AMD XCV200-4PQ240C

Overview

XCV200-4PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 236,666 system gates, 5,292 logic cells in a 28×42 CLB array, and 284 user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP) package. It supports 66-MHz PCI compliance, hot-swappable Compact PCI operation, and features four dedicated delay-locked loops (DLLs) for advanced clock control - deployed in high-speed industrial control and communications interface logic.

For engineers reviewing the XCV200-4PQ240C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, 57,344 bits of block SelectRAM, 14 dedicated 4k-bit dual-ported RAM blocks, LUT-configurable memory modes, and multi-standard SelectIO™ support across 16 interface standards including LVTTL, SSTL2/3, HSTL, and GTL+.

Technical Context

The XCV200-4PQ240C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLBs contain four logic cells each, with dedicated carry chains per slice and F5/F6 multiplexers supporting up to 19-input logic functions.

Each IOB supports independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, and configurable weak-keeper circuits. I/O banking enforces voltage domain isolation: eight banks require shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V), and VREF-dependent standards (e.g., HSTL, SSTL) are restricted to one reference voltage per bank.

Key Specifications

Pinout & Package

Package: 240-pin Plastic Quad Flat Pack (PQFP), 32.0 mm × 32.0 mm body, 0.5 mm pitch, JEDEC MS-026 compliant. Thermal pad not present; lead finish is matte tin.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-4PQ240C, the XCV200-5PQ240C offers higher timing margin for demanding clock domains, while the XCV300-4PQ240C provides headroom for logic growth - both retain identical package, pinout, and configuration methodology, enabling drop-in migration paths within the Virtex family.

Availability

XCV200-4PQ240C is available at Aetrix Electronics and suitable for industrial control, telecommunications infrastructure, and test equipment applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV200-4PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design tools now integral to adaptive computing.

The Virtex family was engineered for high-performance, high-density logic replacement in systems demanding >100 MHz operation, multi-standard I/O, and embedded memory - targeting communications infrastructure, military/aerospace, and industrial automation.

FAQ

What is the maximum operating temperature range for the XCV200-4PQ240C?

The XCV200-4PQ240C is rated for commercial temperature operation: junction temperature (T_J) from 0°C to +85°C. This specification is indicated by the "C" suffix in the part number and applies to all electrical and timing parameters in the DS003-1 datasheet. Operation outside this range may result in timing violations or configuration loss. The device includes an on-die temperature sensor diode for monitoring, but thermal derating beyond 85°C is not guaranteed.

Does the XCV200-4PQ240C support JTAG boundary scan, and what standard does it comply with?

Yes, the XCV200-4PQ240C fully supports IEEE 1149.1 boundary scan functionality via dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, programming, and debug visibility across the entire CLB and IOB fabric. All Virtex devices, including XCV200-4PQ240C, implement mandatory boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, IDCODE, BYPASS) and optional ones (CLAMP, HIGHZ) as defined in the IEEE 1149.1-1990 standard.

Can the XCV200-4PQ240C be configured using a serial PROM, and which modes support this?

Yes, the XCV200-4PQ240C supports master serial configuration using an external serial PROM connected to the CCLK, DIN, and DONE pins. In this mode, the FPGA drives CCLK and reads configuration data from the PROM. This is distinct from slave serial or SelectMAP™ modes, which require an external controller. The M0–M2 pins must be strapped to "001" to select master serial mode, and the PROM must be compatible with Xilinx's XC18V00 or XCFxx series PROMs.

How many block SelectRAM modules does the XCV200-4PQ240C contain, and what are their port configurations?

The XCV200-4PQ240C contains 14 block SelectRAM modules, each providing 4,096 bits of synchronous dual-ported RAM. Each block supports independent configuration of port widths (1–16 bits) and depths (256–4096), with valid combinations listed in Table 4 of DS003-2 - e.g., 16×256, 8×512, or 1×4096. Both ports have separate clock, enable, write-enable, and reset controls, enabling true simultaneous read/write operations across different address spaces.

Is the XCV200-4PQ240C still in production, and what is its obsolescence status?

No - the XCV200-4PQ240C is obsolete. Per DS003-1 (v4.0) dated March 1, 2013, all Virtex devices, including XCV200-4PQ240C, are listed as "Product Obsolete/Under Obsolescence". Xilinx issued discontinuation notice XCN10016, and no new manufacturing lots have been produced since ~2005. Aetrix Electronics supplies remaining authorized inventory with full traceability and extended lifecycle support for legacy system maintenance.