AMD XCV200-5BG352I

Overview

XCV200-5BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUTs configurable as 16-bit RAM or shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-5BG352I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB slice structure, and SelectIO™ standard compatibility - all critical for high-speed interface design, PCI-compliant system integration, and legacy FPGA migration planning.

Technical Context

The XCV200-5BG352I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices each, with four 4-input LUTs, dedicated carry chains per slice, F5/F6 multiplexers for 5–19 input logic, and dual-port 4k-bit block RAMs organized in two full-height columns.

Each IOB supports programmable I/O standards including LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Class IV (200 MHz), SSTL2/3, GTL+, and CTT, with banked VCCO and VREF constraints: eight independent I/O banks, each requiring uniform VCCO voltage and at most one VREF value; 5 V tolerance applies only to LVTTL, LVCMOS2, and PCI 5 V inputs.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Pinout defined in DS003-4 (v4.0), Module 4: Pinout Tables - includes 284 user I/O pins distributed across eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), JTAG boundary-scan pins (TCK/TMS/TDI/TDO), configuration pins (INIT, PROGRAM, CCLK, DIN), and power/ground balls grouped by bank and function.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV200-5BG352I, the XCV200-6BG352I offers higher timing margin at identical density and package, while the XCV300-5BG432C trades industrial temperature support for increased gate count and I/O - both require no RTL changes but differ in thermal validation scope and board layout impact.

Availability

XCV200-5BG352I is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, CompactPCI hot-swap managers, and legacy ASIC emulation platforms requiring stable component supply across extended product lifecycles.

Supply support for XCV200-5BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and established industry standards for reconfigurable computing.

The Virtex family - including XCV200-5BG352I - was designed for high-performance, high-density digital system integration in telecommunications infrastructure, military/aerospace systems, and industrial automation where ASIC-like performance meets FPGA flexibility.

FAQ

What is the maximum operating frequency supported by the XCV200-5BG352I?

The XCV200-5BG352I supports synchronous system clock rates up to 200 MHz, including I/O timing. This is guaranteed under worst-case conditions for the -5 speed grade and confirmed by Xilinx benchmarking of register-to-register paths, adders, and multiplexers. Real-world performance depends on design placement and routing but consistently achieves ≥180 MHz in LVTTL and HSTL Class IV I/O standards.

Does the XCV200-5BG352I support 5 V tolerant I/O?

Yes, the XCV200-5BG352I supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, implemented via on-chip Zener-like clamping structures. However, 5 V tolerance applies only to inputs - outputs are strictly 2.5 V core and 1.5/2.5/3.3 V I/O compatible. Outputs must never be driven into 5 V buses without external level-shifting circuitry.

How many block RAMs does the XCV200-5BG352I contain, and what are their configurations?

The XCV200-5BG352I contains 14 block SelectRAMs totaling 57,344 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independent address/data/control per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion and simultaneous read/write operations for FIFOs and frame buffers.

Can the XCV200-5BG352I be configured in master serial mode?

Yes, the XCV200-5BG352I supports master serial configuration mode, where the FPGA drives the CCLK signal and reads configuration data from an external serial PROM. This mode requires external 2.5 V PROM with compatible timing and is enabled by pulling the MODE pins to 001. All four configuration modes (master serial, slave serial, SelectMAP, and JTAG) are fully supported and documented in DS003-3.

Is the XCV200-5BG352I still in production, and what is its obsolescence status?

The XCV200-5BG352I is marked as obsolete/under obsolescence per Xilinx documentation DS003-1 (v4.0) dated March 2013. While no longer manufactured, Aetrix Electronics maintains legacy inventory with traceable sourcing and provides lifecycle availability coordination, including last-time-buy planning and cross-reference support for migration paths to newer Xilinx families.