AMD XCV200-5PQ240C

Overview

XCV200-5PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 maximum user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV200-5PQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility, and migration guidance from Virtex-1 generation designs.

Technical Context

The XCV200-5PQ240C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing I/O ring - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port synchronous storage elements.

Each IOB supports programmable input/output standards including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2/3, with per-bank VCCO and VREF constraints. The device uses four DLLs for clock deskew and jitter reduction, feeding four global low-skew clock nets and 24 secondary local clock nets - critical for synchronous multi-domain timing closure.

Key Specifications

Pinout & Package

Package: PQ240 - 240-pin Plastic Quad Flat Pack, 28 × 28 mm body, 0.5 mm lead pitch, JEDEC MS-026 compliant. Requires 8 independent I/O banks; VCCO and VREF pins are bank-specific and must be externally decoupled per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-5PQ240C, the -6 variant improves worst-case timing margin without altering I/O or memory resources, while the XCV300-5 offers headroom for logic expansion within the same PQ240 footprint - both preserve board layout and firmware compatibility.

Availability

XCV200-5PQ240C is available at Aetrix Electronics and suitable for industrial control systems, telecom line cards, legacy system emulation, and high-speed data acquisition requiring stable component supply across extended product lifecycles.

Supply support for XCV200-5PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA and adaptive SoC solutions since 1984 for aerospace, defense, communications, and industrial markets.

The Virtex family - including XCV200-5PQ240C - was engineered for high-performance, high-density logic implementation in systems demanding 200 MHz operation, multi-standard I/O, and deterministic clock management without external PLLs or buffers.

FAQ

What is the maximum operating frequency supported by XCV200-5PQ240C?

XCV200-5PQ240C supports a worst-case system clock rate of 200 MHz, validated under commercial temperature conditions (0°C to +85°C) and confirmed by Xilinx DS003-1 timing analysis. This includes I/O timing closure for standards such as HSTL Class IV and 66-MHz PCI. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection - but the -5 speed grade guarantees timing closure up to this limit with proper constraints.

Does XCV200-5PQ240C support hot-swap capability for Compact PCI applications?

Yes, XCV200-5PQ240C is explicitly designed for hot-swappable Compact PCI systems, as documented in DS003-1 Section "Features". Its I/O structure, power sequencing behavior, and configuration architecture comply with Compact PCI hot-swap requirements - including controlled power-up sequencing, I/O tri-state during insertion, and robust ESD protection on all user pins.

Can XCV200-5PQ240C be configured via JTAG, and what are the implications for production programming?

Yes, XCV200-5PQ240C supports JTAG configuration mode (IEEE 1149.1) using TCK/TMS/TDI/TDO pins. In production, this enables in-system programming without external PROMs, simplifying test flow and supporting field firmware updates. However, JTAG configuration requires bitstream validation prior to loading - unlike master serial mode, it does not provide automatic CRC checking during load.

How many I/O banks does XCV200-5PQ240C have, and why does bank partitioning matter for mixed-voltage designs?

XCV200-5PQ240C has eight I/O banks, formed by splitting each side of the PQ240 package into two banks. Bank partitioning matters because VCCO and VREF voltages are bank-restricted: all pins in a bank must share the same VCCO, and only one VREF voltage is allowed per bank. This enforces strict grouping of I/O standards - e.g., mixing HSTL (1.5 V VCCO) and LVTTL (3.3 V VCCO) requires separate banks, preventing electrical conflict.

Is XCV200-5PQ240C still in active production, and what lifecycle support does Aetrix Electronics provide?

No - XCV200-5PQ240C is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle coordination, including last-time-buy planning, cross-reference assistance to Virtex-II or Spartan-3 alternatives, and engineering support for sustaining production of systems dependent on XCV200-5PQ240C.