AMD XCV200-4FG256C

Overview

XCV200-4FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 256-pin Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUT-based RAM/shift register modes), and supports 16 SelectIO™ interface standards including PCI 66 MHz compliance and hot-swap capability for Compact PCI.

For engineers reviewing the XCV200-4FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and real-world FPGA integration considerations for high-speed digital systems requiring reconfigurable logic at up to 200 MHz system clock rates.

Technical Context

The XCV200-4FG256C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual-port synchronous storage elements.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only if compatible with shared VCCO (e.g., LVTTL, PCI, SSTL3 at 3.3 V) and permits one VREF voltage per bank. The FG256 package provides 176 user I/O pins - consistent with Table 3 in DS003-1 v4.0 - and requires configuration via master serial, slave serial, JTAG, or SelectMAP™ mode.

Key Specifications

Pinout & Package

Package: 256-pin Fine-pitch Ball Grid Array (FG256), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C). Pinout conforms to DS003-4 (v4.0) Module 4 - Pinout Tables - with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and JTAG boundary-scan interface (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV200-4FG256C, the -5 speed grade offers improved timing margin without architectural change, while the BG256 variant trades finer pitch for higher I/O count - both require PCB redesign but preserve functional equivalence and toolchain compatibility.

Availability

XCV200-4FG256C is available at Aetrix Electronics and suitable for industrial motion controllers, PCI interface cards, high-speed data acquisition systems, and legacy protocol gateways requiring stable component supply throughout extended product lifecycles.

Supply support for XCV200-4FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family - including XCV200-4FG256C - was engineered for high-performance, high-density reconfigurable computing in telecommunications infrastructure, test equipment, and industrial automation where deterministic timing and multi-standard I/O flexibility are critical.

FAQ

What is the maximum operating frequency supported by the XCV200-4FG256C?

The XCV200-4FG256C supports synchronous system clock rates up to 200 MHz, including I/O paths, under worst-case timing conditions as specified in DS003-3 (v4.0). This figure reflects register-to-register performance measured with the -4 speed grade and accounts for DLL-compensated clock distribution. Real-world achievable frequency depends on design complexity, placement, and routing; typical high-utilization designs achieve 120–180 MHz.

Does the XCV200-4FG256C support hot-swap operation in Compact PCI systems?

Yes, the XCV200-4FG256C is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets PCI 66 MHz electrical specifications and includes robust ESD protection, programmable slew rate control, and weak-keeper circuits to maintain valid logic states during insertion/removal. These features are documented in DS003-1 Section "Features" and DS003-2 Section "Input/Output Block".

How many block RAMs does the XCV200-4FG256C contain, and what are their configurations?

The XCV200-4FG256C contains 14 block SelectRAM units, totaling 57,344 bits of memory. Each block is a fully synchronous dual-ported 4096-bit RAM with independent address, data, and control buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible bus-width conversion and ping-pong buffering as detailed in DS003-2 Table 4 and Figure 6.

Can the XCV200-4FG256C implement both LVTTL and SSTL2 I/O standards simultaneously?

Yes, the XCV200-4FG256C supports concurrent LVTTL (3.3 V) and SSTL2 (2.5 V) I/O standards - but only in separate I/O banks. LVTTL requires VCCO = 3.3 V and is 5 V tolerant; SSTL2 requires VCCO = 2.5 V and uses VREF = 1.25 V. Since each bank enforces a single VCCO and VREF, mixing these standards requires assigning them to different banks (e.g., Bank 0 for LVTTL, Bank 1 for SSTL2), as defined in DS003-2 Table 2 and I/O Banking section.

Is the XCV200-4FG256C still in active production or considered obsolete?

The XCV200-4FG256C is marked as obsolete per DS003-1 (v4.0) Revision History dated March 2013, which states "The products listed in this data sheet are obsolete. See XCN10016 for further information." However, Aetrix Electronics maintains legacy supply chain access for this device through authorized distributors and surplus inventory channels to support long-life industrial and aerospace programs.