AMD XCV200-5PQ240I
- Part No.:
- XCV200-5PQ240I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV200-5PQ240I.pdf
- Description:
- IC FPGA 166 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,145
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Product details
Overview
XCV200-5PQ240I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 maximum user I/O pins in a 240-pin Plastic Quad Flat Pack (PQ240) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block SelectRAM), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.
For engineers reviewing the XCV200-5PQ240I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and migration guidance from Virtex-1 generation devices.
Technical Context
The XCV200-5PQ240I implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O ring, and dedicated horizontal bus lines per CLB row. Its CLBs contain two slices each with four 4-input LUTs, carry chains, and configurable storage elements supporting synchronous/asynchronous set/reset.
It supports multi-standard SelectIO™ interfaces across eight I/O banks, requiring bank-specific VCCO (1.5 V/2.5 V/3.3 V) and optional VREF (0.75–1.5 V). The device uses a 0.22 μm 5-layer metal CMOS process and is fully IEEE 1149.1 boundary-scan compliant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 236,666 - defines logic capacity for ASIC replacement in mid-complexity digital systems |
| Logic Cells | 5,292 - provides granular, place-and-route-efficient resources for pipelined datapaths |
| Max User I/O | 284 - enables dense peripheral interfacing with banked voltage domain isolation |
| Block RAM Bits | 57,344 - delivers on-chip dual-ported synchronous memory for FIFOs and buffering |
| Speed Grade | -5 - guarantees 200 MHz system clock performance under industrial temperature range |
| Package | PQ240 - 240-pin Plastic Quad Flat Pack with 0.5 mm pitch, suitable for cost-sensitive PCB assembly |
| Temperature Range | –40°C to +100°C - qualified for industrial environments without forced cooling |
Pinout & Package
Package: PQ240 (Plastic Quad Flat Pack, 240-pin, 0.5 mm pitch, body size 32.0 × 32.0 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated Global Clock Input | Four low-skew primary clock nets feeding DLLs and CLB arrays; require external termination |
| CLKA/CLKB | Block RAM Port Clock | Independent synchronous clocks for dual-port RAM access; support asynchronous read/write timing |
| ADDRA[11:0]/ADDRB[11:0] | Block RAM Address Bus | 12-bit address inputs per port; enable 4096-word depth configuration with flexible width/depth trade-offs |
| DIA[15:0]/DIB[15:0] | Block RAM Data In | 16-bit bidirectional data paths per port; support byte-wide writes via WE masking |
| DOA[15:0]/DOB[15:0] | Block RAM Data Out | Registered outputs with programmable output delay; critical for meeting setup/hold at high-frequency interfaces |
| VCCO_0–VCCO_7 | I/O Bank Power Supply | Eight independent VCCO pins (one per I/O bank); must be tied to same voltage within each bank |
| VREF_0–VREF_7 | I/O Threshold Reference | Eight VREF inputs (one per bank); required only for standards like HSTL/SSTL; internally bonded per bank |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; supports in-system programming and post-configuration verification |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time clock distribution and phase alignment across multiple clock domains |
| Configurable LUT RAM | Each 4-LUT can operate as 16×1-bit synchronous RAM or 16-bit shift register for burst capture |
| SelectIO™ Banking | Eight isolated I/O banks allow mixed-voltage operation (1.5 V/2.5 V/3.3 V) on single device |
| Dual-Port Block RAM | 4k-bit synchronous RAM blocks with independent clocks, addresses, and enables per port |
| Carry Chain Arithmetic | Dedicated 2-bit-per-CLB carry chain enables high-speed adders, counters, and accumulators |
Applications
| PCI Bridge Controller | Industrial Motion Control |
|---|---|
Use Scenario: Interface between legacy PCI peripherals and modern microcontroller subsystems in factory automation equipment. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing adapter, managing 66-MHz PCI bursts and synchronizing to 50-MHz real-time control loop. Use Value: Eliminates need for ASIC redesign; leverages -5 speed grade to meet PCI tCO < 5.0 ns and tSU > 3.5 ns requirements. |
Use Scenario: Closed-loop servo positioning using encoder feedback, PWM motor drive, and safety monitoring in CNC machines. IC Role / Device Role / Timing Role: Real-time logic fabric implementing PID computation, pulse-width modulation, and hardware-enforced safe torque off (STO). Use Value: Uses internal carry chains for sub-10 ns arithmetic and block RAM for 256-sample position history buffer without external memory. |
| High-Speed Data Acquisition | Communications Protocol Converter |
Use Scenario: Digitizing analog sensor streams at 100+ MSPS with on-the-fly filtering and packetization for Ethernet transport. IC Role / Device Role / Timing Role: Front-end processing unit capturing parallel ADC outputs, applying FIR filters via distributed LUTs, and packing into UDP frames. Use Value: Leverages 284 I/O pins for wide parallel bus capture and 57,344 block RAM bits for ping-pong buffering at sustained 80 MB/s throughput. |
Use Scenario: Converting proprietary fieldbus protocols (e.g., Profibus DP) to Modbus TCP in gateway appliances for smart grid infrastructure. IC Role / Device Role / Timing Role: State-machine-based protocol engine handling physical layer framing, CRC calculation, and address translation between mismatched timing domains. Use Value: Uses four DLLs to independently lock to 1.5 MHz Profibus clock and 125 MHz Ethernet PHY clock while maintaining deterministic latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200-6PQ240I | Higher speed grade (-6 vs. -5); achieves 220 MHz max system clock vs. 200 MHz | Required where worst-case path timing margins fall below 0.3 ns at -5 grade | Select when targeting >180 MHz clock domains with tight hold-time closure |
| XCV300-5PQ240I | Higher density (322,970 gates, 6,912 logic cells, 316 I/O) in identical PQ240 package | Needed for designs exceeding XCV200 resource utilization by >25% | Choose for upward migration path without PCB redesign; same footprint and thermal profile |
Compared with XCV200-5PQ240I, the -6 variant improves timing margin for high-frequency control loops, while the XCV300-5 offers headroom for feature expansion-both retain identical I/O banking structure and DLL configuration flow, enabling reuse of board layout and firmware initialization code.
