchronous dual-ported memory for FIFOs, buffers, or lookup tables without external RAM |
| Speed Grade | -4 - guarantees 200 MHz system clock operation including I/O timing under worst-case conditions |
| Package | BG352 - 352-ball fine-pitch ball grid array with 1.27 mm pitch, optimized for thermal dissipation and signal integrity in dense PCB layouts |
| DLL Count | 4 - enables precise clock domain crossing, phase alignment, and jitter reduction across multiple clock domains |
Pinout & Package
The XCV200-4BG352C is housed in a 352-ball BGA (BG352) package with eight I/O banks, each supporting independent VCCO and shared VREF. Pin functions are defined per bank and include dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan (TCK, TMS, TDI, TDO), and user-configurable I/O with programmable pull-up/pull-down and weak-keeper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock distribution inputs tied to four dedicated DLLs for domain synchronization |
| INIT, PROGRAM | Configuration Control | Asynchronous reset and reconfiguration enable signals for in-system programming and recovery |
| CCLK, DIN, DONE | Master Serial Configuration | Serial clock/data input and configuration completion handshake for PROM-based bitstream loading |
| TCK, TMS, TDI, TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for device-level verification and PCB interconnect testing |
| VCCINT, VCCO, VREF | Power & Reference | VCCINT = 2.5 V core supply; VCCO per bank sets output voltage level; VREF per bank sets input threshold for compatible standards |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based configuration | Enables unlimited in-system reprogramming via JTAG or serial PROM, supporting iterative design validation and field updates |
| Dedicated carry logic | Provides high-speed arithmetic chains for pipelined adders, counters, and DSP datapaths without consuming LUT resources |
| SelectIO™ interface flexibility | Allows mixed-voltage I/O banking (e.g., 3.3 V LVTTL and 1.5 V HSTL on same device) while maintaining signal integrity and timing closure |
| Configurable LUT RAM | Permits use of each 4-input LUT as 16×1-bit synchronous RAM or combined into 32×1-bit/16×2-bit RAMs for compact register files |
| Dual-ported block RAM | Supports simultaneous read/write operations at independent addresses-critical for video frame buffers and real-time data streaming |
Applications
| PCI Bridge Controller | High-Speed Data Acquisition |
|---|---|
Use Scenario: Interfacing legacy PCI peripherals to modern microprocessor subsystems in industrial test equipment. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing adapter, managing PCI address/data multiplexing, arbitration, and burst transfers. Use Value: Leverages 66-MHz PCI compliance and 284 I/O to implement full 32-bit/66-MHz PCI master/slave interface without external glue logic. | Use Scenario: Capturing synchronized analog sensor streams (e.g., 16-channel 100 MSPS ADC) in radar or medical imaging systems. IC Role / Device Role / Timing Role: FPGA serves as real-time preprocessing engine, performing decimation, filtering, and packetization before transmission. Use Value: Uses 57,344-bit block RAM for deep acquisition buffers and LUT-based shift registers for high-speed parallel-to-serial conversion. |
| Communications Protocol Gateway | Reconfigurable Digital Signal Processing |
Use Scenario: Translating between proprietary fieldbus protocols (e.g., Profibus, CANopen) and Ethernet/IP in factory automation gateways. IC Role / Device Role / Timing Role: FPGA implements dual MAC layers, packet parsing, and state-machine-based protocol conversion with deterministic latency. Use Value: Exploits 200 MHz system performance and multi-standard SelectIO™ to concurrently manage 3.3 V LVTTL fieldbus and 2.5 V Ethernet PHY interfaces. | Use Scenario: Implementing adaptive FIR filters and FFT engines in software-defined radio (SDR) baseband processing. IC Role / Device Role / Timing Role: FPGA functions as hardware-accelerated DSP co-processor, offloading compute-intensive operations from host CPU. Use Value: Uses dedicated multiplier support and carry chains to achieve >100 million MAC/sec throughput within 5,292 logic cells. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200-5BG352C | Higher -5 speed grade (guaranteed >200 MHz), identical logic density and I/O count | Suitable for designs requiring tighter setup/hold margins or higher clock frequencies beyond 200 MHz | Select when timing closure fails at -4 grade or when future-proofing against process variation |
| XCV200-6BG352C | Highest -6 speed grade in family, same architecture and package, optimized for worst-case timing | Required for ultra-low-latency control loops or high-frequency sampling clock generation where sub-5 ns path delays are critical | Choose only if design requires guaranteed <4.5 ns register-to-register delay under industrial temperature range |
Compared with XCV200-4BG352C, the -5 and -6 alternatives offer progressively tighter timing guarantees without architectural change-enabling drop-in replacement in existing BG352 layouts when higher performance or margin is needed, but all three share identical pinout, memory resources, and I/O banking structure.
