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AMD XCV200-4BG352I
- Part No.:
- XCV200-4BG352I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV200-4BG352I.pdf
- Description:
- IC FPGA 260 I/O 352MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,109
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Product details
Overview
XCV200-4BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 maximum user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV200-4BG352I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-speed programmable logic solution for legacy industrial control, telecom infrastructure, and test equipment where 200 MHz system performance, multi-standard SelectIO™ interfaces, and in-system reprogrammability are required.
Technical Context
The XCV200-4BG352I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock™ interconnect, and peripheral VersaRing™ I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLB structure contains two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for wide-function synthesis, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.
Each IOB supports 16 selectable I/O standards (e.g., LVTTL, HSTL Class IV, SSTL3), with banked VCCO/VREF management, optional weak-keeper, programmable pull-up/down, and IEEE 1149.1 boundary-scan. The device integrates 14 block SelectRAM™ modules (4,096-bit dual-ported synchronous RAM per block), configurable as various depth/width combinations up to 16×256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 236,666 - measures logic capacity using Xilinx's standard gate-equivalent metric for architectural comparison |
| Logic Cells | 5,292 - total configurable logic elements (CLBs × 4.5 LCs/CLB), each containing dual slices with LUTs and flip-flops |
| Max User I/O | 284 - available signal pins in BG352 package, excluding dedicated clock and configuration pins |
| Block RAM Bits | 57,344 - distributed across 14 × 4,096-bit dual-ported synchronous RAM blocks for data buffering and FIFOs |
| Speed Grade | -4 - specifies worst-case timing performance; supports 200 MHz system clock rates including I/O paths |
| DLL Count | 4 - dedicated delay-locked loops for advanced clock deskew, phase alignment, and jitter reduction |
| Operating Temp | –40°C to +100°C - industrial temperature range validated for extended thermal reliability in embedded systems |
Pinout & Package
Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 25 mm × 25 mm, 1.27 mm pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Four dedicated low-skew primary clock inputs feeding DLLs and global clock networks |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous input that resets configuration logic and clears internal SRAM |
| INIT_B | Configuration Status | Open-drain output indicating FPGA initialization status; pulled high externally during configuration |
| CCLK | Configuration Clock | Input clock for master serial mode; drives internal configuration shift register during bitstream loading |
| DIN / DOUT | Serial Data I/O | Single-pin bidirectional serial interface for JTAG or slave serial configuration modes |
| VCCINT | Core Supply | 2.5 V ± 3% supply for internal logic and CLBs; requires low-noise decoupling near package corners |
| VCCO_0–VCCO_7 | I/O Bank Supply | Eight independent VCCO pins (one per I/O bank) setting output voltage levels for bank-specific signaling standards |
| VREF_0–VREF_7 | I/O Reference Voltage | Eight bank-specific reference inputs for standards requiring threshold voltage (e.g., HSTL, SSTL) |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based Configuration | Enables unlimited in-system reprogramming via JTAG, SelectMAP™, or serial PROM; supports dynamic partial reconfiguration |
| SelectIO™ Interface | Supports 16 I/O standards (LVTTL, HSTL Class IV, SSTL3, GTL+, etc.) with per-bank VCCO/VREF control and 5 V-tolerant inputs |
| Distributed Memory | LUTs configurable as 16×1, 16×2, or 32×1 synchronous RAM, 16×1 dual-port RAM, or 16-bit shift register for high-speed capture |
| Dedicated Carry Logic | Two independent carry chains per CLB enable high-speed arithmetic (e.g., 32-bit adders in <8 ns) without consuming LUT resources |
| IEEE 1149.1 Boundary Scan | Fully compliant test access port (TAP) controller with instruction/data registers supporting board-level interconnect testing |
Applications
| Industrial Motion Control | Legacy Telecom Line Cards |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes in CNC machines and robotic arms using deterministic timing and parallel I/O. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom PWM generators, encoder counters, and safety-critical state machines with sub-microsecond latency. Use Value: 284 I/O pins support direct connection to motor drivers, encoders, and limit switches; DLLs ensure synchronized sampling across all axes at 200 MHz. |
Use Scenario: Protocol bridging and framing logic in TDM-based access multiplexers handling E1/T1 signals before migration to packet-based infrastructure. IC Role / Device Role / Timing Role: FPGA acts as a flexible TDM switch fabric and HDLC controller, interfacing with framer ICs and backplane buses. Use Value: 66-MHz PCI compliance enables direct attachment to host processors; SelectIO™ supports both LVTTL and HSTL for mixed-voltage backplane interfacing. |
| Automated Test Equipment (ATE) | High-Speed Data Acquisition Systems |
