AMD XCV200-4FG256I

Overview

XCV200-4FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells in a 28×42 CLB array, and 284 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets plus 24 secondary local clock nets, and 57,344 bits of block SelectRAM for high-speed synchronous dual-port memory applications in telecom infrastructure and industrial control systems.

For engineers reviewing the XCV200-4FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -4 speed grade (200 MHz system performance), industrial temperature range (–40°C to +100°C), FG256 package compatibility with PCI-66 MHz compliance, and support for 16 SelectIO™ standards including LVTTL, HSTL Class IV, and SSTL2.

Technical Context

The XCV200-4FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 12 Longlines for full-chip signal distribution, and VersaRing™ I/O routing for pin-locking flexibility. Its CLBs contain four logic cells each, with dedicated carry chains per slice and F5/F6 multiplexers enabling up to 19-input logic functions.

Each IOB supports independent input/output flip-flops with programmable set/reset polarity, optional input delay for zero pad-to-pad hold time, and configurable drive strength (up to 24 mA source / 48 mA sink). Block SelectRAM provides fully synchronous dual-ported 4k-bit RAMs with independent port widths (1–16 bits) and depth/width aspect ratios defined by ADDR and DATA bus sizing.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 solder balls, 1.0 mm pitch, 17 mm × 17 mm body size, and industrial-grade thermal performance (T_J = –40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV200-4FG256I, the XCV200-5FG256I offers higher clock performance without changing logic resources or pinout, while the XCV300-4FG456C trades industrial temperature tolerance for increased gate count and I/O - making it appropriate for cost-optimized commercial systems requiring headroom.

Availability

XCV200-4FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging backend processing, and automated test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV200-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed for high-performance system-level integration in applications demanding speed, density, and flexible I/O - including wireless infrastructure, defense electronics, and high-end instrumentation.

FAQ

What is the maximum operating frequency supported by the XCV200-4FG256I?

The XCV200-4FG256I is rated for 200 MHz system clock performance under worst-case industrial conditions (–40°C to +100°C) as specified in DS003-1 v4.0. This includes synchronous register-to-register paths and I/O timing. Measured performance for representative circuits such as pipelined multipliers and address decoders ranges from 4.1 ns to 7.2 ns propagation delay, confirming the -4 speed grade's timing guarantee for the XCV200-4FG256I.

Does the XCV200-4FG256I support hot-swap operation in Compact PCI systems?

Yes, the XCV200-4FG256I supports hot-swappable operation in Compact PCI systems as explicitly stated in DS003-1 v4.0 Section "Features". Its I/O architecture meets Compact PCI hot-swap requirements through controlled power-up sequencing, high-impedance default states on configuration pins, and robust ESD protection on all I/O pads - ensuring safe insertion/removal without disrupting backplane operation.

How many block RAMs does the XCV200-4FG256I contain, and what are their configurations?

The XCV200-4FG256I contains 14 block SelectRAMs totaling 57,344 bits, as confirmed in DS003-2 Table 3. Each block is a fully synchronous dual-ported 4096-bit RAM with independently configurable port widths (1–16 bits) and depths (1–4096), supporting aspect ratios from 1×4096 to 16×256. These blocks are arranged in two vertical columns along the chip edges and connect directly to CLBs via dedicated routing.

What I/O standards are supported by the XCV200-4FG256I, and how are they grouped?

The XCV200-4FG256I supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI (3.3 V and 5 V), HSTL Classes I/III/IV, SSTL2/SSTL3, GTL/GTL+, and CTT, as listed in DS003-2 Table 1. These are grouped into eight I/O banks (two per side), each requiring shared VCCO and, where applicable, a common VREF voltage. Bank-level constraints ensure compatible standards (e.g., HSTL I/III/IV at 1.5 V) can coexist within one bank.

Is the XCV200-4FG256I still in active production, and what is its lifecycle status?

No, the XCV200-4FG256I is obsolete. DS003-1 v4.0 (March 2013) explicitly states "The products listed in this data sheet are obsolete. See XCN10016 for further information." While Aetrix Electronics maintains legacy supply channels for this part, design-in is not recommended for new projects. Obsolescence notice XCN10016 confirms end-of-life status with last-time-buy windows and cross-reference guidance to newer Virtex families.