AMD XCV200-5FG256C

Overview

XCV200-5FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), hierarchical SelectRAM™ memory (57,344 block RAM bits + distributed LUT RAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV200-5FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (200 MHz system performance), FG256 package thermal and routing constraints, dual-port block RAM configuration flexibility, and SelectIO™ interface compatibility with LVTTL, LVCMOS2, HSTL, and SSTL standards.

Technical Context

The XCV200-5FG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs) containing four logic cells each, two per slice, and dedicated carry chains enabling high-speed arithmetic. Its 28×42 CLB array supports pipelined multipliers (8×8 in 5.1 ns), register-to-register paths at ≤5.0 ns, and 16:1 multiplexers in 5.4 ns under worst-case timing.

It features eight I/O banks with independent VCCO and VREF supply domains, supporting mixed-voltage signaling (e.g., 3.3 V LVTTL and 1.5 V HSTL Class IV on separate banks), IEEE 1149.1 boundary-scan, and hot-swap capability for Compact PCI systems. The device uses a 0.22 μm 5-layer-metal CMOS process and is 100% factory tested.

Key Specifications

Pinout & Package

Package: FG256 - 256-ball fine-pitch ball grid array (1.0 mm pitch), 17 mm × 17 mm body size, standard JEDEC MO-205AC footprint. Thermal resistance θJA ≈ 32°C/W (typical, still-air).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-5FG256C, the -6 variant offers improved timing headroom without changing footprint or functionality, while the XCV300-5FG456C provides higher density and I/O at the cost of board-level redesign - both maintain identical Virtex architecture, SelectIO support, and development ecosystem compatibility.

Availability

XCV200-5FG256C is available at Aetrix Electronics and suitable for industrial control systems, legacy telecom infrastructure upgrades, and aerospace avionics retrofit programs requiring stable component supply amid long product lifecycles.

Supply support for XCV200-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex family - including XCV200-5FG256C - was engineered for high-speed, high-density logic replacement in demanding applications such as communications infrastructure, military systems, and scientific instrumentation where ASIC non-recurring engineering costs were prohibitive.

FAQ

Is XCV200-5FG256C still in production or supported?

XCV200-5FG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and no longer manufactured. However, Aetrix Electronics maintains verified legacy inventory with full traceability and extended lifecycle support for existing designs requiring replacement or repair. Xilinx provides archived documentation and ISE design tools for continued development.

What configuration modes does XCV200-5FG256C support?

XCV200-5FG256C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (configured by external controller), SelectMAP™ (parallel configuration via 8- or 16-bit bus), and JTAG (boundary-scan programming and debugging). All modes use SRAM-based configuration, requiring reinitialization at power-up.

Can XCV200-5FG256C interface directly with 5 V logic?

XCV200-5FG256C IOBs are 5 V tolerant only for specific standards: LVTTL, LVCMOS2, and PCI 5 V. Inputs tolerate 5 V regardless of VCCO setting, but outputs drive only up to VCCO (max 3.3 V). For true 5 V bidirectional interfacing, external level-shifting circuitry is required - the device itself does not generate or accept 5 V output signals.

How many clock regions and DLLs are available in XCV200-5FG256C?

XCV200-5FG256C contains four dedicated delay-locked loops (DLLs) and four primary low-skew global clock distribution nets (GCLK0–GCLK3), each feeding all CLBs and IOBs. There are no defined "clock regions" - instead, clock routing uses hierarchical nets and local routing to minimize skew across the entire 28×42 CLB array.

Does XCV200-5FG256C include on-die temperature sensing?

Yes, XCV200-5FG256C integrates a calibrated die-temperature sensor diode. This analog output can be read via external circuitry (e.g., ADC) to monitor junction temperature in real time - a feature used for thermal management in high-power or sealed-environment applications where the XCV200-5FG256C operates near thermal limits.