AMD XCV200-5BG352C

Overview

XCV200-5BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-5BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility, and migration guidance from Virtex family documentation modules DS003-1 through DS003-4.

Technical Context

The XCV200-5BG352C implements a regular array architecture with configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix including general-purpose channels, local VersaBlock paths, and dedicated carry chains. Each CLB contains four logic cells with 4-input LUTs, carry logic, and dual flip-flops per slice.

Its IO subsystem supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2-organized across eight I/O banks with independent VCCO and VREF supply domains. The device integrates 14 dual-ported 4k-bit block RAMs (57,344 total bits), each configurable for independent port widths (1–16 bits) and depths (4096–256).

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), RoHS-compliant, 25 mm × 25 mm footprint, 1.27 mm ball pitch, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-5BG352C, the -6 variant offers improved timing margin without architectural change, while XCV300-5BG432C provides higher density and I/O count at the cost of package size increase-both maintain identical toolchain compatibility and SelectIO™ feature set.

Availability

XCV200-5BG352C is available at Aetrix Electronics and suitable for high-reliability industrial control systems, legacy avionics test equipment upgrades, and PCI-based data acquisition platforms requiring stable component supply throughout extended product lifecycles.

Supply support for XCV200-5BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures widely adopted in communications, aerospace, and industrial markets.

The Virtex family-including XCV200-5BG352C-was engineered for high-performance, high-density logic replacement in systems demanding 200 MHz operation, multi-standard I/O, and embedded memory, targeting applications where ASIC non-recurring engineering costs and long lead times were prohibitive.

FAQ

What is the maximum operating frequency supported by the XCV200-5BG352C?

The XCV200-5BG352C supports a maximum system clock frequency of 200 MHz, including I/O timing, as validated under worst-case commercial conditions (0°C to +85°C) and speed grade -5. This rating applies to synchronous register-to-register paths and is confirmed in DS003-1 Table 2 and DS003-3 switching characteristics. Actual design frequency depends on placement, routing, and logic depth-but the -5 grade guarantees timing closure up to this limit.

Does the XCV200-5BG352C support hot-swap capability for Compact PCI applications?

Yes, the XCV200-5BG352C explicitly supports hot-swappable operation in Compact PCI systems, as documented in DS003-1 Features section and Architecture overview. Its I/O structure, power sequencing behavior, and robust ESD protection (per DS003-2 IOB description) meet the electrical and timing requirements for safe insertion/removal while the backplane remains powered.

How many block RAMs does the XCV200-5BG352C contain, and what are their configurations?

The XCV200-5BG352C contains 14 block SelectRAM units totaling 57,344 bits, as specified in DS003-2 Table 3 and Module 2 architectural description. Each block is a fully synchronous dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096), enabling flexible FIFO, buffer, or lookup table implementations without consuming CLB resources.

Can the XCV200-5BG352C interface directly with 5 V tolerant peripherals?

Yes, the XCV200-5BG352C supports 5 V tolerance on LVTTL, LVCMOS2, and PCI 5 V inputs, as confirmed in DS003-2 Table 1 and IOB protection description. This is achieved via internal Zener-like clamping structures. However, outputs are not 5 V tolerant-VCCO must be set to 3.3 V for these standards, and 5 V-tolerant inputs cannot coexist in the same I/O bank with standards requiring VREF (e.g., HSTL).

What development tools are compatible with the XCV200-5BG352C?

The XCV200-5BG352C is supported by Xilinx Foundation™ and Alliance Series™ Development Systems, as stated in DS003-1 Features and DS003-2 Architectural Description. These tools provide schematic entry, VHDL/Verilog synthesis, place-and-route, timing analysis, and bitstream generation specifically validated for Virtex-1 architecture-including XCV200-5BG352C pinout and speed grade constraints.