AMD XCV200-5FG256I

Overview

XCV200-5FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells in a 28×42 CLB array, and 284 user I/O pins in a 256-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block SelectRAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV200-5FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specifications, CLB-level timing parameters, and migration guidance from Virtex-1 generation FPGAs.

Technical Context

The XCV200-5FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, and F5/F6 multiplexers supporting up to 19-input functions.

Each IOB supports 16 SelectIO™ standards-including LVTTL, HSTL Class IV, SSTL2/3, and GTL+-with independent VCCO per I/O bank, programmable slew rate, drive strength up to 24 mA source / 48 mA sink, and IEEE 1149.1 boundary-scan. The device uses four primary low-skew global clock nets plus 24 secondary local clock nets, all synchronized via DLLs with jitter compensation.

Key Specifications

Pinout & Package

Package: 256-ball Fine-pitch Ball Grid Array (FG256), 1.0 mm pitch, 17×17 array, RoHS-compliant. Pinout conforms to DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG TAP controller (TCK, TMS, TDI, TDO), and VCCO/VREF pins assigned per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-5FG256I, the -6 variant offers tighter timing margins for robustness across voltage/temperature extremes, while the XCV300-5FG456C provides scalable gate count and I/O at the cost of industrial temperature qualification.

Availability

XCV200-5FG256I is available at Aetrix Electronics and suitable for high-reliability industrial control, legacy system upgrades, and aerospace subsystems requiring stable component supply across extended product lifecycles.

Supply support for XCV200-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for high-performance digital system design.

The Virtex family was designed as Xilinx's flagship high-density, high-speed FPGA platform for demanding applications including telecommunications infrastructure, military systems, and scientific instrumentation-emphasizing silicon efficiency, clock management, and I/O flexibility.

FAQ

Is XCV200-5FG256I still in production or supported by Xilinx?

No, XCV200-5FG256I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Xilinx discontinued the Virtex family in favor of Spartan and Virtex-II successors. Aetrix Electronics maintains legacy inventory and provides obsolescence mitigation support, including cross-reference analysis and long-term stocking agreements for continued use in installed base systems.

What configuration modes does XCV200-5FG256I support?

XCV200-5FG256I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial (bitstream loaded via DIN/CCLK), SelectMAP™ (parallel loading via 8- or 16-bit bus), and JTAG (boundary-scan programming via TDI/TDO). All modes are electrically compatible and selectable via mode pins (M0–M2); JTAG is mandatory for debugging and in-system verification of XCV200-5FG256I.

Can XCV200-5FG256I interface directly with DDR SDRAM?

Yes, XCV200-5FG256I supports DDR SDRAM interfacing through its SelectIO™ I/O standards-specifically SSTL2 Class I/II (2.5 V) and SSTL3 Class I/II (3.3 V)-with programmable drive strength, slew rate, and termination controls. Its DLLs enable precise DQS-to-clock alignment, and the 284 I/O pins allow full 16-bit data bus + address/control lines. Timing closure requires careful PCB layout and adherence to SSTL signaling rules per I/O bank.

What is the maximum operating frequency of internal logic in XCV200-5FG256I?

XCV200-5FG256I achieves synchronous internal logic speeds up to 200 MHz under worst-case conditions when using the -5 speed grade with DLL-enabled clock distribution. Benchmarks show register-to-register paths at 5.0 ns, pipelined 16×16 multipliers at 6.0 ns, and 16:1 multiplexers at 5.4 ns. Actual performance depends on design placement, routing, and utilization density-but the -5 grade guarantees timing closure at 200 MHz for properly constrained implementations.

Does XCV200-5FG256I include on-chip temperature sensing?

Yes, XCV200-5FG256I integrates a die-temperature sensor diode as a standard feature. This analog element allows external circuitry (e.g., ADC or thermal monitor IC) to measure junction temperature by biasing the diode and reading forward voltage drop. The sensor supports thermal management in industrial and automotive applications where reliability depends on real-time die temperature monitoring-critical for maintaining timing integrity and preventing thermal runaway in XCV200-5FG256I deployments.