AMD XCV200-5FG456C

Overview

XCV200-5FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block SelectRAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-5FG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and real-world FPGA integration considerations for legacy industrial control and telecom infrastructure designs.

Technical Context

The XCV200-5FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift registers.

I/O functionality is organized into eight banks, each supporting multiple SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class I/III/IV, and SSTL2/3-with strict VCCO and VREF voltage segregation per bank. Each IOB includes three storage elements (DFF/latch), independent polarity control, and optional weak-keeper circuits.

Key Specifications

Pinout & Package

Package: 456-ball Fine-pitch Ball Grid Array (FG456), RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-5FG456C, the -6 variant improves worst-case timing margin without altering pinout or power delivery, while the XCV300-5FG456C expands logic and I/O capacity within identical mechanical constraints-making both viable for lifecycle extension or performance scaling in legacy systems.

Availability

XCV200-5FG456C is available at Aetrix Electronics and suitable for industrial motion control, PCI-based data acquisition, legacy telecom line cards, and hot-swappable Compact PCI modules requiring stable component supply amid obsolescence transitions.

Supply support for XCV200-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it established industry standards for FPGA architecture and design tools.

The Virtex family was engineered for high-performance, high-density logic implementation in telecommunications infrastructure, industrial automation, and military/aerospace systems-emphasizing clock management, I/O flexibility, and silicon efficiency via 0.22 μm process technology.

FAQ

What is the maximum operating frequency supported by XCV200-5FG456C?

XCV200-5FG456C supports synchronous system clock rates up to 200 MHz, including I/O paths, under worst-case timing conditions defined by its -5 speed grade. This rating applies to register-to-register paths and validated I/O standards like HSTL Class IV (200 MHz) and LVTTL (180 MHz). Actual achievable frequency depends on design placement, routing, and clock domain structure.

Does XCV200-5FG456C support JTAG programming and boundary scan testing?

Yes, XCV200-5FG456C includes full IEEE 1149.1 boundary scan logic with dedicated TCK, TMS, TDI, and TDO pins. It supports in-system programming, configuration bitstream loading, and post-configuration verification. The boundary scan chain covers all IOBs and CLBs, enabling structural testing and debug without physical probe access.

How many block RAMs does XCV200-5FG456C contain, and what are their configurations?

XCV200-5FG456C contains 14 block SelectRAM units, totaling 57,344 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independently configurable port widths (1–16 bits) and depths (4096–256), supporting true dual-clock operation and built-in bus-width conversion-ideal for FIFOs, frame buffers, and protocol translation tables.

Can XCV200-5FG456C interface with both 3.3 V and 2.5 V I/O standards simultaneously?

Yes, XCV200-5FG456C supports mixed I/O voltages via its eight isolated I/O banks. Banks can be independently configured for 3.3 V (e.g., LVTTL, PCI) or 2.5 V (e.g., LVCMOS2, SSTL2) operation, provided all VCCO pins in a given bank share the same voltage. GTL/GTL+ standards are compatible across all VCCO levels due to open-drain topology.

Is XCV200-5FG456C still in active production, and what is its obsolescence status?

XCV200-5FG456C is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. Aetrix Electronics maintains legacy inventory with traceable sourcing and provides lifecycle availability coordination-including last-time buy planning, cross-reference guidance, and migration support-to sustain existing designs through end-of-life transitions.