Availability
XCV200-4BG352C is available at Aetrix Electronics and suitable for industrial control systems, legacy communications infrastructure upgrades, and aerospace avionics retrofit programs requiring stable component supply amid obsolescence transitions.
Supply support for XCV200-4BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family-including XCV200-4BG352C-was engineered for high-performance, high-density digital system integration in telecommunications, military/aerospace, and industrial automation, emphasizing place-and-route efficiency and silicon utilization.
FAQ
Is XCV200-4BG352C still in active production?
No, XCV200-4BG352C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains traceable inventory with full lot traceability and extended lifecycle support for legacy system maintenance and repair.
What configuration modes does XCV200-4BG352C support?
XCV200-4BG352C supports four configuration modes: Master Serial (via external PROM), Slave Serial, SelectMAP™ (parallel bus), and JTAG. All modes load the same SRAM-based bitstream; JTAG is used for debugging and boundary-scan testing, while Master Serial is typical for production deployment.
Can XCV200-4BG352C interface directly with 5 V TTL devices?
Yes-XCV200-4BG352C IOBs are 5 V tolerant for LVTTL, LVCMOS2, and PCI 5 V standards when VCCO = 3.3 V. However, 5 V tolerance applies only to inputs; outputs remain 3.3 V referenced and must not drive 5 V buses directly without level-shifting circuitry.
What is the maximum operating temperature range for XCV200-4BG352C?
The "C" suffix in XCV200-4BG352C denotes Commercial temperature range: junction temperature (TJ) from 0°C to +85°C. It is not rated for industrial (–40°C to +100°C) or extended temperature operation; thermal derating is required above 85°C ambient.
Does XCV200-4BG352C include built-in debug capabilities?
Yes-XCV200-4BG352C integrates IEEE 1149.1 boundary-scan logic across all I/O and internal logic, enabling board-level interconnect testing. It also supports ChipScope™ Pro ILA cores (when implemented in design) for real-time signal visibility during system bring-up and validation of XCV200-4BG352C-based logic.
XCV200-4BG352C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 260
- Number of Gates:
- 236666
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XCV200-4BG352C FAQ
1.How can I place an order for XCV200-4BG352C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200-4BG352C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200-4BG352C reliable?
The price and inventory of XCV200-4BG352C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200-4BG352C is usually 5 days.
3.What payment methods are accepted for XCV200-4BG352C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200-4BG352C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200-4BG352C?
XCV200-4BG352C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200-4BG352C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200-4BG352C?
For technical support, including XCV200-4BG352C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200-4BG352C requirements.
6.How does Aetrix verify that XCV200-4BG352C is sourced from the original manufacturer or authorized distributors?
All XCV200-4BG352C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200-4BG352C meets industry standards.
7.What is the process for return or replacement of XCV200-4BG352C?
All XCV200-4BG352C units undergo pre-shipment inspection (PSI). If there is an issue with XCV200-4BG352C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200-4BG352C part is unused and in its original packaging.
Return procedure for XCV200-4BG352C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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