AMD XCV200-5BG256I

Overview

XCV200-5BG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV200-5BG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (200 MHz system performance), industrial temperature range (–40°C to +100°C), BG256 package compatibility, and support for multi-standard SelectIO™ interfaces including LVTTL, HSTL, and SSTL.

Technical Context

The XCV200-5BG256I implements a hierarchical routing architecture with general-purpose routing matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLB structure contains two slices, each with four 4-input LUTs, dedicated carry chains, and configurable storage elements supporting synchronous/asynchronous set/reset.

It integrates 14 dual-ported 4k-bit block RAMs (57,344 total bits), supports up to 16 I/O standards per bank with independent VCCO/VREF management, and provides IEEE 1149.1 boundary-scan testability alongside die-temperature sensor diode functionality.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, 17 × 17 mm body size, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV200-5BG256I, the XCV200-6BG256I delivers higher timing margin without changing logic resources or footprint, while the XCV300-5BG352I offers gate/I/O scalability at the cost of larger PCB area and increased power - both require revalidation but no architectural redesign.

Availability

XCV200-5BG256I is available at Aetrix Electronics and suitable for industrial automation controllers, PCI-based instrumentation, and avionics sensor interface modules requiring stable component supply across extended product lifecycles.

Supply support for XCV200-5BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed for high-performance, high-density applications demanding advanced clock management, multi-standard I/O, and hierarchical memory - targeting telecom infrastructure, military systems, and scientific instrumentation.

FAQ

What is the maximum system clock frequency supported by the XCV200-5BG256I?

The XCV200-5BG256I is rated for synchronous system clock operation up to 200 MHz under worst-case timing conditions, as confirmed by its -5 speed grade designation in the Virtex DS003-1 datasheet. This includes full I/O timing compliance and accounts for process, voltage, and temperature variations across the industrial temperature range (–40°C to +100°C). The XCV200-5BG256I achieves this using four integrated delay-locked loops (DLLs) for precise clock deskew and phase alignment.

Does the XCV200-5BG256I support hot-swap operation in Compact PCI systems?

Yes, the XCV200-5BG256I is explicitly specified as hot-swappable for Compact PCI applications per the Virtex family documentation. Its I/O architecture meets Compact PCI hot-swap requirements through controlled slew rates, drive strength programmability, and robust ESD protection on all user I/O pins. The XCV200-5BG256I also complies fully with 66-MHz PCI electrical specifications, enabling direct integration into hot-pluggable carrier cards without additional interface logic.

How many block RAMs does the XCV200-5BG256I contain, and what is their configuration flexibility?

The XCV200-5BG256I contains 14 dedicated block SelectRAMs, totaling 57,344 bits of memory. Each block is a fully synchronous, dual-ported 4096-bit RAM with independent address and data buses per port. Width/depth configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion (e.g., 16-bit write / 32-bit read) without external glue logic. The XCV200-5BG256I supports true dual-port operation with no read/write collision restrictions.

What I/O standards are supported by the XCV200-5BG256I, and how are they managed across banks?

The XCV200-5BG256I supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Classes I/III/IV, SSTL2/3 Classes I/II, GTL/GTL+, and CTT. These are organized across eight I/O banks (two per side), each with dedicated VCCO and VREF pins. Within each bank, only standards sharing the same VCCO voltage (e.g., 3.3 V for PCI/LVTTL/SSTL3) may be mixed; VREF-dependent standards (e.g., HSTL, SSTL) require common VREF per bank. The XCV200-5BG256I enforces these constraints via internal bank isolation.

Is the XCV200-5BG256I still in production, and what is its obsolescence status?

The XCV200-5BG256I is listed as obsolete/under obsolescence per the Virtex DS003-1 (v4.0) datasheet dated March 2013, with cross-reference to XCN10016 for discontinuation details. While no longer manufactured by Xilinx, Aetrix Electronics maintains legacy inventory and provides traceable, tested units for ongoing maintenance and repair of installed systems. The XCV200-5BG256I remains suitable for long-lifecycle industrial and defense applications where form-fit-function replacement is required.