Use Scenario: Pin electronics per-channel logic in semiconductor testers requiring precise timing calibration and pattern generation. IC Role / Device Role / Timing Role: Configurable digital pattern generator with on-chip delay calibration, jitter-compensated clocks, and real-time pass/fail decision logic. Use Value: Four DLLs allow independent clock domain control per channel; block RAM stores test vectors and results locally to minimize bus contention. |
Use Scenario: Front-end signal conditioning and preprocessing in oscilloscopes and spectrum analyzers capturing >100 MS/s analog data streams. IC Role / Device Role / Timing Role: High-speed serializer/deserializer, decimation filter, and trigger engine implemented in logic fabric with tight timing closure. Use Value: LUT-based 16-bit shift registers capture burst-mode ADC outputs; 200 MHz system clock supports real-time FFT windowing and peak detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200-5BG352I | Higher speed grade (-5 vs. -4); 10–15% faster worst-case timing, same logic density and I/O count | Suitable for designs requiring tighter setup/hold margins or higher clock frequencies beyond 200 MHz | Select XCV200-5BG352I only if timing closure fails with -4 grade; identical pinout and configuration interface |
| XCV250-4BG352I | Higher density (284,000 system gates, 6,480 logic cells); same BG352 package and speed grade | Provides additional logic resources for more complex control planes or expanded protocol stacks without PCB change | Choose XCV250-4BG352I when design growth exceeds XCV200-4BG352I capacity but mechanical footprint must be preserved |
Compared with XCV200-4BG352I, the XCV200-5BG352I delivers improved timing margin for demanding clock domains, while the XCV250-4BG352I offers scalable logic capacity within identical packaging - both maintain full functional and pinout compatibility for drop-in upgrades in legacy industrial and telecom hardware.
Availability
XCV200-4BG352I is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom infrastructure, and automated test equipment requiring stable component supply across long-lifecycle programs.
Supply support for XCV200-4BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it delivers FPGA, adaptive SoC, and ACAP platforms.
The Virtex family was designed as Xilinx's flagship high-performance FPGA line for compute-intensive, high-bandwidth applications - emphasizing silicon efficiency, clock management, and I/O flexibility in 2.5 V architectures.
FAQ
Is XCV200-4BG352I still in production?
No, XCV200-4BG352I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and provides traceable, tested units for ongoing maintenance and repair of installed systems.
What configuration modes does XCV200-4BG352I support?
XCV200-4BG352I supports four configuration modes: master serial (loads bitstream from external PROM), slave serial (bitstream driven by external controller), SelectMAP™ (8- or 16-bit parallel interface), and JTAG (boundary-scan programming via IEEE 1149.1 TAP). All modes use the same CCLK, DIN/DOUT, and PROGRAM_B pins.
Can XCV200-4BG352I interface with 3.3 V peripherals?
Yes, XCV200-4BG352I supports 3.3 V I/O standards including LVTTL, PCI 3.3 V, and SSTL3 via its SelectIO™ buffers. Each I/O bank uses a dedicated VCCO pin; connecting VCCO to 3.3 V enables full compatibility with 3.3 V peripherals while maintaining 2.5 V core logic operation.
Does XCV200-4BG352I include on-chip memory for data storage?
Yes, XCV200-4BG352I integrates 57,344 bits of block RAM across 14 dedicated 4,096-bit dual-ported synchronous RAM modules, plus distributed memory using LUTs as 16-bit RAM or shift registers - enabling FIFOs, buffers, and lookup tables without external memory.
What is the significance of the "I" suffix in XCV200-4BG352I?
The "I" in XCV200-4BG352I denotes Industrial temperature grade (–40°C to +100°C junction temperature), validated for reliable operation in harsh environments such as factory automation, outdoor telecom cabinets, and power generation control systems - distinct from Commercial ("C") grade devices rated 0°C to +85°C.
XCV200-4BG352I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 260
- Number of Gates:
- 236666
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XCV200-4BG352I FAQ
1.How can I place an order for XCV200-4BG352I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200-4BG352I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200-4BG352I reliable?
The price and inventory of XCV200-4BG352I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200-4BG352I is usually 5 days.
3.What payment methods are accepted for XCV200-4BG352I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200-4BG352I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200-4BG352I?
XCV200-4BG352I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200-4BG352I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200-4BG352I?
For technical support, including XCV200-4BG352I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200-4BG352I requirements.
6.How does Aetrix verify that XCV200-4BG352I is sourced from the original manufacturer or authorized distributors?
All XCV200-4BG352I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200-4BG352I meets industry standards.
7.What is the process for return or replacement of XCV200-4BG352I?
All XCV200-4BG352I units undergo pre-shipment inspection (PSI). If there is an issue with XCV200-4BG352I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200-4BG352I part is unused and in its original packaging.
Return procedure for XCV200-4BG352I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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