Availability
XCV200-5PQ240I is available at Aetrix Electronics and suitable for industrial motion control, PCI bridge design, high-speed data acquisition, communications protocol conversion, and legacy system re-engineering requiring stable component supply over extended production lifecycles.
Supply support for XCV200-5PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family was designed for high-performance, high-density logic implementation in telecommunications infrastructure, military systems, and industrial automation-emphasizing silicon efficiency, clock management, and I/O flexibility.
FAQ
What is the maximum operating frequency supported by the XCV200-5PQ240I?
The XCV200-5PQ240I is rated for up to 200 MHz system clock performance under industrial temperature conditions (–40°C to +100°C). This specification applies to register-to-register paths with worst-case timing analysis using the -5 speed grade. Actual achievable frequency depends on design topology, placement, and routing; benchmark data shows pipelined multipliers operating at 5.1 ns (196 MHz) and address decoders at 4.4 ns (227 MHz) in representative circuits.
Does the XCV200-5PQ240I support hot-swap capability for Compact PCI applications?
Yes, the XCV200-5PQ240I supports hot-swappable operation in Compact PCI systems. Its I/O architecture meets PCI 66-MHz compliance requirements, and its power-up sequencing-including configurable weak-keeper circuits and high-impedance default states on non-configuration pins-ensures safe insertion and removal without disrupting backplane signaling integrity.
How many block RAM modules does the XCV200-5PQ240I contain, and what are their configurations?
The XCV200-5PQ240I contains 14 block SelectRAM modules totaling 57,344 bits. Each module is a fully synchronous, dual-ported 4096-bit RAM with independent clocks, addresses, and enables per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256, enabling flexible data buffering, FIFO construction, and lookup table implementation without external memory.
Can the XCV200-5PQ240I be configured via JTAG, and what modes are supported?
Yes, the XCV200-5PQ240I supports JTAG (IEEE 1149.1) configuration in addition to master serial, slave serial, and SelectMAP™ modes. JTAG enables in-system programming, boundary-scan testing, and readback of configuration bitstreams. The TCK/TMS/TDI/TDO pins are dedicated and fully compliant with JTAG specification, allowing integration into automated test and programming workflows.
What I/O standards are supported by the XCV200-5PQ240I, and how are they grouped?
The XCV200-5PQ240I supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Classes I/III/IV, SSTL2/3, GTL/GTL+, and CTT-grouped across eight electrically isolated I/O banks. Each bank requires a common VCCO voltage; VREF is required only for HSTL/SSTL and must be shared across all VREF pins within the same bank. Mixing incompatible standards (e.g., 3.3 V and 1.5 V outputs) within one bank is prohibited.
XCV200-5PQ240I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 57344
- Number of I/O:
- 166
- Number of Gates:
- 236666
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV200-5PQ240I FAQ
1.How can I place an order for XCV200-5PQ240I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200-5PQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200-5PQ240I reliable?
The price and inventory of XCV200-5PQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200-5PQ240I is usually 5 days.
3.What payment methods are accepted for XCV200-5PQ240I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200-5PQ240I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200-5PQ240I?
XCV200-5PQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200-5PQ240I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200-5PQ240I?
For technical support, including XCV200-5PQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200-5PQ240I requirements.
6.How does Aetrix verify that XCV200-5PQ240I is sourced from the original manufacturer or authorized distributors?
All XCV200-5PQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200-5PQ240I meets industry standards.
7.What is the process for return or replacement of XCV200-5PQ240I?
All XCV200-5PQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV200-5PQ240I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200-5PQ240I part is unused and in its original packaging.
Return procedure for XCV200-5PQ240I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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