AMD XCV200-4FG456I

Overview

XCV200-4FG456I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUTs configurable as 16-bit RAM/shift register), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV200-4FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include industrial temperature range (–40°C to +100°C), speed grade –4 (200 MHz system performance), SelectIO™ multi-standard I/O support (LVTTL, LVCMOS2, HSTL, SSTL), and dual-port block RAM configuration capability.

Technical Context

The XCV200-4FG456I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLB structure contains two slices each with four logic cells (LCs), carry chains, F5/F6 multiplexers for 5-/6-input functions, and BUFTs for internal 3-state bus driving.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. I/O banking enforces VCCO and VREF voltage grouping across eight banks, enabling mixed-voltage signaling within constraints defined in DS003-2.

Key Specifications

Pinout & Package

Package: 456-ball Fine-pitch Ball Grid Array (FG456), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-4FG456I, the –5 variant improves timing margin without altering footprint or power profile, while the XCV300-4FG456I increases gate count by 36% within identical mechanical and thermal constraints - both serve as validated migration paths for design scalability.

Availability

XCV200-4FG456I is available at Aetrix Electronics and suitable for industrial motion control, telecom infrastructure, medical imaging, and automated test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV200-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions since 1984 for high-performance computing, communications, and aerospace applications.

The Virtex family was designed for high-speed, high-density system integration - targeting applications demanding advanced clock management, multi-standard I/O, and embedded memory, where flexibility and performance outweigh mask-programmed ASIC cost advantages.

FAQ

What is the maximum operating frequency supported by XCV200-4FG456I?

XCV200-4FG456I supports synchronous system clock rates up to 200 MHz under worst-case industrial conditions (–40°C to +100°C), verified by Xilinx timing analysis using speed grade –4 characterization. This includes full I/O path timing and meets 66-MHz PCI compliance requirements. Performance varies by design topology, but register-to-register paths achieve ≤5.0 ns propagation delay.

Does XCV200-4FG456I support hot-swap operation in CompactPCI systems?

Yes, XCV200-4FG456I is explicitly designed for hot-swappable CompactPCI applications. Its I/O architecture, power sequencing behavior, and robust ESD protection (per DS003-1) meet the electrical and timing requirements for live insertion and removal. The device enters high-impedance state on power loss and resumes operation within 100 ms after stable VCCINT/VCCO restoration.

How many block RAMs does XCV200-4FG456I contain, and what configurations are supported?

XCV200-4FG456I contains 14 block SelectRAM modules, totaling 57,344 bits of dedicated dual-port memory. Each 4096-bit block supports independent configuration of port widths (1–16 bits) and depths (256–4096), enabling synchronous dual-port operation with full bus-width conversion - e.g., 8-bit write port and 32-bit read port on the same block.

Can XCV200-4FG456I interface directly with DDR SDRAM using SSTL2 standards?

Yes, XCV200-4FG456I supports SSTL2 Class I and II standards natively through its SelectIO™ I/O banks. When configured with VCCO = 2.5 V and appropriate VREF = 1.25 V, it drives and receives DDR SDRAM command/address/control signals and bidirectional data lines with guaranteed setup/hold timing per JEDEC specifications, eliminating external level translators.

Is XCV200-4FG456I still in active production, and what lifecycle support does Aetrix provide?

XCV200-4FG456I is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), but Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination including last-time-buy planning, cross-reference guidance, and migration path support to Virtex-II or Spartan-3 families where functionally appropriate.