AMD XCV200-4FG456C

Overview

XCV200-4FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block SelectRAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV200-4FG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and migration guidance from Virtex-1 to later families - all grounded in DS003-1 (v4.0) and DS003-4 documentation.

Technical Context

The XCV200-4FG456C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O interconnect, and dedicated horizontal 3-state bus lines per CLB row. Its CLBs contain two slices each with four 4-input LUTs, carry chains, and dual-port synchronous storage elements configurable as flip-flops or latches.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class IV, and SSTL2/3, with banked VCCO (1.5 V / 2.5 V / 3.3 V) and VREF (0.75–1.5 V) constraints. The device uses a 0.22 μm 5-layer metal CMOS process and is fully IEEE 1149.1 boundary-scan compliant.

Key Specifications

Pinout & Package

Package: FG456 (Fine-pitch Ball Grid Array, 456 balls, 1.0 mm pitch, 27 × 27 mm body). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - full pin function mapping available in official pinout tables. I/O banks are organized across eight edges (Bank 0–7), each requiring dedicated VCCO and optional VREF supply.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-4FG456C, the -5 and -6 variants offer progressively tighter timing budgets and higher guaranteed clock frequencies but share identical logic density, I/O count, package, and feature set - making them drop-in replacements where board layout and power delivery support the increased dynamic current.

Availability

XCV200-4FG456C is available at Aetrix Electronics and suitable for PCI interface bridging, high-speed data acquisition, telecom line card development, and reconfigurable DSP applications requiring stable component supply across long-lifecycle industrial programs.

Supply support for XCV200-4FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was designed for demanding applications requiring high logic density, multi-standard I/O, and deterministic clock management - targeting communications infrastructure, test & measurement, and high-end embedded systems.

FAQ

Is XCV200-4FG456C still in production?

No, XCV200-4FG456C is obsolete per Xilinx documentation DS003-1 (v4.0) dated March 2013 and XCN10016. Aetrix Electronics maintains limited legacy inventory with full traceability and offers technical migration support to Spartan-7 or Artix-7 equivalents where feasible.

What is the maximum operating temperature for XCV200-4FG456C?

The XCV200-4FG456C is rated for commercial temperature range: junction temperature (TJ) from 0°C to +85°C. The "C" suffix in the part number explicitly denotes this grade; industrial-grade variants use "I" and support –40°C to +100°C.

Does XCV200-4FG456C support JTAG programming?

Yes, XCV200-4FG456C fully supports IEEE 1149.1 JTAG programming via TCK, TMS, TDI, and TDO pins. It enables in-circuit configuration, boundary-scan testing, and debug access without requiring dedicated configuration PROMs.

Can XCV200-4FG456C interface directly with DDR SDRAM?

No, XCV200-4FG456C does not natively support DDR SDRAM signaling. Its SelectIO™ standards include SSTL2 Class I/II (for SDR SDRAM) but lack the phase-aligned strobes and fly-by topology support required for DDR. External PHY or discrete logic is needed for DDR interfacing.

What configuration modes does XCV200-4FG456C support?

XCV200-4FG456C supports four configuration modes: Master Serial (via external PROM), Slave Serial, SelectMAP™ (parallel host CPU loading), and JTAG. All modes load the same SRAM-based bitstream; mode selection is controlled by M0–M2 pins at power-up.